NSN 5962-01-200-6584 of Microcircuit Digital - Parts Details
| Alternative NSN: 5962012006584 |
| Item Name: Microcircuit Digital |
| FSG: 59 Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC): 5962 Microcircuits Electronic |
| NIIN: 012006584 |
| NCB Code: USA (01) |
| Manufacturers: Texas Instrument Inc , National Semiconductor Corp , Fsg Inc , Wespercorp Fsg Inc , Eldec Corporation , Dme Corporation , Ametek Programmable Power Inc |
ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is the latest parts procurement platform for the aerospace and aviation industry. Check out high demanding part numbers SN54HC367J, MM54HC367J 883B, F17007040, CM38-367A, A1-11-0180-012 under NSN 5962-01-200-6584 of Microcircuit Digital manufactured by Texas Instrument Inc, National Semiconductor Corp, Fsg Inc, Wespercorp Fsg Inc, Eldec Corporation.
Federal Supply Class of NSN 5962-01-200-6584 is FSC 5962 contains part details of Microcircuits Electronic. Quote for your desired part numbers.
Part Number's List for NSN 5962-01-200-6584, 5962012006584
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Part No Manufacturer Item Name QTY RFQ SN54HC367J Texas Instrument Inc microcircuit digital Avl RFQ MM54HC367J 883B National Semiconductor Corp microcircuit digital Avl RFQ F17007040 Fsg Inc microcircuit digital Avl RFQ F17007040 Wespercorp Fsg Inc microcircuit digital Avl RFQ CM38-367A Eldec Corporation microcircuit digital Avl RFQ A1-11-0180-012 Dme Corporation microcircuit digital Avl RFQ 849H36-7X Ametek Programmable Power Inc microcircuit digital Avl RFQ
Characteristics Data of NSN 5962012006584MRC Criteria Characteristic ADAQ BODY LENGTH 0.785 INCHES MAXIMUM ADAT BODY WIDTH 0.291 INCHES MAXIMUM ADAU BODY HEIGHT 0.180 INCHES MAXIMUM AEHX MAXIMUM POWER DISSIPATION RATING 500.0 MILLIWATTS AFGA OPERATING TEMP RANGE -55.0/+125.0 DEG CELSIUS AFJQ STORAGE TEMP RANGE -65.0/+150.0 DEG CELSIUS CBBL FEATURES PROVIDED HERMETICALLY SEALED AND BURN IN AND 3-STATE OUTPUT AND W/ENABLE AND HIGH SPEED CQSJ INCLOSURE MATERIAL CERAMIC CQSZ INCLOSURE CONFIGURATION DUAL-IN-LINE CQWX OUTPUT LOGIC FORM COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC CQZP INPUT CIRCUIT PATTERN 8 INPUT CSSL DESIGN FUNCTION AND QUANTITY 6 BUFFER, TRI-STATE CWSG TERMINAL SURFACE TREATMENT SOLDER CZEN VOLTAGE RATING AND TYPE PER CHARACTERISTIC -1.5 VOLTS MAXIMUM POWER SOURCE AND 7.5 VOLTS MAXIMUM POWER SOURCE CZEQ TIME RATING PER CHACTERISTIC 280.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 280.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT TEST TEST DATA DOCUMENT 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). TTQY TERMINAL TYPE AND QUANTITY 16 PRINTED CIRCUIT
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 0.785 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.291 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.180 INCHES MAXIMUM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 500.0 MILLIWATTS |
| AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN AND 3-STATE OUTPUT AND W/ENABLE AND HIGH SPEED |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | 8 INPUT |
| CSSL | DESIGN FUNCTION AND QUANTITY | 6 BUFFER, TRI-STATE |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -1.5 VOLTS MAXIMUM POWER SOURCE AND 7.5 VOLTS MAXIMUM POWER SOURCE |
| CZEQ | TIME RATING PER CHACTERISTIC | 280.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 280.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| TTQY | TERMINAL TYPE AND QUANTITY | 16 PRINTED CIRCUIT |