NSN 5962-01-121-3786 of Microcircuit Digital - Parts Details
| Alternative NSN: 5962011213786 |
| Item Name: Microcircuit Digital |
| FSG: 59 Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC): 5962 Microcircuits Electronic |
| NIIN: 011213786 |
| NCB Code: USA (01) |
| Manufacturers: Texas Instrument Inc , Philips Semiconductors Inc , Fairchild Semiconductor Corp , Raytheon Aircraft , Raytheon Technical Services Company |
ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is the latest parts procurement platform for the aerospace and aviation industry. Check out high demanding part numbers SNM74LS32J, N74LS32F 883C, DM74LS32N, 9LS32DCQC, 74LS32DC under NSN 5962-01-121-3786 of Microcircuit Digital manufactured by Texas Instrument Inc, Philips Semiconductors Inc, Fairchild Semiconductor Corp, Raytheon Aircraft, Raytheon Technical Services Company.
Federal Supply Class of NSN 5962-01-121-3786 is FSC 5962 contains part details of Microcircuits Electronic. Quote for your desired part numbers.
Part Number's List for NSN 5962-01-121-3786, 5962011213786
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Part No Manufacturer Item Name QTY RFQ SNM74LS32J Texas Instrument Inc microcircuit digital Avl RFQ N74LS32F 883C Philips Semiconductors Inc microcircuit digital Avl RFQ DM74LS32N Fairchild Semiconductor Corp microcircuit digital Avl RFQ 9LS32DCQC Fairchild Semiconductor Corp microcircuit digital Avl RFQ 74LS32DC Raytheon Aircraft microcircuit digital Avl RFQ 74LS32DC Raytheon Technical Services Company microcircuit digital Avl RFQ 725000-278 Raytheon Aircraft microcircuit digital Avl RFQ
Characteristics Data of NSN 5962011213786MRC Criteria Characteristic ADAQ BODY LENGTH 0.785 INCHES MAXIMUM ADAT BODY WIDTH 0.280 INCHES MAXIMUM ADAU BODY HEIGHT 0.180 INCHES MAXIMUM AEHX MAXIMUM POWER DISSIPATION RATING 2.0 MILLIWATTS AFGA OPERATING TEMP RANGE +0.0/+70.0 DEG CELSIUS AFJQ STORAGE TEMP RANGE -65.0/+150.0 DEG CELSIUS CBBL FEATURES PROVIDED HERMETICALLY SEALED AND BURN IN AND W/TOTEM POLE OUTPUT AND LOW POWER AND SCHOTTKY CQSJ INCLOSURE MATERIAL CERAMIC AND GLASS CQSZ INCLOSURE CONFIGURATION DUAL-IN-LINE CQWX OUTPUT LOGIC FORM TRANSISTOR-TRANSISTOR LOGIC CQZP INPUT CIRCUIT PATTERN QUAD 2 INPUT CSSL DESIGN FUNCTION AND QUANTITY 4 GATE, OR CTFT CASE OUTLINE SOURCE AND DESIGNATOR D-1 MIL-M-38510 CZEQ TIME RATING PER CHACTERISTIC 22.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 22.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT PMLC PRECIOUS MATERIAL AND LOCATION TERMINAL SURFACE OPTION GOLD PRMT PRECIOUS MATERIAL GOLD TEST TEST DATA DOCUMENT 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 0.785 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.280 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.180 INCHES MAXIMUM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 2.0 MILLIWATTS |
| AFGA | OPERATING TEMP RANGE | +0.0/+70.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN AND W/TOTEM POLE OUTPUT AND LOW POWER AND SCHOTTKY |
| CQSJ | INCLOSURE MATERIAL | CERAMIC AND GLASS |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CQWX | OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | QUAD 2 INPUT |
| CSSL | DESIGN FUNCTION AND QUANTITY | 4 GATE, OR |
| CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | D-1 MIL-M-38510 |
| CZEQ | TIME RATING PER CHACTERISTIC | 22.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 22.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
| PMLC | PRECIOUS MATERIAL AND LOCATION | TERMINAL SURFACE OPTION GOLD |
| PRMT | PRECIOUS MATERIAL | GOLD |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |