NSN 5962-01-219-3781 of Microcircuit Memory - Parts Details
Alternative NSN: 5962012193781 |
Item Name: Microcircuit Memory |
FSG: 59 Electrical and Electronic Equipment Components |
Federal Supply Class (FSC): 5962 Microcircuits Electronic |
NIIN: 012193781 |
NCB Code: USA (01) |
Manufacturers: Raytheon Aircraft , Dla Land And Maritime , Texas Instrument Inc |
ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is the latest parts procurement platform for the aerospace and aviation industry. Check out high demanding part numbers 2058089-5, PROM0005, ROM PROM FAMILY 023, SN74S472J under NSN 5962-01-219-3781 of Microcircuit Memory manufactured by Raytheon Aircraft, Dla Land And Maritime, Texas Instrument Inc.
Federal Supply Class of NSN 5962-01-219-3781 is FSC 5962 contains part details of Microcircuits Electronic. Quote for your desired part numbers.
Part Number's List for NSN 5962-01-219-3781, 5962012193781
Characteristics Data of NSN 5962012193781MRC Criteria Characteristic ADAT BODY WIDTH 0.245 INCHES MINIMUM AND 0.300 INCHES MAXIMUM ADAU BODY HEIGHT 0.150 INCHES MAXIMUM CQSZ INCLOSURE CONFIGURATION DUAL-IN-LINE CQZP INPUT CIRCUIT PATTERN 10 INPUT TTQY TERMINAL TYPE AND QUANTITY 20 PRINTED CIRCUIT CZEQ TIME RATING PER CHACTERISTIC 15.00 NANOSECONDS NOMINAL PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 15.00 NANOSECONDS NOMINAL PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT CBBL FEATURES PROVIDED HERMETICALLY SEALED AND SCHOTTKY AND 3-STATE OUTPUT AND PROGRAMMABLE CQWX OUTPUT LOGIC FORM TRANSISTOR-TRANSISTOR LOGIC CZEN VOLTAGE RATING AND TYPE PER CHARACTERISTIC 7.0 VOLTS MAXIMUM POWER SOURCE CQSJ INCLOSURE MATERIAL CERAMIC AND GLASS ADAQ BODY LENGTH 0.930 INCHES MINIMUM AND 0.975 INCHES MAXIMUM AFGA OPERATING TEMP RANGE -0.0 TO 70.0 DEG CELSIUS AFJQ STORAGE TEMP RANGE -65.0 TO 150.0 DEG CELSIUS CWSG TERMINAL SURFACE TREATMENT SOLDER CZER MEMORY DEVICE TYPE ROM
MRC | Criteria | Characteristic |
---|---|---|
ADAT | BODY WIDTH | 0.245 INCHES MINIMUM AND 0.300 INCHES MAXIMUM |
ADAU | BODY HEIGHT | 0.150 INCHES MAXIMUM |
CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
CQZP | INPUT CIRCUIT PATTERN | 10 INPUT |
TTQY | TERMINAL TYPE AND QUANTITY | 20 PRINTED CIRCUIT |
CZEQ | TIME RATING PER CHACTERISTIC | 15.00 NANOSECONDS NOMINAL PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 15.00 NANOSECONDS NOMINAL PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND SCHOTTKY AND 3-STATE OUTPUT AND PROGRAMMABLE |
CQWX | OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 7.0 VOLTS MAXIMUM POWER SOURCE |
CQSJ | INCLOSURE MATERIAL | CERAMIC AND GLASS |
ADAQ | BODY LENGTH | 0.930 INCHES MINIMUM AND 0.975 INCHES MAXIMUM |
AFGA | OPERATING TEMP RANGE | -0.0 TO 70.0 DEG CELSIUS |
AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
CZER | MEMORY DEVICE TYPE | ROM |