NSN 5962-01-116-6930 of Microcircuit Linear - Parts Details
Alternative NSN: 5962011166930 |
Item Name: Microcircuit Linear |
FSG: 59 Electrical and Electronic Equipment Components |
Federal Supply Class (FSC): 5962 Microcircuits Electronic |
NIIN: 011166930 |
NCB Code: USA (01) |
Manufacturers: Racal Survey Inc Div Of Racal Da , Thales Uk Limited , Cardion Inc , Advanced Micro Devices Inc , Xes Inc Xerox Engineering Services |
ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is the latest parts procurement platform for the aerospace and aviation industry. Check out high demanding part numbers 1870645, 407115, AM686BEA, AM686DCB, AM686DMB under NSN 5962-01-116-6930 of Microcircuit Linear manufactured by Racal Survey Inc Div Of Racal Da, Thales Uk Limited, Cardion Inc, Advanced Micro Devices Inc, Xes Inc Xerox Engineering Services.
Federal Supply Class of NSN 5962-01-116-6930 is FSC 5962 contains part details of Microcircuits Electronic. Quote for your desired part numbers.
Part Number's List for NSN 5962-01-116-6930, 5962011166930
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Part No Manufacturer Item Name QTY RFQ 1870645 Racal Survey Inc Div Of Racal Da microcircuit linear Avl RFQ 1870645 Thales Uk Limited microcircuit linear Avl RFQ 407115 Cardion Inc microcircuit linear Avl RFQ AM686BEA Advanced Micro Devices Inc microcircuit linear Avl RFQ AM686DCB Advanced Micro Devices Inc microcircuit linear Avl RFQ AM686DMB Advanced Micro Devices Inc microcircuit linear Avl RFQ AM686PC Advanced Micro Devices Inc microcircuit linear Avl RFQ AM686PC Xes Inc Xerox Engineering Services microcircuit linear Avl RFQ
Characteristics Data of NSN 5962011166930MRC Criteria Characteristic ADAQ BODY LENGTH 0.840 INCHES MAXIMUM ADAT BODY WIDTH 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM ADAU BODY HEIGHT 0.140 INCHES MINIMUM AND 0.185 INCHES MAXIMUM AEHX MAXIMUM POWER DISSIPATION RATING 600.0 MILLIWATTS AFGA OPERATING TEMP RANGE -55.0/+125.0 DEG CELSIUS AFJQ STORAGE TEMP RANGE -65.0/+150.0 DEG CELSIUS CBBL FEATURES PROVIDED HERMETICALLY SEALED AND BURN IN AND W/ENABLE AND SCHOTTKY AND HIGH SPEED AND BIPOLAR CQSJ INCLOSURE MATERIAL CERAMIC CQSZ INCLOSURE CONFIGURATION DUAL-IN-LINE CQZP INPUT CIRCUIT PATTERN 2 INPUT CSSL DESIGN FUNCTION AND QUANTITY 1 COMPARATOR, VOLTAGE CTFT CASE OUTLINE SOURCE AND DESIGNATOR D-2 MIL-M-38510 CWSG TERMINAL SURFACE TREATMENT SOLDER CZEQ TIME RATING PER CHACTERISTIC 15.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 15.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT TEST TEST DATA DOCUMENT 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
MRC | Criteria | Characteristic |
---|---|---|
ADAQ | BODY LENGTH | 0.840 INCHES MAXIMUM |
ADAT | BODY WIDTH | 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM |
ADAU | BODY HEIGHT | 0.140 INCHES MINIMUM AND 0.185 INCHES MAXIMUM |
AEHX | MAXIMUM POWER DISSIPATION RATING | 600.0 MILLIWATTS |
AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN AND W/ENABLE AND SCHOTTKY AND HIGH SPEED AND BIPOLAR |
CQSJ | INCLOSURE MATERIAL | CERAMIC |
CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
CQZP | INPUT CIRCUIT PATTERN | 2 INPUT |
CSSL | DESIGN FUNCTION AND QUANTITY | 1 COMPARATOR, VOLTAGE |
CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | D-2 MIL-M-38510 |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
CZEQ | TIME RATING PER CHACTERISTIC | 15.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 15.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |