NSN 5962-01-204-7268 of Microcircuit Memory - Parts Details
Alternative NSN: 5962012047268 |
Item Name: Microcircuit Memory |
FSG: 59 Electrical and Electronic Equipment Components |
Federal Supply Class (FSC): 5962 Microcircuits Electronic |
NIIN: 012047268 |
NCB Code: USA (01) |
Manufacturers: Texas Instrument Inc , Dla Land And Maritime , Intel Corp Sales Office , Advanced Micro Devices Inc , Thales Avionics , Boeing Company , Rockwell Collins Inc , Sagem Telecommunications , Thales Communications Inc |
ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is the latest parts procurement platform for the aerospace and aviation industry. Check out high demanding part numbers SMJ27256-25JM, ROM PROM HEAD 247, MD27256-25 B, D27256-30, AM27256-25DMB under NSN 5962-01-204-7268 of Microcircuit Memory manufactured by Texas Instrument Inc, Dla Land And Maritime, Intel Corp Sales Office, Advanced Micro Devices Inc, Thales Avionics.
Federal Supply Class of NSN 5962-01-204-7268 is FSC 5962 contains part details of Microcircuits Electronic. Quote for your desired part numbers.
Part Number's List for NSN 5962-01-204-7268, 5962012047268
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Part No Manufacturer Item Name QTY RFQ SMJ27256-25JM Texas Instrument Inc microcircuit memory Avl RFQ ROM PROM HEAD 247 Dla Land And Maritime microcircuit memory Avl RFQ MD27256-25 B Intel Corp Sales Office microcircuit memory Avl RFQ D27256-30 Intel Corp Sales Office microcircuit memory Avl RFQ AM27256-25DMB Advanced Micro Devices Inc microcircuit memory Avl RFQ AM27256-25 BXA Advanced Micro Devices Inc microcircuit memory Avl RFQ 99143737 Thales Avionics microcircuit memory Avl RFQ 8411102YA Dla Land And Maritime microcircuit memory Avl RFQ 84111 Dla Land And Maritime microcircuit memory Avl RFQ 5962-8411102BYX Dla Land And Maritime microcircuit memory Avl RFQ 5962-8411102BYB Dla Land And Maritime microcircuit memory Avl RFQ 5962-8411102BYA Dla Land And Maritime microcircuit memory Avl RFQ 477-2844-003 Boeing Company microcircuit memory Avl RFQ 351-2443-022 Rockwell Collins Inc microcircuit memory Avl RFQ 14080035-0 Sagem Telecommunications microcircuit memory Avl RFQ 115587-0001 Thales Communications Inc microcircuit memory Avl RFQ
Characteristics Data of NSN 5962012047268MRC Criteria Characteristic ADAQ BODY LENGTH 1.485 INCHES MAXIMUM ADAT BODY WIDTH 0.560 INCHES MINIMUM AND 0.625 INCHES MAXIMUM ADAU BODY HEIGHT 0.217 INCHES MAXIMUM AEHX MAXIMUM POWER DISSIPATION RATING 1.0 WATTS AFGA OPERATING TEMP RANGE -55.0 TO 125.0 DEG CELSIUS AFJQ STORAGE TEMP RANGE -65.0 TO 150.0 DEG CELSIUS CBBL FEATURES PROVIDED BURN IN AND ELECTROSTATIC SENSITIVE AND GATED OUTPUT AND HERMETICALLY SEALED AND MEDIUM SPEED AND MONOLITHIC AND PARALLEL OPERATION AND POSITIVE OUTPUTS AND PROGRAMMABLE AND ULTRAVIOLET ERASABLE AND W/BUFFERED OUTPUT AND W/INDEPENDENT OUTPU CQSJ INCLOSURE MATERIAL CERAMIC AND GLASS CQSZ INCLOSURE CONFIGURATION DUAL-IN-LINE CQWX OUTPUT LOGIC FORM METAL OXIDE-SEMICONDUCTOR LOGIC CQZP INPUT CIRCUIT PATTERN 16 INPUT CWSG TERMINAL SURFACE TREATMENT SOLDER CZEN VOLTAGE RATING AND TYPE PER CHARACTERISTIC 5.0 VOLTS NOMINAL POWER SOURCE CZER MEMORY DEVICE TYPE ROM TEST TEST DATA DOCUMENT 14933-84111 DRAWING (THIS IS THE BASIC GOVERNING DRAWING, SUCH AS A CONTRACTOR DRAWING, ORIGINAL EQUIPMENT MANUFACTURER DRAWING, ETC.; EXCLUDES ANY SPECIFICATION, STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNING DRAWIN TTQY TERMINAL TYPE AND QUANTITY 28 PRINTED CIRCUIT
MRC | Criteria | Characteristic |
---|---|---|
ADAQ | BODY LENGTH | 1.485 INCHES MAXIMUM |
ADAT | BODY WIDTH | 0.560 INCHES MINIMUM AND 0.625 INCHES MAXIMUM |
ADAU | BODY HEIGHT | 0.217 INCHES MAXIMUM |
AEHX | MAXIMUM POWER DISSIPATION RATING | 1.0 WATTS |
AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS |
AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS |
CBBL | FEATURES PROVIDED | BURN IN AND ELECTROSTATIC SENSITIVE AND GATED OUTPUT AND HERMETICALLY SEALED AND MEDIUM SPEED AND MONOLITHIC AND PARALLEL OPERATION AND POSITIVE OUTPUTS AND PROGRAMMABLE AND ULTRAVIOLET ERASABLE AND W/BUFFERED OUTPUT AND W/INDEPENDENT OUTPU |
CQSJ | INCLOSURE MATERIAL | CERAMIC AND GLASS |
CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
CQWX | OUTPUT LOGIC FORM | METAL OXIDE-SEMICONDUCTOR LOGIC |
CQZP | INPUT CIRCUIT PATTERN | 16 INPUT |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 5.0 VOLTS NOMINAL POWER SOURCE |
CZER | MEMORY DEVICE TYPE | ROM |
TEST | TEST DATA DOCUMENT | 14933-84111 DRAWING (THIS IS THE BASIC GOVERNING DRAWING, SUCH AS A CONTRACTOR DRAWING, ORIGINAL EQUIPMENT MANUFACTURER DRAWING, ETC.; EXCLUDES ANY SPECIFICATION, STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNING DRAWIN |
TTQY | TERMINAL TYPE AND QUANTITY | 28 PRINTED CIRCUIT |