NSN 5962-01-165-3107 of Microcircuit Memory - Parts Details
| Alternative NSN: 5962011653107 |
| Item Name: Microcircuit Memory |
| FSG: 59 Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC): 5962 Microcircuits Electronic |
| NIIN: 011653107 |
| NCB Code: USA (01) |
| Manufacturers: Stmicroelectronics Inc , Agilent Technologies Inc , Hewlett Packard Co |
ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is the latest parts procurement platform for the aerospace and aviation industry. Check out high demanding part numbers MK36064, MK36000P-4 MASKED, MK36000P-4, 1818-0831 under NSN 5962-01-165-3107 of Microcircuit Memory manufactured by Stmicroelectronics Inc, Agilent Technologies Inc, Hewlett Packard Co.
Federal Supply Class of NSN 5962-01-165-3107 is FSC 5962 contains part details of Microcircuits Electronic. Quote for your desired part numbers.
Part Number's List for NSN 5962-01-165-3107, 5962011653107
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Part No Manufacturer Item Name QTY RFQ MK36064 Stmicroelectronics Inc microcircuit memory Avl RFQ MK36000P-4 MASKED Stmicroelectronics Inc microcircuit memory Avl RFQ MK36000P-4 Stmicroelectronics Inc microcircuit memory Avl RFQ 1818-0831 Agilent Technologies Inc microcircuit memory Avl RFQ 1818-0831 Hewlett Packard Co microcircuit memory Avl RFQ
Characteristics Data of NSN 5962011653107MRC Criteria Characteristic ADAQ BODY LENGTH 1.250 INCHES NOMINAL ADAT BODY WIDTH 0.500 INCHES NOMINAL ADAU BODY HEIGHT 0.187 INCHES NOMINAL AEHX MAXIMUM POWER DISSIPATION RATING 1.0 WATTS AFGA OPERATING TEMP RANGE +0.0/+70.0 DEG CELSIUS AFJQ STORAGE TEMP RANGE -65.0/+150.0 DEG CELSIUS AGAV END ITEM IDENTIFICATION TEST SET 9900A CBBL FEATURES PROVIDED HERMETICALLY SEALED AND W/ENABLE AND 3-STATE OUTPUT AND HIGH PERFORMANCE CQSJ INCLOSURE MATERIAL CERAMIC CQSZ INCLOSURE CONFIGURATION DUAL-IN-LINE CQWX OUTPUT LOGIC FORM N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC CQZP INPUT CIRCUIT PATTERN 14 INPUT CWSG TERMINAL SURFACE TREATMENT SOLDER CZEN VOLTAGE RATING AND TYPE PER CHARACTERISTIC 7.0 VOLTS MAXIMUM POWER SOURCE CZEQ TIME RATING PER CHACTERISTIC 250.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT CZER MEMORY DEVICE TYPE ROM CZZZ MEMORY CAPACITY UNKNOWN TTQY TERMINAL TYPE AND QUANTITY 24 PRINTED CIRCUIT
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 1.250 INCHES NOMINAL |
| ADAT | BODY WIDTH | 0.500 INCHES NOMINAL |
| ADAU | BODY HEIGHT | 0.187 INCHES NOMINAL |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 1.0 WATTS |
| AFGA | OPERATING TEMP RANGE | +0.0/+70.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
| AGAV | END ITEM IDENTIFICATION | TEST SET 9900A |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND W/ENABLE AND 3-STATE OUTPUT AND HIGH PERFORMANCE |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CQWX | OUTPUT LOGIC FORM | N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | 14 INPUT |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 7.0 VOLTS MAXIMUM POWER SOURCE |
| CZEQ | TIME RATING PER CHACTERISTIC | 250.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT |
| CZER | MEMORY DEVICE TYPE | ROM |
| CZZZ | MEMORY CAPACITY | UNKNOWN |
| TTQY | TERMINAL TYPE AND QUANTITY | 24 PRINTED CIRCUIT |