NSN 5962-01-235-1963 of Microcircuit Memory - Parts Details
| Alternative NSN: 5962012351963 |
| Item Name: Microcircuit Memory |
| FSG: 59 Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC): 5962 Microcircuits Electronic |
| NIIN: 012351963 |
| NCB Code: USA (01) |
| Manufacturers: Dla Land And Maritime , Intel Corp Sales Office , Seeq Technology Inc , Thales Avionics , Nai Technologies Inc , Honeywell International Inc |
ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is the latest parts procurement platform for the aerospace and aviation industry. Check out high demanding part numbers ROM PROM HEAD 148, MD2817A-25B, MD2817A-25, M2817A-250 B, DM2817A250 B under NSN 5962-01-235-1963 of Microcircuit Memory manufactured by Dla Land And Maritime, Intel Corp Sales Office, Seeq Technology Inc, Thales Avionics, Nai Technologies Inc.
Federal Supply Class of NSN 5962-01-235-1963 is FSC 5962 contains part details of Microcircuits Electronic. Quote for your desired part numbers.
Part Number's List for NSN 5962-01-235-1963, 5962012351963
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Part No Manufacturer Item Name QTY RFQ ROM PROM HEAD 148 Dla Land And Maritime microcircuit memory Avl RFQ MD2817A-25B Intel Corp Sales Office microcircuit memory Avl RFQ MD2817A-25 Intel Corp Sales Office microcircuit memory Avl RFQ M2817A-250 B Seeq Technology Inc microcircuit memory Avl RFQ DM2817A250 B Seeq Technology Inc microcircuit memory Avl RFQ 91594791 Thales Avionics microcircuit memory Avl RFQ 887038 Nai Technologies Inc microcircuit memory Avl RFQ 8511462-462 Honeywell International Inc microcircuit memory Avl RFQ
Characteristics Data of NSN 5962012351963MRC Criteria Characteristic ADAQ BODY LENGTH 1.435 INCHES MINIMUM AND 1.485 INCHES MAXIMUM ADAT BODY WIDTH 0.515 INCHES MINIMUM AND 0.600 INCHES MAXIMUM ADAU BODY HEIGHT 0.140 INCHES MINIMUM AND 0.185 INCHES MAXIMUM AFGA OPERATING TEMP RANGE -55.0 TO 125.0 DEG CELSIUS AFJQ STORAGE TEMP RANGE -65.0 TO 150.0 DEG CELSIUS CBBL FEATURES PROVIDED PROGRAMMABLE AND ERASABLE AND W/ENABLE AND HIGH PERFORMANCE CQSJ INCLOSURE MATERIAL CERAMIC CQSZ INCLOSURE CONFIGURATION DUAL-IN-LINE CQWX OUTPUT LOGIC FORM METAL OXIDE-SEMICONDUCTOR LOGIC CQZP INPUT CIRCUIT PATTERN 22 INPUT CWSG TERMINAL SURFACE TREATMENT SOLDER CZEN VOLTAGE RATING AND TYPE PER CHARACTERISTIC 6.0 VOLTS MAXIMUM POWER SOURCE CZEQ TIME RATING PER CHACTERISTIC 250.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 250.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT CZER MEMORY DEVICE TYPE ROM TEST TEST DATA DOCUMENT 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). TTQY TERMINAL TYPE AND QUANTITY 28 PRINTED CIRCUIT
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 1.435 INCHES MINIMUM AND 1.485 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.515 INCHES MINIMUM AND 0.600 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.140 INCHES MINIMUM AND 0.185 INCHES MAXIMUM |
| AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | PROGRAMMABLE AND ERASABLE AND W/ENABLE AND HIGH PERFORMANCE |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CQWX | OUTPUT LOGIC FORM | METAL OXIDE-SEMICONDUCTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | 22 INPUT |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 6.0 VOLTS MAXIMUM POWER SOURCE |
| CZEQ | TIME RATING PER CHACTERISTIC | 250.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 250.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
| CZER | MEMORY DEVICE TYPE | ROM |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| TTQY | TERMINAL TYPE AND QUANTITY | 28 PRINTED CIRCUIT |