NSN 5962-01-229-3339 of Microcircuit Memory - Parts Details
| Alternative NSN: 5962012293339 |
| Item Name: Microcircuit Memory |
| FSG: 59 Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC): 5962 Microcircuits Electronic |
| NIIN: 012293339 |
| NCB Code: USA (01) |
| Manufacturers: Texas Instrument Inc , Integrated Device Technology Inc , General Dynamics Canada Ltd |
ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is the latest parts procurement platform for the aerospace and aviation industry. Check out high demanding part numbers SMJ5517-15JD, IDT6116SA150D, 908529-001 under NSN 5962-01-229-3339 of Microcircuit Memory manufactured by Texas Instrument Inc, Integrated Device Technology Inc, General Dynamics Canada Ltd.
Federal Supply Class of NSN 5962-01-229-3339 is FSC 5962 contains part details of Microcircuits Electronic. Quote for your desired part numbers.
Part Number's List for NSN 5962-01-229-3339, 5962012293339
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Part No Manufacturer Item Name QTY RFQ SMJ5517-15JD Texas Instrument Inc microcircuit memory Avl RFQ IDT6116SA150D Integrated Device Technology Inc microcircuit memory Avl RFQ 908529-001 General Dynamics Canada Ltd microcircuit memory Avl RFQ
Characteristics Data of NSN 5962012293339MRC Criteria Characteristic ADAQ BODY LENGTH 1.200 INCHES NOMINAL ADAT BODY WIDTH 0.560 INCHES NOMINAL ADAU BODY HEIGHT 0.120 INCHES MAXIMUM AFGA OPERATING TEMP RANGE -55.0 TO 125.0 DEG CELSIUS CBBL FEATURES PROVIDED BURN IN AND MONOLITHIC AND STATIC OPERATION CQSJ INCLOSURE MATERIAL CERAMIC CQSZ INCLOSURE CONFIGURATION DUAL-IN-LINE CQWX OUTPUT LOGIC FORM COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC CQZP INPUT CIRCUIT PATTERN 19 INPUT CWSG TERMINAL SURFACE TREATMENT SOLDER CZER MEMORY DEVICE TYPE ROM TEST TEST DATA DOCUMENT 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). TTQY TERMINAL TYPE AND QUANTITY 24 PRINTED CIRCUIT
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 1.200 INCHES NOMINAL |
| ADAT | BODY WIDTH | 0.560 INCHES NOMINAL |
| ADAU | BODY HEIGHT | 0.120 INCHES MAXIMUM |
| AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | BURN IN AND MONOLITHIC AND STATIC OPERATION |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | 19 INPUT |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZER | MEMORY DEVICE TYPE | ROM |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| TTQY | TERMINAL TYPE AND QUANTITY | 24 PRINTED CIRCUIT |