NSN 5962-01-199-2626 of Microcircuit Digital - Parts Details
| Alternative NSN: 5962011992626 |
| Item Name: Microcircuit Digital |
| FSG: 59 Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC): 5962 Microcircuits Electronic |
| NIIN: 011992626 |
| NCB Code: USA (01) |
| Manufacturers: Texas Instrument Inc , National Semiconductor Corp , Advanced Micro Devices Inc |
ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is the latest parts procurement platform for the aerospace and aviation industry. Check out high demanding part numbers SNC54LS257J, DM54LS257J 883B, DM54LS257AJ 883, AM54LS257DM-B under NSN 5962-01-199-2626 of Microcircuit Digital manufactured by Texas Instrument Inc, National Semiconductor Corp, Advanced Micro Devices Inc.
Federal Supply Class of NSN 5962-01-199-2626 is FSC 5962 contains part details of Microcircuits Electronic. Quote for your desired part numbers.
Part Number's List for NSN 5962-01-199-2626, 5962011992626
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Part No Manufacturer Item Name QTY RFQ SNC54LS257J Texas Instrument Inc microcircuit digital Avl RFQ DM54LS257J 883B National Semiconductor Corp microcircuit digital Avl RFQ DM54LS257AJ 883 National Semiconductor Corp microcircuit digital Avl RFQ AM54LS257DM-B Advanced Micro Devices Inc microcircuit digital Avl RFQ
Characteristics Data of NSN 5962011992626MRC Criteria Characteristic ADAQ BODY LENGTH 0.755 INCHES MINIMUM AND 0.785 INCHES MAXIMUM ADAT BODY WIDTH 0.245 INCHES MINIMUM AND 0.280 INCHES MAXIMUM ADAU BODY HEIGHT 0.180 INCHES MAXIMUM AEHX MAXIMUM POWER DISSIPATION RATING 60.0 MILLIWATTS AFGA OPERATING TEMP RANGE -55.0/+125.0 DEG CELSIUS AFJQ STORAGE TEMP RANGE -65.0/+150.0 DEG CELSIUS CBBL FEATURES PROVIDED BIPOLAR AND BURN IN AND GATED OUTPUT AND HERMETICALLY SEALED AND HIGH PERFORMANCE AND MONOLITHIC AND PARALLEL OPERATION AND POSITIVE OUTPUTS AND SCHOTTKY AND W/DATA SELECT AND W/ENABLE AND W/TOTEM POLE OUTPUT AND 3-STATE OUTPUT CQSJ INCLOSURE MATERIAL CERAMIC AND GLASS CQSZ INCLOSURE CONFIGURATION DUAL-IN-LINE CQWX OUTPUT LOGIC FORM TRANSISTOR-TRANSISTOR LOGIC CQZP INPUT CIRCUIT PATTERN QUAD 2 INPUT CSSL DESIGN FUNCTION AND QUANTITY 1 MULTIPLEXER, EIGHT TO FOUR LINE CWSG TERMINAL SURFACE TREATMENT SOLDER CZEN VOLTAGE RATING AND TYPE PER CHARACTERISTIC 7.0 VOLTS MAXIMUM POWER SOURCE CZEQ TIME RATING PER CHACTERISTIC 18.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 18.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT TTQY TERMINAL TYPE AND QUANTITY 16 PRINTED CIRCUIT
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 0.755 INCHES MINIMUM AND 0.785 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.245 INCHES MINIMUM AND 0.280 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.180 INCHES MAXIMUM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 60.0 MILLIWATTS |
| AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | BIPOLAR AND BURN IN AND GATED OUTPUT AND HERMETICALLY SEALED AND HIGH PERFORMANCE AND MONOLITHIC AND PARALLEL OPERATION AND POSITIVE OUTPUTS AND SCHOTTKY AND W/DATA SELECT AND W/ENABLE AND W/TOTEM POLE OUTPUT AND 3-STATE OUTPUT |
| CQSJ | INCLOSURE MATERIAL | CERAMIC AND GLASS |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CQWX | OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | QUAD 2 INPUT |
| CSSL | DESIGN FUNCTION AND QUANTITY | 1 MULTIPLEXER, EIGHT TO FOUR LINE |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 7.0 VOLTS MAXIMUM POWER SOURCE |
| CZEQ | TIME RATING PER CHACTERISTIC | 18.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 18.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
| TTQY | TERMINAL TYPE AND QUANTITY | 16 PRINTED CIRCUIT |