NSN 5962-01-133-1276 of Microcircuit Memory - Parts Details
| Alternative NSN: 5962011331276 |
| Item Name: Microcircuit Memory |
| FSG: 59 Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC): 5962 Microcircuits Electronic |
| NIIN: 011331276 |
| NCB Code: USA (01) |
| Manufacturers: Texas Instrument Inc , Freescale Semiconductor Inc , Computer Automation Inc |
ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is the latest parts procurement platform for the aerospace and aviation industry. Check out high demanding part numbers TMS4164-20JDL, SMJ4164-20JDL, SM4164-20JDL, MCM6665BP20, MCM6665AL20 under NSN 5962-01-133-1276 of Microcircuit Memory manufactured by Texas Instrument Inc, Freescale Semiconductor Inc, Computer Automation Inc.
Federal Supply Class of NSN 5962-01-133-1276 is FSC 5962 contains part details of Microcircuits Electronic. Quote for your desired part numbers.
Part Number's List for NSN 5962-01-133-1276, 5962011331276
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Part No Manufacturer Item Name QTY RFQ TMS4164-20JDL Texas Instrument Inc microcircuit memory Avl RFQ SMJ4164-20JDL Texas Instrument Inc microcircuit memory Avl RFQ SM4164-20JDL Texas Instrument Inc microcircuit memory Avl RFQ MCM6665BP20 Freescale Semiconductor Inc microcircuit memory Avl RFQ MCM6665AL20 Freescale Semiconductor Inc microcircuit memory Avl RFQ 01-50064-20 Computer Automation Inc microcircuit memory Avl RFQ
Characteristics Data of NSN 5962011331276MRC Criteria Characteristic ADAQ BODY LENGTH 0.840 INCHES MAXIMUM ADAT BODY WIDTH 0.295 INCHES NOMINAL ADAU BODY HEIGHT 0.180 INCHES MAXIMUM AEHX MAXIMUM POWER DISSIPATION RATING 1.0 WATTS AFGA OPERATING TEMP RANGE +0.0/+70.0 DEG CELSIUS AFJQ STORAGE TEMP RANGE -65.0/+150.0 DEG CELSIUS AGAV END ITEM IDENTIFICATION AN/APY-1 08783 CBBL FEATURES PROVIDED HERMETICALLY SEALED AND LOW POWER AND HIGH SPEED AND HIGH PERFORMANCE CQSJ INCLOSURE MATERIAL CERAMIC CQSZ INCLOSURE CONFIGURATION DUAL-IN-LINE CQWX OUTPUT LOGIC FORM N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC CQZP INPUT CIRCUIT PATTERN 12 INPUT CWSG TERMINAL SURFACE TREATMENT SOLDER CZEN VOLTAGE RATING AND TYPE PER CHARACTERISTIC 6.0 VOLTS MAXIMUM POWER SOURCE CZEQ TIME RATING PER CHACTERISTIC 200.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT CZER MEMORY DEVICE TYPE RAM CZZZ MEMORY CAPACITY UNKNOWN TTQY TERMINAL TYPE AND QUANTITY 16 PRINTED CIRCUIT
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 0.840 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.295 INCHES NOMINAL |
| ADAU | BODY HEIGHT | 0.180 INCHES MAXIMUM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 1.0 WATTS |
| AFGA | OPERATING TEMP RANGE | +0.0/+70.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
| AGAV | END ITEM IDENTIFICATION | AN/APY-1 08783 |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND LOW POWER AND HIGH SPEED AND HIGH PERFORMANCE |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CQWX | OUTPUT LOGIC FORM | N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | 12 INPUT |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 6.0 VOLTS MAXIMUM POWER SOURCE |
| CZEQ | TIME RATING PER CHACTERISTIC | 200.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT |
| CZER | MEMORY DEVICE TYPE | RAM |
| CZZZ | MEMORY CAPACITY | UNKNOWN |
| TTQY | TERMINAL TYPE AND QUANTITY | 16 PRINTED CIRCUIT |