NSN 5962-01-122-4432 of Microcircuit Memory - Parts Details
| Alternative NSN: 5962011224432 |
| Item Name: Microcircuit Memory |
| FSG: 59 Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC): 5962 Microcircuits Electronic |
| NIIN: 011224432 |
| NCB Code: USA (01) |
| Manufacturers: Motorola Inc , Intersil Corporation , Harris Corporation , Rochester Electronics Llc , Cardion Inc |
ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is the latest parts procurement platform for the aerospace and aviation industry. Check out high demanding part numbers NLN6561A, IM6561MJN 883B, I26-0009-000, HM1-6561-9, HM1-6561-8 under NSN 5962-01-122-4432 of Microcircuit Memory manufactured by Motorola Inc, Intersil Corporation, Harris Corporation, Rochester Electronics Llc, Cardion Inc.
Federal Supply Class of NSN 5962-01-122-4432 is FSC 5962 contains part details of Microcircuits Electronic. Quote for your desired part numbers.
Part Number's List for NSN 5962-01-122-4432, 5962011224432
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Part No Manufacturer Item Name QTY RFQ NLN6561A Motorola Inc microcircuit memory Avl RFQ IM6561MJN 883B Intersil Corporation microcircuit memory Avl RFQ I26-0009-000 Harris Corporation microcircuit memory Avl RFQ HM1-6561-9 Intersil Corporation microcircuit memory Avl RFQ HM1-6561-8 Intersil Corporation microcircuit memory Avl RFQ HM1-6561 883 Rochester Electronics Llc microcircuit memory Avl RFQ HM1 6561 883 Intersil Corporation microcircuit memory Avl RFQ 65S092 Intersil Corporation microcircuit memory Avl RFQ 51-P08711T001 Motorola Inc microcircuit memory Avl RFQ 405941 Cardion Inc microcircuit memory Avl RFQ
Characteristics Data of NSN 5962011224432MRC Criteria Characteristic ADAQ BODY LENGTH 0.885 INCHES MINIMUM AND 0.915 INCHES MAXIMUM ADAT BODY WIDTH 0.280 INCHES MINIMUM AND 0.310 INCHES MAXIMUM ADAU BODY HEIGHT 0.145 INCHES MAXIMUM AFGA OPERATING TEMP RANGE -55.0 TO 125.0 DEG CELSIUS AFJQ STORAGE TEMP RANGE -65.0 TO 150.0 DEG CELSIUS AGAV END ITEM IDENTIFICATION 5811-01-088-0549 80058 CBBL FEATURES PROVIDED HERMETICALLY SEALED AND 3-STATE OUTPUT AND SYNCHRONOUS AND HIGH PERFORMANCE AND LOW POWER CQSJ INCLOSURE MATERIAL CERAMIC CQSZ INCLOSURE CONFIGURATION DUAL-IN-LINE CQWX OUTPUT LOGIC FORM COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC CQZP INPUT CIRCUIT PATTERN 16 INPUT CWSG TERMINAL SURFACE TREATMENT SOLDER CZEN VOLTAGE RATING AND TYPE PER CHARACTERISTIC -0.3 VOLTS MINIMUM POWER SOURCE AND 8.3 VOLTS MAXIMUM POWER SOURCE CZER MEMORY DEVICE TYPE ROM TEST TEST DATA DOCUMENT 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). TTQY TERMINAL TYPE AND QUANTITY 18 PRINTED CIRCUIT
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 0.885 INCHES MINIMUM AND 0.915 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.280 INCHES MINIMUM AND 0.310 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.145 INCHES MAXIMUM |
| AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS |
| AGAV | END ITEM IDENTIFICATION | 5811-01-088-0549 80058 |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND 3-STATE OUTPUT AND SYNCHRONOUS AND HIGH PERFORMANCE AND LOW POWER |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | 16 INPUT |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -0.3 VOLTS MINIMUM POWER SOURCE AND 8.3 VOLTS MAXIMUM POWER SOURCE |
| CZER | MEMORY DEVICE TYPE | ROM |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| TTQY | TERMINAL TYPE AND QUANTITY | 18 PRINTED CIRCUIT |