NSN 5962-01-190-6976 of Microcircuit Memory - Parts Details
Alternative NSN: 5962011906976 |
Item Name: Microcircuit Memory |
FSG: 59 Electrical and Electronic Equipment Components |
Federal Supply Class (FSC): 5962 Microcircuits Electronic |
NIIN: 011906976 |
NCB Code: USA (01) |
Manufacturers: Toshiba International Corporation , Hewlett Packard Co |
ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is the latest parts procurement platform for the aerospace and aviation industry. Check out high demanding part numbers TC5517APL, 1818-1968 under NSN 5962-01-190-6976 of Microcircuit Memory manufactured by Toshiba International Corporation, Hewlett Packard Co.
Federal Supply Class of NSN 5962-01-190-6976 is FSC 5962 contains part details of Microcircuits Electronic. Quote for your desired part numbers.
Part Number's List for NSN 5962-01-190-6976, 5962011906976
Characteristics Data of NSN 5962011906976MRC Criteria Characteristic ADAQ BODY LENGTH 1.250 INCHES NOMINAL ADAT BODY WIDTH 0.562 INCHES NOMINAL ADAU BODY HEIGHT 0.187 INCHES NOMINAL AEHX MAXIMUM POWER DISSIPATION RATING 800.0 MILLIWATTS AFGA OPERATING TEMP RANGE -30.0/+85.0 DEG CELSIUS AFJQ STORAGE TEMP RANGE -55.0/+150.0 DEG CELSIUS AGAV END ITEM IDENTIFICATION 4920-01-111-2981 AUTOMATIC TEST CBBL FEATURES PROVIDED STATIC OPERATION AND W/ENABLE AND BIDIRECTIONAL AND 3-STATE OUTPUT CQSJ INCLOSURE MATERIAL PLASTIC CQSZ INCLOSURE CONFIGURATION DUAL-IN-LINE CQWX OUTPUT LOGIC FORM COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC CQZP INPUT CIRCUIT PATTERN 22 INPUT CWSG TERMINAL SURFACE TREATMENT SOLDER CZEN VOLTAGE RATING AND TYPE PER CHARACTERISTIC 7.3 VOLTS MAXIMUM POWER SOURCE CZEQ TIME RATING PER CHACTERISTIC 250.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 250.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT CZER MEMORY DEVICE TYPE RAM CZZZ MEMORY CAPACITY UNKNOWN TTQY TERMINAL TYPE AND QUANTITY 24 PRINTED CIRCUIT
MRC | Criteria | Characteristic |
---|---|---|
ADAQ | BODY LENGTH | 1.250 INCHES NOMINAL |
ADAT | BODY WIDTH | 0.562 INCHES NOMINAL |
ADAU | BODY HEIGHT | 0.187 INCHES NOMINAL |
AEHX | MAXIMUM POWER DISSIPATION RATING | 800.0 MILLIWATTS |
AFGA | OPERATING TEMP RANGE | -30.0/+85.0 DEG CELSIUS |
AFJQ | STORAGE TEMP RANGE | -55.0/+150.0 DEG CELSIUS |
AGAV | END ITEM IDENTIFICATION | 4920-01-111-2981 AUTOMATIC TEST |
CBBL | FEATURES PROVIDED | STATIC OPERATION AND W/ENABLE AND BIDIRECTIONAL AND 3-STATE OUTPUT |
CQSJ | INCLOSURE MATERIAL | PLASTIC |
CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
CQZP | INPUT CIRCUIT PATTERN | 22 INPUT |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 7.3 VOLTS MAXIMUM POWER SOURCE |
CZEQ | TIME RATING PER CHACTERISTIC | 250.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 250.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
CZER | MEMORY DEVICE TYPE | RAM |
CZZZ | MEMORY CAPACITY | UNKNOWN |
TTQY | TERMINAL TYPE AND QUANTITY | 24 PRINTED CIRCUIT |