NSN 5962-01-122-1995 of Microcircuit Memory - Parts Details
| Alternative NSN: 5962011221995 |
| Item Name: Microcircuit Memory |
| FSG: 59 Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC): 5962 Microcircuits Electronic |
| NIIN: 011221995 |
| NCB Code: USA (01) |
| Manufacturers: Mmi Amd , Philips Semiconductors Inc , Intersil Corporation , Thales Avionics , Rockwell Collins Inc , Boeing Company , Harris Corporation , Sensor Products Inc |
ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is the latest parts procurement platform for the aerospace and aviation industry. Check out high demanding part numbers SM1214, N82S123, N825123N, HM1-7603-8SIMTO, HM-7603-2 under NSN 5962-01-122-1995 of Microcircuit Memory manufactured by Mmi Amd, Philips Semiconductors Inc, Intersil Corporation, Thales Avionics, Rockwell Collins Inc.
Federal Supply Class of NSN 5962-01-122-1995 is FSC 5962 contains part details of Microcircuits Electronic. Quote for your desired part numbers.
Part Number's List for NSN 5962-01-122-1995, 5962011221995
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Part No Manufacturer Item Name QTY RFQ SM1214 Mmi Amd microcircuit memory Avl RFQ N82S123 Philips Semiconductors Inc microcircuit memory Avl RFQ N825123N Philips Semiconductors Inc microcircuit memory Avl RFQ HM1-7603-8SIMTO Intersil Corporation microcircuit memory Avl RFQ HM-7603-2 Intersil Corporation microcircuit memory Avl RFQ CC5143 Philips Semiconductors Inc microcircuit memory Avl RFQ 99123765 Thales Avionics microcircuit memory Avl RFQ 73587-1 Rockwell Collins Inc microcircuit memory Avl RFQ 477-1489-002 Boeing Company microcircuit memory Avl RFQ 144556-003 Harris Corporation microcircuit memory Avl RFQ 1151084-1 Sensor Products Inc microcircuit memory Avl RFQ
Characteristics Data of NSN 5962011221995MRC Criteria Characteristic ADAQ BODY LENGTH 0.840 INCHES MAXIMUM ADAT BODY WIDTH 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM ADAU BODY HEIGHT 0.140 INCHES MINIMUM AND 0.185 INCHES MAXIMUM AEHX MAXIMUM POWER DISSIPATION RATING 739.0 MILLIWATTS AFGA OPERATING TEMP RANGE -55.0/+125.0 DEG CELSIUS AFJQ STORAGE TEMP RANGE -65.0/+150.0 DEG CELSIUS AGAV END ITEM IDENTIFICATION HULL OBRP 03950 CBBL FEATURES PROVIDED HERMETICALLY SEALED AND MONOLITHIC AND PROGRAMMABLE AND PROGRAMMED AND 3-STATE OUTPUT CQSJ INCLOSURE MATERIAL CERAMIC CQSZ INCLOSURE CONFIGURATION DUAL-IN-LINE CQWX OUTPUT LOGIC FORM TRANSISTOR-TRANSISTOR LOGIC CQZP INPUT CIRCUIT PATTERN 6 INPUT CTFT CASE OUTLINE SOURCE AND DESIGNATOR D-2 MIL-M-38510 CWSG TERMINAL SURFACE TREATMENT SOLDER CZEN VOLTAGE RATING AND TYPE PER CHARACTERISTIC 7.0 VOLTS MAXIMUM POWER SOURCE CZEQ TIME RATING PER CHACTERISTIC 80.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 80.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT CZER MEMORY DEVICE TYPE PROM CZZZ MEMORY CAPACITY UNKNOWN TEST TEST DATA DOCUMENT 81349-MIL-M-38510 SPECIFICATION (INCLUDES ENGINEERING TYPE BULLETINS, BROCHURES,ETC., THAT REFLECT SPECIFICATION TYPE DATA IN SPECIFICATION FORMAT; EXCLUDES COMMERCIAL CATALOGS, INDUSTRY DIRECTORIES, AND SIMILAR TRADE PUBLICATIONS, REFLECTI TTQY TERMINAL TYPE AND QUANTITY 16 PRINTED CIRCUIT ZZZK SPECIFICATION/STANDARD DATA 81349-MIL-M-38510/207/USAF/ GOVERNMENT SPECIFICATION
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 0.840 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.140 INCHES MINIMUM AND 0.185 INCHES MAXIMUM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 739.0 MILLIWATTS |
| AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
| AGAV | END ITEM IDENTIFICATION | HULL OBRP 03950 |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND MONOLITHIC AND PROGRAMMABLE AND PROGRAMMED AND 3-STATE OUTPUT |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CQWX | OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | 6 INPUT |
| CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | D-2 MIL-M-38510 |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 7.0 VOLTS MAXIMUM POWER SOURCE |
| CZEQ | TIME RATING PER CHACTERISTIC | 80.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 80.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
| CZER | MEMORY DEVICE TYPE | PROM |
| CZZZ | MEMORY CAPACITY | UNKNOWN |
| TEST | TEST DATA DOCUMENT | 81349-MIL-M-38510 SPECIFICATION (INCLUDES ENGINEERING TYPE BULLETINS, BROCHURES,ETC., THAT REFLECT SPECIFICATION TYPE DATA IN SPECIFICATION FORMAT; EXCLUDES COMMERCIAL CATALOGS, INDUSTRY DIRECTORIES, AND SIMILAR TRADE PUBLICATIONS, REFLECTI |
| TTQY | TERMINAL TYPE AND QUANTITY | 16 PRINTED CIRCUIT |
| ZZZK | SPECIFICATION/STANDARD DATA | 81349-MIL-M-38510/207/USAF/ GOVERNMENT SPECIFICATION |