NSN 5962-01-143-2593 of Microcircuit Linear - Parts Details
Alternative NSN: 5962011432593 |
Item Name: Microcircuit Linear |
FSG: 59 Electrical and Electronic Equipment Components |
Federal Supply Class (FSC): 5962 Microcircuits Electronic |
NIIN: 011432593 |
NCB Code: USA (01) |
Manufacturers: Thales Communications Inc , Telephonics Corporation , Raytheon Aircraft , Selex Systems Integration Inc Di , Texas Instrument Inc |
ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is the latest parts procurement platform for the aerospace and aviation industry. Check out high demanding part numbers 115499-0003, 513147-1, 725004-201, 73L153M003, 896930-1 under NSN 5962-01-143-2593 of Microcircuit Linear manufactured by Thales Communications Inc, Telephonics Corporation, Raytheon Aircraft, Selex Systems Integration Inc Di, Texas Instrument Inc.
Federal Supply Class of NSN 5962-01-143-2593 is FSC 5962 contains part details of Microcircuits Electronic. Quote for your desired part numbers.
Part Number's List for NSN 5962-01-143-2593, 5962011432593
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Part No Manufacturer Item Name QTY RFQ 115499-0003 Thales Communications Inc microcircuit linear Avl RFQ 513147-1 Telephonics Corporation microcircuit linear Avl RFQ 725004-201 Raytheon Aircraft microcircuit linear Avl RFQ 73L153M003 Selex Systems Integration Inc Di microcircuit linear Avl RFQ 896930-1 Raytheon Aircraft microcircuit linear Avl RFQ ANJ55189J Texas Instrument Inc microcircuit linear Avl RFQ SNJ55189J Texas Instrument Inc microcircuit linear Avl RFQ SNJ55189J Thales Communications Inc microcircuit linear Avl RFQ
Characteristics Data of NSN 5962011432593MRC Criteria Characteristic ADAQ BODY LENGTH 0.755 INCHES MINIMUM AND 0.785 INCHES MAXIMUM ADAT BODY WIDTH 0.245 INCHES MINIMUM AND 0.280 INCHES MAXIMUM ADAU BODY HEIGHT 0.180 INCHES MAXIMUM AEHX MAXIMUM POWER DISSIPATION RATING 1.0 WATTS AFGA OPERATING TEMP RANGE -55.0/+125.0 DEG CELSIUS AFJQ STORAGE TEMP RANGE -65.0/+125.0 DEG CELSIUS CBBL FEATURES PROVIDED HERMETICALLY SEALED AND MONOLITHIC CQSJ INCLOSURE MATERIAL CERAMIC AND GLASS CQSZ INCLOSURE CONFIGURATION DUAL-IN-LINE CQZP INPUT CIRCUIT PATTERN QUAD 1 INPUT CSSL DESIGN FUNCTION AND QUANTITY 4 RECEIVER, LINE CWSG TERMINAL SURFACE TREATMENT TIN CZEQ TIME RATING PER CHACTERISTIC 85.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 50.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT
MRC | Criteria | Characteristic |
---|---|---|
ADAQ | BODY LENGTH | 0.755 INCHES MINIMUM AND 0.785 INCHES MAXIMUM |
ADAT | BODY WIDTH | 0.245 INCHES MINIMUM AND 0.280 INCHES MAXIMUM |
ADAU | BODY HEIGHT | 0.180 INCHES MAXIMUM |
AEHX | MAXIMUM POWER DISSIPATION RATING | 1.0 WATTS |
AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
AFJQ | STORAGE TEMP RANGE | -65.0/+125.0 DEG CELSIUS |
CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND MONOLITHIC |
CQSJ | INCLOSURE MATERIAL | CERAMIC AND GLASS |
CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
CQZP | INPUT CIRCUIT PATTERN | QUAD 1 INPUT |
CSSL | DESIGN FUNCTION AND QUANTITY | 4 RECEIVER, LINE |
CWSG | TERMINAL SURFACE TREATMENT | TIN |
CZEQ | TIME RATING PER CHACTERISTIC | 85.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 50.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |