NSN 5962-01-140-1657 of Microcircuit Memory - Parts Details
Alternative NSN: 5962011401657 |
Item Name: Microcircuit Memory |
FSG: 59 Electrical and Electronic Equipment Components |
Federal Supply Class (FSC): 5962 Microcircuits Electronic |
NIIN: 011401657 |
NCB Code: USA (01) |
Manufacturers: Dla Land And Maritime , Texas Instrument Inc |
ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is the latest parts procurement platform for the aerospace and aviation industry. Check out high demanding part numbers ROM PROM FAMILY 009, TMS2716JL under NSN 5962-01-140-1657 of Microcircuit Memory manufactured by Dla Land And Maritime, Texas Instrument Inc.
Federal Supply Class of NSN 5962-01-140-1657 is FSC 5962 contains part details of Microcircuits Electronic. Quote for your desired part numbers.
Part Number's List for NSN 5962-01-140-1657, 5962011401657
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Part No Manufacturer Item Name QTY RFQ ROM PROM FAMILY 009 Dla Land And Maritime microcircuit memory Avl RFQ TMS2716JL Texas Instrument Inc microcircuit memory Avl RFQ
Characteristics Data of NSN 5962011401657MRC Criteria Characteristic ADAQ BODY LENGTH 1.235 INCHES MINIMUM AND 1.290 INCHES MAXIMUM ADAT BODY WIDTH 0.515 INCHES MINIMUM AND 0.560 INCHES MAXIMUM ADAU BODY HEIGHT 0.145 INCHES MINIMUM AND 0.187 INCHES MAXIMUM AEHX MAXIMUM POWER DISSIPATION RATING 595.0 MILLIWATTS AFGA OPERATING TEMP RANGE +0.0/+70.0 DEG CELSIUS AFJQ STORAGE TEMP RANGE -55.0/+125.0 DEG CELSIUS CBBL FEATURES PROVIDED PROGRAMMABLE AND ULTRAVIOLET ERASABLE AND HIGH SPEED AND STATIC OPERATION CQSJ INCLOSURE MATERIAL CERAMIC CQSZ INCLOSURE CONFIGURATION DUAL-IN-LINE CQWX OUTPUT LOGIC FORM N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC CQZP INPUT CIRCUIT PATTERN 12 INPUT CWSG TERMINAL SURFACE TREATMENT SOLDER CZEN VOLTAGE RATING AND TYPE PER CHARACTERISTIC -0.3 VOLTS MINIMUM POWER SOURCE AND 20.0 VOLTS MAXIMUM POWER SOURCE CZEQ TIME RATING PER CHACTERISTIC 120.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 120.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT CZER MEMORY DEVICE TYPE ROM CZZZ MEMORY CAPACITY UNKNOWN TTQY TERMINAL TYPE AND QUANTITY 24 PRINTED CIRCUIT
MRC | Criteria | Characteristic |
---|---|---|
ADAQ | BODY LENGTH | 1.235 INCHES MINIMUM AND 1.290 INCHES MAXIMUM |
ADAT | BODY WIDTH | 0.515 INCHES MINIMUM AND 0.560 INCHES MAXIMUM |
ADAU | BODY HEIGHT | 0.145 INCHES MINIMUM AND 0.187 INCHES MAXIMUM |
AEHX | MAXIMUM POWER DISSIPATION RATING | 595.0 MILLIWATTS |
AFGA | OPERATING TEMP RANGE | +0.0/+70.0 DEG CELSIUS |
AFJQ | STORAGE TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
CBBL | FEATURES PROVIDED | PROGRAMMABLE AND ULTRAVIOLET ERASABLE AND HIGH SPEED AND STATIC OPERATION |
CQSJ | INCLOSURE MATERIAL | CERAMIC |
CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
CQWX | OUTPUT LOGIC FORM | N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC |
CQZP | INPUT CIRCUIT PATTERN | 12 INPUT |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -0.3 VOLTS MINIMUM POWER SOURCE AND 20.0 VOLTS MAXIMUM POWER SOURCE |
CZEQ | TIME RATING PER CHACTERISTIC | 120.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 120.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
CZER | MEMORY DEVICE TYPE | ROM |
CZZZ | MEMORY CAPACITY | UNKNOWN |
TTQY | TERMINAL TYPE AND QUANTITY | 24 PRINTED CIRCUIT |