NSN 5962-01-159-2494 of Microcircuit Memory - Parts Details
Alternative NSN: 5962011592494 |
Item Name: Microcircuit Memory |
FSG: 59 Electrical and Electronic Equipment Components |
Federal Supply Class (FSC): 5962 Microcircuits Electronic |
NIIN: 011592494 |
NCB Code: USA (01) |
Manufacturers: L 3 Communications , Raytheon Technical Services Company , Fairchild Semiconductor Corp , Dla Land And Maritime , Texas Instrument Inc |
ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is the latest parts procurement platform for the aerospace and aviation industry. Check out high demanding part numbers 4014626 280, 4014626-157, 4014626-280, F10416DC, ROM PROM FAMILY 037 under NSN 5962-01-159-2494 of Microcircuit Memory manufactured by L 3 Communications, Raytheon Technical Services Company, Fairchild Semiconductor Corp, Dla Land And Maritime, Texas Instrument Inc.
Federal Supply Class of NSN 5962-01-159-2494 is FSC 5962 contains part details of Microcircuits Electronic. Quote for your desired part numbers.
Part Number's List for NSN 5962-01-159-2494, 5962011592494
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Part No Manufacturer Item Name QTY RFQ 4014626 280 L 3 Communications microcircuit memory Avl RFQ 4014626-157 Raytheon Technical Services Company microcircuit memory Avl RFQ 4014626-280 Raytheon Technical Services Company microcircuit memory Avl RFQ F10416DC Fairchild Semiconductor Corp microcircuit memory Avl RFQ ROM PROM FAMILY 037 Dla Land And Maritime microcircuit memory Avl RFQ TBP24S41MJ Texas Instrument Inc microcircuit memory Avl RFQ
Characteristics Data of NSN 5962011592494MRC Criteria Characteristic ADAQ BODY LENGTH 0.755 INCHES MINIMUM AND 0.785 INCHES MAXIMUM ADAT BODY WIDTH 0.265 INCHES MINIMUM AND 0.291 INCHES MAXIMUM ADAU BODY HEIGHT 0.199 INCHES NOMINAL AFGA OPERATING TEMP RANGE +0.0/+75.0 DEG CELSIUS AFJQ STORAGE TEMP RANGE -65.0/+150.0 DEG CELSIUS CBBL FEATURES PROVIDED HERMETICALLY SEALED AND PROGRAMMABLE AND W/ENABLE CQSJ INCLOSURE MATERIAL CERAMIC CQSZ INCLOSURE CONFIGURATION DUAL-IN-LINE CQWX OUTPUT LOGIC FORM EMITTER-COUPLED LOGIC CQZP INPUT CIRCUIT PATTERN 9 INPUT CWSG TERMINAL SURFACE TREATMENT SOLDER CZEN VOLTAGE RATING AND TYPE PER CHARACTERISTIC -7.0 VOLTS MAXIMUM POWER SOURCE CZEQ TIME RATING PER CHACTERISTIC 20.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT CZER MEMORY DEVICE TYPE ROM CZZZ MEMORY CAPACITY UNKNOWN TTQY TERMINAL TYPE AND QUANTITY 16 PRINTED CIRCUIT
MRC | Criteria | Characteristic |
---|---|---|
ADAQ | BODY LENGTH | 0.755 INCHES MINIMUM AND 0.785 INCHES MAXIMUM |
ADAT | BODY WIDTH | 0.265 INCHES MINIMUM AND 0.291 INCHES MAXIMUM |
ADAU | BODY HEIGHT | 0.199 INCHES NOMINAL |
AFGA | OPERATING TEMP RANGE | +0.0/+75.0 DEG CELSIUS |
AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND PROGRAMMABLE AND W/ENABLE |
CQSJ | INCLOSURE MATERIAL | CERAMIC |
CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
CQWX | OUTPUT LOGIC FORM | EMITTER-COUPLED LOGIC |
CQZP | INPUT CIRCUIT PATTERN | 9 INPUT |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -7.0 VOLTS MAXIMUM POWER SOURCE |
CZEQ | TIME RATING PER CHACTERISTIC | 20.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT |
CZER | MEMORY DEVICE TYPE | ROM |
CZZZ | MEMORY CAPACITY | UNKNOWN |
TTQY | TERMINAL TYPE AND QUANTITY | 16 PRINTED CIRCUIT |