NSN 5962-01-163-4168 of Microcircuit Memory - Parts Details
Alternative NSN: 5962011634168 |
Item Name: Microcircuit Memory |
FSG: 59 Electrical and Electronic Equipment Components |
Federal Supply Class (FSC): 5962 Microcircuits Electronic |
NIIN: 011634168 |
NCB Code: USA (01) |
Manufacturers: Texas Instrument Inc , Raytheon Technical Services Company , Philips Semiconductors Inc , Mmi Amd , Intersil Corporation , Intel Corp Sales Office , Fairchild Semiconductor Corp , L 3 Communications , Boeing Company |
ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is the latest parts procurement platform for the aerospace and aviation industry. Check out high demanding part numbers SN74S476J, SK010296, N82S137F, MM6353-1J, HM1-7643-5 under NSN 5962-01-163-4168 of Microcircuit Memory manufactured by Texas Instrument Inc, Raytheon Technical Services Company, Philips Semiconductors Inc, Mmi Amd, Intersil Corporation.
Federal Supply Class of NSN 5962-01-163-4168 is FSC 5962 contains part details of Microcircuits Electronic. Quote for your desired part numbers.
Part Number's List for NSN 5962-01-163-4168, 5962011634168
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Part No Manufacturer Item Name QTY RFQ SN74S476J Texas Instrument Inc microcircuit memory Avl RFQ SK010296 Raytheon Technical Services Company microcircuit memory Avl RFQ N82S137F Philips Semiconductors Inc microcircuit memory Avl RFQ MM6353-1J Mmi Amd microcircuit memory Avl RFQ HM1-7643-5 Intersil Corporation microcircuit memory Avl RFQ D3625-2 Intel Corp Sales Office microcircuit memory Avl RFQ 93453DC Fairchild Semiconductor Corp microcircuit memory Avl RFQ 4014726-124 Raytheon Technical Services Company microcircuit memory Avl RFQ 4014726-124 L 3 Communications microcircuit memory Avl RFQ 4014312-01 L 3 Communications microcircuit memory Avl RFQ 4014312-01 Raytheon Technical Services Company microcircuit memory Avl RFQ 000-8002-348 Boeing Company microcircuit memory Avl RFQ
Characteristics Data of NSN 5962011634168MRC Criteria Characteristic ADAQ BODY LENGTH 0.880 INCHES MINIMUM AND 0.930 INCHES MAXIMUM ADAT BODY WIDTH 0.265 INCHES MINIMUM AND 0.300 INCHES MAXIMUM ADAU BODY HEIGHT 0.155 INCHES MINIMUM AND 0.175 INCHES MAXIMUM AFGA OPERATING TEMP RANGE +0.0/+75.0 DEG CELSIUS AFJQ STORAGE TEMP RANGE -65.0/+150.0 DEG CELSIUS CBBL FEATURES PROVIDED HERMETICALLY SEALED AND PROGRAMMABLE AND BIPOLAR AND MONOLITHIC CQSJ INCLOSURE MATERIAL CERAMIC AND GLASS CQSZ INCLOSURE CONFIGURATION DUAL-IN-LINE CQWX OUTPUT LOGIC FORM TRANSISTOR-TRANSISTOR LOGIC CQZP INPUT CIRCUIT PATTERN 12 INPUT CWSG TERMINAL SURFACE TREATMENT SOLDER CZEN VOLTAGE RATING AND TYPE PER CHARACTERISTIC 5.5 VOLTS MAXIMUM POWER SOURCE CZEQ TIME RATING PER CHACTERISTIC 30.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 30.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT CZER MEMORY DEVICE TYPE ROM CZZZ MEMORY CAPACITY UNKNOWN TTQY TERMINAL TYPE AND QUANTITY 18 PRINTED CIRCUIT
MRC | Criteria | Characteristic |
---|---|---|
ADAQ | BODY LENGTH | 0.880 INCHES MINIMUM AND 0.930 INCHES MAXIMUM |
ADAT | BODY WIDTH | 0.265 INCHES MINIMUM AND 0.300 INCHES MAXIMUM |
ADAU | BODY HEIGHT | 0.155 INCHES MINIMUM AND 0.175 INCHES MAXIMUM |
AFGA | OPERATING TEMP RANGE | +0.0/+75.0 DEG CELSIUS |
AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND PROGRAMMABLE AND BIPOLAR AND MONOLITHIC |
CQSJ | INCLOSURE MATERIAL | CERAMIC AND GLASS |
CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
CQWX | OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
CQZP | INPUT CIRCUIT PATTERN | 12 INPUT |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 5.5 VOLTS MAXIMUM POWER SOURCE |
CZEQ | TIME RATING PER CHACTERISTIC | 30.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 30.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
CZER | MEMORY DEVICE TYPE | ROM |
CZZZ | MEMORY CAPACITY | UNKNOWN |
TTQY | TERMINAL TYPE AND QUANTITY | 18 PRINTED CIRCUIT |