NSN 5962-01-137-9284 of Microcircuit Digital - Parts Details
| Alternative NSN: 5962011379284 |
| Item Name: Microcircuit Digital |
| FSG: 59 Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC): 5962 Microcircuits Electronic |
| NIIN: 011379284 |
| NCB Code: USA (01) |
| Manufacturers: Intersil Corporation , Fairchild Semiconductor Corp , Freescale Semiconductor Inc , National Semiconductor Corp , Texas Instrument Inc |
ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is the latest parts procurement platform for the aerospace and aviation industry. Check out high demanding part numbers CD4016BD 3, B4010111 under NSN 5962-01-137-9284 of Microcircuit Digital manufactured by Intersil Corporation, Fairchild Semiconductor Corp, Freescale Semiconductor Inc, National Semiconductor Corp, Texas Instrument Inc.
Federal Supply Class of NSN 5962-01-137-9284 is FSC 5962 contains part details of Microcircuits Electronic. Quote for your desired part numbers.
Part Number's List for NSN 5962-01-137-9284, 5962011379284
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Part No Manufacturer Item Name QTY RFQ CD4016BD 3 Intersil Corporation microcircuit digital Avl RFQ B4010111 Fairchild Semiconductor Corp microcircuit digital Avl RFQ B4010111 Freescale Semiconductor Inc microcircuit digital Avl RFQ B4010111 Intersil Corporation microcircuit digital Avl RFQ B4010111 National Semiconductor Corp microcircuit digital Avl RFQ B4010111 Texas Instrument Inc microcircuit digital Avl RFQ
Characteristics Data of NSN 5962011379284MRC Criteria Characteristic ADAQ BODY LENGTH 0.745 INCHES MINIMUM AND 0.770 INCHES MAXIMUM" ADAT BODY WIDTH 0.240 INCHES MINIMUM AND 0.260 INCHES MAXIMUM" ADAU BODY HEIGHT 0.055 INCHES MINIMUM AND 0.140 INCHES MAXIMUM" AEHX MAXIMUM POWER DISSIPATION RATING 200.0 MILLIWATTS" AFGA OPERATING TEMP RANGE -55.0/+125.0 DEG CELSIUS" AFJQ STORAGE TEMP RANGE -65.0/+150.0 DEG CELSIUS" CBBL FEATURES PROVIDED MONOLITHIC AND HERMETICALLY SEALED AND BURN IN AND HIGH VOLTAGE" CQSJ INCLOSURE MATERIAL CERAMIC" CQSZ INCLOSURE CONFIGURATION DUAL-IN-LINE" CQWX OUTPUT LOGIC FORM COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC" CQZP INPUT CIRCUIT PATTERN QUAD 2 INPUT" CZEQ TIME RATING PER CHACTERISTIC 100.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 50.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT" TEST TEST DATA DOCUMENT 56996-B4010111 DRAWING (THIS IS THE BASIC GOVERNING DRAWING, SUCH AS A CONTRACTOR DRAWING, ORIGINAL EQUIPMENT MANUFACTURER DRAWING, ETC.; EXCLUDES ANY SPECIFICATION, STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNING DRA" ADAQ BODY LENGTH 0.745 INCHES MINIMUM AND 0.770 INCHES MAXIMUM" ADAT BODY WIDTH 0.240 INCHES MINIMUM AND 0.260 INCHES MAXIMUM" ADAU BODY HEIGHT 0.055 INCHES MINIMUM AND 0.140 INCHES MAXIMUM" AEHX MAXIMUM POWER DISSIPATION RATING 200.0 MILLIWATTS" AFGA OPERATING TEMP RANGE -55.0/+125.0 DEG CELSIUS" AFJQ STORAGE TEMP RANGE -65.0/+150.0 DEG CELSIUS" CBBL FEATURES PROVIDED MONOLITHIC AND HERMETICALLY SEALED AND BURN IN AND HIGH VOLTAGE" CQSJ INCLOSURE MATERIAL CERAMIC" CQSZ INCLOSURE CONFIGURATION DUAL-IN-LINE" CQWX OUTPUT LOGIC FORM COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC" CQZP INPUT CIRCUIT PATTERN QUAD 2 INPUT" CZEQ TIME RATING PER CHACTERISTIC 100.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 50.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT" TEST TEST DATA DOCUMENT 56996-B4010111 DRAWING (THIS IS THE BASIC GOVERNING DRAWING, SUCH AS A CONTRACTOR DRAWING, ORIGINAL EQUIPMENT MANUFACTURER DRAWING, ETC.; EXCLUDES ANY SPECIFICATION, STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNING DRA"
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 0.745 INCHES MINIMUM AND 0.770 INCHES MAXIMUM" |
| ADAT | BODY WIDTH | 0.240 INCHES MINIMUM AND 0.260 INCHES MAXIMUM" |
| ADAU | BODY HEIGHT | 0.055 INCHES MINIMUM AND 0.140 INCHES MAXIMUM" |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 200.0 MILLIWATTS" |
| AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS" |
| AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS" |
| CBBL | FEATURES PROVIDED | MONOLITHIC AND HERMETICALLY SEALED AND BURN IN AND HIGH VOLTAGE" |
| CQSJ | INCLOSURE MATERIAL | CERAMIC" |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE" |
| CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC" |
| CQZP | INPUT CIRCUIT PATTERN | QUAD 2 INPUT" |
| CZEQ | TIME RATING PER CHACTERISTIC | 100.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 50.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT" |
| TEST | TEST DATA DOCUMENT | 56996-B4010111 DRAWING (THIS IS THE BASIC GOVERNING DRAWING, SUCH AS A CONTRACTOR DRAWING, ORIGINAL EQUIPMENT MANUFACTURER DRAWING, ETC.; EXCLUDES ANY SPECIFICATION, STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNING DRA" |
| ADAQ | BODY LENGTH | 0.745 INCHES MINIMUM AND 0.770 INCHES MAXIMUM" |
| ADAT | BODY WIDTH | 0.240 INCHES MINIMUM AND 0.260 INCHES MAXIMUM" |
| ADAU | BODY HEIGHT | 0.055 INCHES MINIMUM AND 0.140 INCHES MAXIMUM" |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 200.0 MILLIWATTS" |
| AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS" |
| AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS" |
| CBBL | FEATURES PROVIDED | MONOLITHIC AND HERMETICALLY SEALED AND BURN IN AND HIGH VOLTAGE" |
| CQSJ | INCLOSURE MATERIAL | CERAMIC" |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE" |
| CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC" |
| CQZP | INPUT CIRCUIT PATTERN | QUAD 2 INPUT" |
| CZEQ | TIME RATING PER CHACTERISTIC | 100.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 50.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT" |
| TEST | TEST DATA DOCUMENT | 56996-B4010111 DRAWING (THIS IS THE BASIC GOVERNING DRAWING, SUCH AS A CONTRACTOR DRAWING, ORIGINAL EQUIPMENT MANUFACTURER DRAWING, ETC.; EXCLUDES ANY SPECIFICATION, STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNING DRA" |