NSN 5962-01-186-6590 of Microcircuit Digital - Parts Details
| Alternative NSN: 5962011866590 |
| Item Name: Microcircuit Digital |
| FSG: 59 Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC): 5962 Microcircuits Electronic |
| NIIN: 011866590 |
| NCB Code: USA (01) |
| Manufacturers: Miltope Corp , L 3 Communications , Raytheon Aircraft , Intersil Corporation , Teledyne Technologies Inc |
ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is the latest parts procurement platform for the aerospace and aviation industry. Check out high demanding part numbers M50-438, HMMP1802AY, HMMP1802AD, HM1802AY-000, CDP1802D 3 under NSN 5962-01-186-6590 of Microcircuit Digital manufactured by Miltope Corp, L 3 Communications, Raytheon Aircraft, Intersil Corporation, Teledyne Technologies Inc.
Federal Supply Class of NSN 5962-01-186-6590 is FSC 5962 contains part details of Microcircuits Electronic. Quote for your desired part numbers.
Part Number's List for NSN 5962-01-186-6590, 5962011866590
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Part No Manufacturer Item Name QTY RFQ M50-438 Miltope Corp microcircuit digital Avl RFQ HMMP1802AY L 3 Communications microcircuit digital Avl RFQ HMMP1802AD L 3 Communications microcircuit digital Avl RFQ HM1802AY-000 Raytheon Aircraft microcircuit digital Avl RFQ CDP1802D 3 Intersil Corporation microcircuit digital Avl RFQ CDP1802AD-3 Intersil Corporation microcircuit digital Avl RFQ 847133 Teledyne Technologies Inc microcircuit digital Avl RFQ
Characteristics Data of NSN 5962011866590MRC Criteria Characteristic ADAQ BODY LENGTH 1.980 INCHES MINIMUM AND 2.020 INCHES MAXIMUM ADAT BODY WIDTH 0.515 INCHES MINIMUM AND 0.600 INCHES MAXIMUM ADAU BODY HEIGHT 0.155 INCHES MAXIMUM AEHX MAXIMUM POWER DISSIPATION RATING 500.0 MILLIWATTS AFGA OPERATING TEMP RANGE -55.0/+125.0 DEG CELSIUS AFJQ STORAGE TEMP RANGE -65.0/+150.0 DEG CELSIUS CBBL FEATURES PROVIDED W/CLOCK AND W/CLEAR AND LOW POWER AND HIGH NOISE CQSJ INCLOSURE MATERIAL CERAMIC CQSZ INCLOSURE CONFIGURATION DUAL-IN-LINE CQWX OUTPUT LOGIC FORM COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC CQZP INPUT CIRCUIT PATTERN 23 INPUT CSSL DESIGN FUNCTION AND QUANTITY 1 MICROPROCESSOR CWSG TERMINAL SURFACE TREATMENT SOLDER CZEN VOLTAGE RATING AND TYPE PER CHARACTERISTIC 11.5 VOLTS MAXIMUM POWER SOURCE CZEQ TIME RATING PER CHACTERISTIC 600.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 600.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT TEST TEST DATA DOCUMENT 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). TTQY TERMINAL TYPE AND QUANTITY 40 PRINTED CIRCUIT
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 1.980 INCHES MINIMUM AND 2.020 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.515 INCHES MINIMUM AND 0.600 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.155 INCHES MAXIMUM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 500.0 MILLIWATTS |
| AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | W/CLOCK AND W/CLEAR AND LOW POWER AND HIGH NOISE |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | 23 INPUT |
| CSSL | DESIGN FUNCTION AND QUANTITY | 1 MICROPROCESSOR |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 11.5 VOLTS MAXIMUM POWER SOURCE |
| CZEQ | TIME RATING PER CHACTERISTIC | 600.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 600.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| TTQY | TERMINAL TYPE AND QUANTITY | 40 PRINTED CIRCUIT |