NSN 5962-01-155-8002 of Microcircuit Memory - Parts Details
| Alternative NSN: 5962011558002 |
| Item Name: Microcircuit Memory |
| FSG: 59 Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC): 5962 Microcircuits Electronic |
| NIIN: 011558002 |
| NCB Code: USA (01) |
| Manufacturers: Philips Semiconductors Inc , Dla Land And Maritime , Advanced Micro Devices Inc , Agilent Technologies Inc , Hewlett Packard Co |
ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is the latest parts procurement platform for the aerospace and aviation industry. Check out high demanding part numbers N2617F, DMS 86003 B, CN8084AN, AM9216BDC, 1818-0748 under NSN 5962-01-155-8002 of Microcircuit Memory manufactured by Philips Semiconductors Inc, Dla Land And Maritime, Advanced Micro Devices Inc, Agilent Technologies Inc, Hewlett Packard Co.
Federal Supply Class of NSN 5962-01-155-8002 is FSC 5962 contains part details of Microcircuits Electronic. Quote for your desired part numbers.
Part Number's List for NSN 5962-01-155-8002, 5962011558002
-
Part No Manufacturer Item Name QTY RFQ N2617F Philips Semiconductors Inc microcircuit memory Avl RFQ DMS 86003 B Dla Land And Maritime microcircuit memory Avl RFQ CN8084AN Philips Semiconductors Inc microcircuit memory Avl RFQ AM9216BDC Advanced Micro Devices Inc microcircuit memory Avl RFQ 1818-0748 Agilent Technologies Inc microcircuit memory Avl RFQ 1818-0748 Hewlett Packard Co microcircuit memory Avl RFQ
Characteristics Data of NSN 5962011558002MRC Criteria Characteristic ADAQ BODY LENGTH 1.188 INCHES MINIMUM AND 1.212 INCHES MAXIMUM ADAT BODY WIDTH 0.568 INCHES MINIMUM AND 0.598 INCHES MAXIMUM ADAU BODY HEIGHT 0.040 INCHES MINIMUM AND 0.162 INCHES MAXIMUM AEHX MAXIMUM POWER DISSIPATION RATING 1.0 WATTS AFGA OPERATING TEMP RANGE +0.0 TO 70.0 DEG CELSIUS AFJQ STORAGE TEMP RANGE -65.0 TO 150.0 DEG CELSIUS CBBL FEATURES PROVIDED HIGH SPEED AND HIGH PERFORMANCE AND STATIC OPERATION AND HERMETICALLY SEALED CQSJ INCLOSURE MATERIAL CERAMIC AND GLASS CQSZ INCLOSURE CONFIGURATION DUAL-IN-LINE CQWX OUTPUT LOGIC FORM N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC CQZP INPUT CIRCUIT PATTERN 13 INPUT CRHL BIT QUANTITY 16384 CSWJ WORD QUANTITY 2048 CWSG TERMINAL SURFACE TREATMENT SOLDER CZEN VOLTAGE RATING AND TYPE PER CHARACTERISTIC 7.0 VOLTS MAXIMUM POWER SOURCE CZEQ TIME RATING PER CHACTERISTIC 400.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT CZER MEMORY DEVICE TYPE ROM TTQY TERMINAL TYPE AND QUANTITY 24 PRINTED CIRCUIT
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 1.188 INCHES MINIMUM AND 1.212 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.568 INCHES MINIMUM AND 0.598 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.040 INCHES MINIMUM AND 0.162 INCHES MAXIMUM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 1.0 WATTS |
| AFGA | OPERATING TEMP RANGE | +0.0 TO 70.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | HIGH SPEED AND HIGH PERFORMANCE AND STATIC OPERATION AND HERMETICALLY SEALED |
| CQSJ | INCLOSURE MATERIAL | CERAMIC AND GLASS |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CQWX | OUTPUT LOGIC FORM | N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | 13 INPUT |
| CRHL | BIT QUANTITY | 16384 |
| CSWJ | WORD QUANTITY | 2048 |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 7.0 VOLTS MAXIMUM POWER SOURCE |
| CZEQ | TIME RATING PER CHACTERISTIC | 400.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT |
| CZER | MEMORY DEVICE TYPE | ROM |
| TTQY | TERMINAL TYPE AND QUANTITY | 24 PRINTED CIRCUIT |