NSN 5962-01-151-4621 of Microcircuit Memory - Parts Details
Alternative NSN: 5962011514621 |
Item Name: Microcircuit Memory |
FSG: 59 Electrical and Electronic Equipment Components |
Federal Supply Class (FSC): 5962 Microcircuits Electronic |
NIIN: 011514621 |
NCB Code: USA (01) |
Manufacturers: Bae Systems , Fairchild Semiconductor Corp , Intersil Corporation , Freescale Semiconductor Inc , Intel Corp Sales Office , Texas Instrument Inc |
ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is the latest parts procurement platform for the aerospace and aviation industry. Check out high demanding part numbers 67422-0001, F2114, IM2114LMJN 883B, MCM2114, MD2114A-5 B under NSN 5962-01-151-4621 of Microcircuit Memory manufactured by Bae Systems, Fairchild Semiconductor Corp, Intersil Corporation, Freescale Semiconductor Inc, Intel Corp Sales Office.
Federal Supply Class of NSN 5962-01-151-4621 is FSC 5962 contains part details of Microcircuits Electronic. Quote for your desired part numbers.
Part Number's List for NSN 5962-01-151-4621, 5962011514621
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Part No Manufacturer Item Name QTY RFQ 67422-0001 Bae Systems microcircuit memory Avl RFQ F2114 Fairchild Semiconductor Corp microcircuit memory Avl RFQ IM2114LMJN 883B Intersil Corporation microcircuit memory Avl RFQ MCM2114 Freescale Semiconductor Inc microcircuit memory Avl RFQ MD2114A-5 B Intel Corp Sales Office microcircuit memory Avl RFQ SMJ2114-45JM Texas Instrument Inc microcircuit memory Avl RFQ
Characteristics Data of NSN 5962011514621MRC Criteria Characteristic AFGA Operating Temp Range -55.0 TO 125.0 DEG CELSIUS CZER Memory Device Type ROM ADAT Body Width 0.220 INCHES MINIMUM AND CQZP Input Circuit Pattern 12 INPUT CBBL Features Provided HERMETICALLY SEALED AND CQSJ Inclosure Material GLASS CQSJ Inclosure Material CERAMIC AND ADAT Body Width 0.310 INCHES MAXIMUM CWSG Terminal Surface Treatment SOLDER CBBL Features Provided POSITIVE OUTPUTS ADAQ Body Length 0.960 INCHES MAXIMUM MRC Decoded Requirement Clear Text Reply ADAU Body Height 0.140 INCHES MINIMUM AND TEST Test Data Document 96906-MIL-STD-833 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). CTFT Case Outline Source And Designator D-6 MIL-M-38510 AEHX Maximum Power Dissipation Rating 1.000 MILLIWATTS AGAV End Item Identification TELETYPEWRITER SET,AN/UGC-129(V) TTQY Terminal Type And Quantity 18 PRINTED CIRCUIT CQSZ Inclosure Configuration DUAL-IN-LINE AFJQ Storage Temp Range -65.0 TO 150.0 DEG CELSIUS CZEN Voltage Rating And Type Per Characteristic 5.5 VOLTS MAXIMUM POWER SOURCE CQWX Output Logic Form TRANSISTOR-TRANSISTOR LOGIC ADAU Body Height 0.185 INCHES MAXIMUM
MRC | Criteria | Characteristic |
---|---|---|
AFGA | Operating Temp Range | -55.0 TO 125.0 DEG CELSIUS |
CZER | Memory Device Type | ROM |
ADAT | Body Width | 0.220 INCHES MINIMUM AND |
CQZP | Input Circuit Pattern | 12 INPUT |
CBBL | Features Provided | HERMETICALLY SEALED AND |
CQSJ | Inclosure Material | GLASS |
CQSJ | Inclosure Material | CERAMIC AND |
ADAT | Body Width | 0.310 INCHES MAXIMUM |
CWSG | Terminal Surface Treatment | SOLDER |
CBBL | Features Provided | POSITIVE OUTPUTS |
ADAQ | Body Length | 0.960 INCHES MAXIMUM |
MRC | Decoded Requirement | Clear Text Reply |
ADAU | Body Height | 0.140 INCHES MINIMUM AND |
TEST | Test Data Document | 96906-MIL-STD-833 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
CTFT | Case Outline Source And Designator | D-6 MIL-M-38510 |
AEHX | Maximum Power Dissipation Rating | 1.000 MILLIWATTS |
AGAV | End Item Identification | TELETYPEWRITER SET,AN/UGC-129(V) |
TTQY | Terminal Type And Quantity | 18 PRINTED CIRCUIT |
CQSZ | Inclosure Configuration | DUAL-IN-LINE |
AFJQ | Storage Temp Range | -65.0 TO 150.0 DEG CELSIUS |
CZEN | Voltage Rating And Type Per Characteristic | 5.5 VOLTS MAXIMUM POWER SOURCE |
CQWX | Output Logic Form | TRANSISTOR-TRANSISTOR LOGIC |
ADAU | Body Height | 0.185 INCHES MAXIMUM |