NSN 5962-01-228-7029 of Microcircuit Memory - Parts Details
| Alternative NSN: 5962012287029 |
| Item Name: Microcircuit Memory |
| FSG: 59 Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC): 5962 Microcircuits Electronic |
| NIIN: 012287029 |
| NCB Code: USA (01) |
| Manufacturers: Dla Land And Maritime , Mmi Amd , Texas Instrument Inc , National Semiconductor Corp , General Dynamics Advanced Technology |
ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is the latest parts procurement platform for the aerospace and aviation industry. Check out high demanding part numbers ROM PROM HEAD 083, MM5348-1J 883B, JBP28SA42MJ, DM54S473J 883, 15-1263016-1 under NSN 5962-01-228-7029 of Microcircuit Memory manufactured by Dla Land And Maritime, Mmi Amd, Texas Instrument Inc, National Semiconductor Corp, General Dynamics Advanced Technology.
Federal Supply Class of NSN 5962-01-228-7029 is FSC 5962 contains part details of Microcircuits Electronic. Quote for your desired part numbers.
Part Number's List for NSN 5962-01-228-7029, 5962012287029
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Part No Manufacturer Item Name QTY RFQ ROM PROM HEAD 083 Dla Land And Maritime microcircuit memory Avl RFQ MM5348-1J 883B Mmi Amd microcircuit memory Avl RFQ JBP28SA42MJ Texas Instrument Inc microcircuit memory Avl RFQ DM54S473J 883 National Semiconductor Corp microcircuit memory Avl RFQ 15-1263016-1 General Dynamics Advanced Technology microcircuit memory Avl RFQ
Characteristics Data of NSN 5962012287029MRC Criteria Characteristic ADAQ BODY LENGTH 0.930 INCHES MINIMUM AND 0.975 INCHES MAXIMUM ADAT BODY WIDTH 0.245 INCHES MINIMUM AND 0.300 INCHES MAXIMUM ADAU BODY HEIGHT 0.180 INCHES NOMINAL AEHX MAXIMUM POWER DISSIPATION RATING 500.0 MILLIWATTS AFGA OPERATING TEMP RANGE -55.0 TO 125.0 DEG CELSIUS AFJQ STORAGE TEMP RANGE -65.0 TO 150.0 DEG CELSIUS AGAV END ITEM IDENTIFICATION RECEIVING SET,COUNTERMEASURES AN/WLR-8(V)2 CBBL FEATURES PROVIDED W/OPEN COLLECTOR AND PROGRAMMABLE AND MONOLITHIC AND W/ENABLE CQSJ INCLOSURE MATERIAL CERAMIC AND GLASS CQSZ INCLOSURE CONFIGURATION DUAL-IN-LINE CQWX OUTPUT LOGIC FORM TRANSISTOR-TRANSISTOR LOGIC CQZP INPUT CIRCUIT PATTERN 10 INPUT CWSG TERMINAL SURFACE TREATMENT SOLDER CZEN VOLTAGE RATING AND TYPE PER CHARACTERISTIC 7.0 VOLTS MAXIMUM POWER SOURCE CZER MEMORY DEVICE TYPE ROM TEST TEST DATA DOCUMENT 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). TTQY TERMINAL TYPE AND QUANTITY 20 PRINTED CIRCUIT
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 0.930 INCHES MINIMUM AND 0.975 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.245 INCHES MINIMUM AND 0.300 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.180 INCHES NOMINAL |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 500.0 MILLIWATTS |
| AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS |
| AGAV | END ITEM IDENTIFICATION | RECEIVING SET,COUNTERMEASURES AN/WLR-8(V)2 |
| CBBL | FEATURES PROVIDED | W/OPEN COLLECTOR AND PROGRAMMABLE AND MONOLITHIC AND W/ENABLE |
| CQSJ | INCLOSURE MATERIAL | CERAMIC AND GLASS |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CQWX | OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | 10 INPUT |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 7.0 VOLTS MAXIMUM POWER SOURCE |
| CZER | MEMORY DEVICE TYPE | ROM |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| TTQY | TERMINAL TYPE AND QUANTITY | 20 PRINTED CIRCUIT |