NSN 5962-01-127-6238 of Microcircuit Memory - Parts Details
| Alternative NSN: 5962011276238 |
| Item Name: Microcircuit Memory |
| FSG: 59 Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC): 5962 Microcircuits Electronic |
| NIIN: 011276238 |
| NCB Code: USA (01) |
| Manufacturers: Texas Instrument Inc , Stmicroelectronics Inc , Freescale Semiconductor Inc , Fujitsu America Inc , Raytheon Aircraft , Dla Land And Maritime , Intel Corp Sales Office , Advanced Micro Devices Inc , Evans And Sutherland Computer Corp , Zentec Corp , Hewlett Packard Co , Honeywell Intl Inc |
ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is the latest parts procurement platform for the aerospace and aviation industry. Check out high demanding part numbers TMS4116-20NL, MK4116J-3, MK4116, MCM4116C20, MB8116E under NSN 5962-01-127-6238 of Microcircuit Memory manufactured by Texas Instrument Inc, Stmicroelectronics Inc, Freescale Semiconductor Inc, Fujitsu America Inc, Raytheon Aircraft.
Federal Supply Class of NSN 5962-01-127-6238 is FSC 5962 contains part details of Microcircuits Electronic. Quote for your desired part numbers.
Part Number's List for NSN 5962-01-127-6238, 5962011276238
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Part No Manufacturer Item Name QTY RFQ TMS4116-20NL Texas Instrument Inc microcircuit memory Avl RFQ MK4116J-3 Stmicroelectronics Inc microcircuit memory Avl RFQ MK4116 Stmicroelectronics Inc microcircuit memory Avl RFQ MCM4116C20 Freescale Semiconductor Inc microcircuit memory Avl RFQ MB8116E Fujitsu America Inc microcircuit memory Avl RFQ G286708-1 Raytheon Aircraft microcircuit memory Avl RFQ G227277-1 Raytheon Aircraft microcircuit memory Avl RFQ DMS 87137B Dla Land And Maritime microcircuit memory Avl RFQ D2117-2 Intel Corp Sales Office microcircuit memory Avl RFQ AM9016EPC Advanced Micro Devices Inc microcircuit memory Avl RFQ 807823-849 Evans And Sutherland Computer Corp microcircuit memory Avl RFQ 80-560-39 Zentec Corp microcircuit memory Avl RFQ 51NW9615E37 Freescale Semiconductor Inc microcircuit memory Avl RFQ 5180-0601 Hewlett Packard Co microcircuit memory Avl RFQ 2223205-1 Honeywell Intl Inc microcircuit memory Avl RFQ 1818-1396 Hewlett Packard Co microcircuit memory Avl RFQ
Characteristics Data of NSN 5962011276238MRC Criteria Characteristic ADAQ BODY LENGTH 0.840 INCHES MAXIMUM ADAT BODY WIDTH 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM ADAU BODY HEIGHT 0.140 INCHES MINIMUM AND 0.185 INCHES MAXIMUM AEHX MAXIMUM POWER DISSIPATION RATING 1.0 WATTS AFGA OPERATING TEMP RANGE -55.0/+110.0 DEG CELSIUS AFJQ STORAGE TEMP RANGE -60.0/+150.0 DEG CELSIUS AGAV END ITEM IDENTIFICATION 1055-01-092-0596 18876 CBBL FEATURES PROVIDED HERMETICALLY SEALED AND MONOLITHIC AND W/CLOCK CQSJ INCLOSURE MATERIAL CERAMIC AND GLASS CQSZ INCLOSURE CONFIGURATION DUAL-IN-LINE CQWX OUTPUT LOGIC FORM N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC CQZP INPUT CIRCUIT PATTERN 11 INPUT CTFT CASE OUTLINE SOURCE AND DESIGNATOR D-2 MIL-M-38510 CWSG TERMINAL SURFACE TREATMENT SOLDER CZEN VOLTAGE RATING AND TYPE PER CHARACTERISTIC 15.0 VOLTS MAXIMUM POWER SOURCE CZEQ TIME RATING PER CHACTERISTIC 200.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT CZER MEMORY DEVICE TYPE RAM CZZZ MEMORY CAPACITY UNKNOWN TEST TEST DATA DOCUMENT 81349-MIL-M-38510 SPECIFICATION (INCLUDES ENGINEERING TYPE BULLETINS, BROCHURES,ETC., THAT REFLECT SPECIFICATION TYPE DATA IN SPECIFICATION FORMAT; EXCLUDES COMMERCIAL CATALOGS, INDUSTRY DIRECTORIES, AND SIMILAR TRADE PUBLICATIONS, REFLECTI TTQY TERMINAL TYPE AND QUANTITY 16 PRINTED CIRCUIT ZZZK SPECIFICATION/STANDARD DATA 81349-MIL-M-38510/240 GOVERNMENT SPECIFICATION
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 0.840 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.140 INCHES MINIMUM AND 0.185 INCHES MAXIMUM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 1.0 WATTS |
| AFGA | OPERATING TEMP RANGE | -55.0/+110.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -60.0/+150.0 DEG CELSIUS |
| AGAV | END ITEM IDENTIFICATION | 1055-01-092-0596 18876 |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND MONOLITHIC AND W/CLOCK |
| CQSJ | INCLOSURE MATERIAL | CERAMIC AND GLASS |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CQWX | OUTPUT LOGIC FORM | N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | 11 INPUT |
| CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | D-2 MIL-M-38510 |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 15.0 VOLTS MAXIMUM POWER SOURCE |
| CZEQ | TIME RATING PER CHACTERISTIC | 200.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT |
| CZER | MEMORY DEVICE TYPE | RAM |
| CZZZ | MEMORY CAPACITY | UNKNOWN |
| TEST | TEST DATA DOCUMENT | 81349-MIL-M-38510 SPECIFICATION (INCLUDES ENGINEERING TYPE BULLETINS, BROCHURES,ETC., THAT REFLECT SPECIFICATION TYPE DATA IN SPECIFICATION FORMAT; EXCLUDES COMMERCIAL CATALOGS, INDUSTRY DIRECTORIES, AND SIMILAR TRADE PUBLICATIONS, REFLECTI |
| TTQY | TERMINAL TYPE AND QUANTITY | 16 PRINTED CIRCUIT |
| ZZZK | SPECIFICATION/STANDARD DATA | 81349-MIL-M-38510/240 GOVERNMENT SPECIFICATION |