NSN 5962-01-200-8322 of Microcircuit Digital - Parts Details
| Alternative NSN: 5962012008322 |
| Item Name: Microcircuit Digital |
| FSG: 59 Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC): 5962 Microcircuits Electronic |
| NIIN: 012008322 |
| NCB Code: USA (01) |
| Manufacturers: Texas Instrument Inc , National Semiconductor Corp , Freescale Semiconductor Inc , Eldec Corporation , Harris Corporation , G E C Marconi Communications Ltd , Bae Systems , Honeywell International Inc |
ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is the latest parts procurement platform for the aerospace and aviation industry. Check out high demanding part numbers SNJ54HC10J, SN54HC10J, MM54HC10J 883B, MC54HC10J, CM38-10A under NSN 5962-01-200-8322 of Microcircuit Digital manufactured by Texas Instrument Inc, National Semiconductor Corp, Freescale Semiconductor Inc, Eldec Corporation, Harris Corporation.
Federal Supply Class of NSN 5962-01-200-8322 is FSC 5962 contains part details of Microcircuits Electronic. Quote for your desired part numbers.
Part Number's List for NSN 5962-01-200-8322, 5962012008322
-
Part No Manufacturer Item Name QTY RFQ SNJ54HC10J Texas Instrument Inc microcircuit digital Avl RFQ SN54HC10J Texas Instrument Inc microcircuit digital Avl RFQ MM54HC10J 883B National Semiconductor Corp microcircuit digital Avl RFQ MC54HC10J Freescale Semiconductor Inc microcircuit digital Avl RFQ CM38-10A Eldec Corporation microcircuit digital Avl RFQ CM38-10 Eldec Corporation microcircuit digital Avl RFQ CD54HC10F 3 Harris Corporation microcircuit digital Avl RFQ 449 4 01930 010 G E C Marconi Communications Ltd microcircuit digital Avl RFQ 449 4 01930 010 Bae Systems microcircuit digital Avl RFQ 10094283-101 Honeywell International Inc microcircuit digital Avl RFQ
Characteristics Data of NSN 5962012008322MRC Criteria Characteristic ADAQ BODY LENGTH 0.785 INCHES MAXIMUM ADAT BODY WIDTH 0.291 INCHES MAXIMUM ADAU BODY HEIGHT 0.180 INCHES MAXIMUM AEHX MAXIMUM POWER DISSIPATION RATING 500.0 MILLIWATTS AFGA OPERATING TEMP RANGE -55.0/+125.0 DEG CELSIUS AFJQ STORAGE TEMP RANGE -65.0/+150.0 DEG CELSIUS CBBL FEATURES PROVIDED HERMETICALLY SEALED AND BURN IN AND HIGH SPEED AND POSITIVE OUTPUTS CQSJ INCLOSURE MATERIAL CERAMIC CQSZ INCLOSURE CONFIGURATION DUAL-IN-LINE CQWX OUTPUT LOGIC FORM COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC CQZP INPUT CIRCUIT PATTERN TRIPLE 3 INPUT CSSL DESIGN FUNCTION AND QUANTITY 3 GATE, NAND CWSG TERMINAL SURFACE TREATMENT SOLDER CZEN VOLTAGE RATING AND TYPE PER CHARACTERISTIC -0.5 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE TEST TEST DATA DOCUMENT 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). TTQY TERMINAL TYPE AND QUANTITY 14 PRINTED CIRCUIT
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 0.785 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.291 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.180 INCHES MAXIMUM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 500.0 MILLIWATTS |
| AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN AND HIGH SPEED AND POSITIVE OUTPUTS |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | TRIPLE 3 INPUT |
| CSSL | DESIGN FUNCTION AND QUANTITY | 3 GATE, NAND |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -0.5 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| TTQY | TERMINAL TYPE AND QUANTITY | 14 PRINTED CIRCUIT |