NSN 5962-01-165-3112 of Microcircuit Memory - Parts Details
| Alternative NSN: 5962011653112 |
| Item Name: Microcircuit Memory |
| FSG: 59 Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC): 5962 Microcircuits Electronic |
| NIIN: 011653112 |
| NCB Code: USA (01) |
| Manufacturers: Texas Instrument Inc , National Semiconductor Corp , Agilent Technologies Inc , Hewlett Packard Co |
ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is the latest parts procurement platform for the aerospace and aviation industry. Check out high demanding part numbers TBP24SA10N PROGRAMMED, TBP24SA10J, DM74S387N PROGRAMMED, DM74S387J, 1816-0438 under NSN 5962-01-165-3112 of Microcircuit Memory manufactured by Texas Instrument Inc, National Semiconductor Corp, Agilent Technologies Inc, Hewlett Packard Co.
Federal Supply Class of NSN 5962-01-165-3112 is FSC 5962 contains part details of Microcircuits Electronic. Quote for your desired part numbers.
Part Number's List for NSN 5962-01-165-3112, 5962011653112
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Part No Manufacturer Item Name QTY RFQ TBP24SA10N PROGRAMMED Texas Instrument Inc microcircuit memory Avl RFQ TBP24SA10J Texas Instrument Inc microcircuit memory Avl RFQ DM74S387N PROGRAMMED National Semiconductor Corp microcircuit memory Avl RFQ DM74S387J National Semiconductor Corp microcircuit memory Avl RFQ 1816-0438 Agilent Technologies Inc microcircuit memory Avl RFQ 1816-0438 Hewlett Packard Co microcircuit memory Avl RFQ
Characteristics Data of NSN 5962011653112MRC Criteria Characteristic ADAQ BODY LENGTH 0.890 INCHES NOMINAL ADAT BODY WIDTH 0.220 INCHES NOMINAL ADAU BODY HEIGHT 0.125 INCHES NOMINAL AEHX MAXIMUM POWER DISSIPATION RATING 375.0 MILLIWATTS AFGA OPERATING TEMP RANGE +0.0/+70.0 DEG CELSIUS AFJQ STORAGE TEMP RANGE -65.0/+150.0 DEG CELSIUS AGAV END ITEM IDENTIFICATION TEST SET 9900A CBBL FEATURES PROVIDED HERMETICALLY SEALED AND 3-STATE OUTPUT AND LOW POWER AND PROGRAMMABLE CQSJ INCLOSURE MATERIAL CERAMIC AND GLASS CQSZ INCLOSURE CONFIGURATION DUAL-IN-LINE CQWX OUTPUT LOGIC FORM TRANSISTOR-TRANSISTOR LOGIC CQZP INPUT CIRCUIT PATTERN 10 INPUT CWSG TERMINAL SURFACE TREATMENT SOLDER CZEN VOLTAGE RATING AND TYPE PER CHARACTERISTIC 5.5 VOLTS MAXIMUM POWER SOURCE CZEQ TIME RATING PER CHACTERISTIC 30.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT CZER MEMORY DEVICE TYPE ROM CZZZ MEMORY CAPACITY UNKNOWN TTQY TERMINAL TYPE AND QUANTITY 16 PRINTED CIRCUIT
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 0.890 INCHES NOMINAL |
| ADAT | BODY WIDTH | 0.220 INCHES NOMINAL |
| ADAU | BODY HEIGHT | 0.125 INCHES NOMINAL |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 375.0 MILLIWATTS |
| AFGA | OPERATING TEMP RANGE | +0.0/+70.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
| AGAV | END ITEM IDENTIFICATION | TEST SET 9900A |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND 3-STATE OUTPUT AND LOW POWER AND PROGRAMMABLE |
| CQSJ | INCLOSURE MATERIAL | CERAMIC AND GLASS |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CQWX | OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | 10 INPUT |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 5.5 VOLTS MAXIMUM POWER SOURCE |
| CZEQ | TIME RATING PER CHACTERISTIC | 30.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT |
| CZER | MEMORY DEVICE TYPE | ROM |
| CZZZ | MEMORY CAPACITY | UNKNOWN |
| TTQY | TERMINAL TYPE AND QUANTITY | 16 PRINTED CIRCUIT |