NSN 5962-01-238-6843 of Microcircuit Digital - Parts Details
| Alternative NSN: 5962012386843 |
| Item Name: Microcircuit Digital |
| FSG: 59 Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC): 5962 Microcircuits Electronic |
| NIIN: 012386843 |
| NCB Code: USA (01) |
| Manufacturers: Texas Instrument Inc , Dla Land And Maritime , Freescale Semiconductor Inc , Integrated Device Technology Inc , Harris Corporation , Raytheon Electronic Systems Inc |
ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is the latest parts procurement platform for the aerospace and aviation industry. Check out high demanding part numbers SNJ54HCT240J, NH84-30533-001, MC54HCT240 BRAJC, IDT54HCT240DB, CD54HCT240F 3 under NSN 5962-01-238-6843 of Microcircuit Digital manufactured by Texas Instrument Inc, Dla Land And Maritime, Freescale Semiconductor Inc, Integrated Device Technology Inc, Harris Corporation.
Federal Supply Class of NSN 5962-01-238-6843 is FSC 5962 contains part details of Microcircuits Electronic. Quote for your desired part numbers.
Part Number's List for NSN 5962-01-238-6843, 5962012386843
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Part No Manufacturer Item Name QTY RFQ SNJ54HCT240J Texas Instrument Inc microcircuit digital Avl RFQ NH84-30533-001 Dla Land And Maritime microcircuit digital Avl RFQ MC54HCT240 BRAJC Freescale Semiconductor Inc microcircuit digital Avl RFQ IDT54HCT240DB Integrated Device Technology Inc microcircuit digital Avl RFQ CD54HCT240F 3 Harris Corporation microcircuit digital Avl RFQ 84-30533-001 Raytheon Electronic Systems Inc microcircuit digital Avl RFQ
Characteristics Data of NSN 5962012386843MRC Criteria Characteristic ADAQ BODY LENGTH 1.060 INCHES MAXIMUM ADAT BODY WIDTH 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM ADAU BODY HEIGHT 0.140 INCHES MAXIMUM AEHX MAXIMUM POWER DISSIPATION RATING 500.0 MILLIWATTS AFGA OPERATING TEMP RANGE -55.0/+125.0 DEG CELSIUS AFJQ STORAGE TEMP RANGE -65.0/+150.0 DEG CELSIUS CBBL FEATURES PROVIDED ELECTROSTATIC SENSITIVE AND W/ENABLE AND HERMETICALLY SEALED CQSJ INCLOSURE MATERIAL CERAMIC CQSZ INCLOSURE CONFIGURATION DUAL-IN-LINE CQWX OUTPUT LOGIC FORM COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC CQZP INPUT CIRCUIT PATTERN 10 INPUT CRTL CRITICALITY CODE JUSTIFICATION FEAT CSSL DESIGN FUNCTION AND QUANTITY 8 BUFFER, INVERTING CTFT CASE OUTLINE SOURCE AND DESIGNATOR D-8 MIL-M-38510 CZEQ TIME RATING PER CHACTERISTIC 37.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 37.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT FEAT SPECIAL FEATURES HARDNESS CRITICAL ITEM NHCF NUCLEAR HARDNESS CRITICAL FEATURE HARDENED TEST TEST DATA DOCUMENT 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 1.060 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.140 INCHES MAXIMUM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 500.0 MILLIWATTS |
| AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | ELECTROSTATIC SENSITIVE AND W/ENABLE AND HERMETICALLY SEALED |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | 10 INPUT |
| CRTL | CRITICALITY CODE JUSTIFICATION | FEAT |
| CSSL | DESIGN FUNCTION AND QUANTITY | 8 BUFFER, INVERTING |
| CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | D-8 MIL-M-38510 |
| CZEQ | TIME RATING PER CHACTERISTIC | 37.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 37.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
| FEAT | SPECIAL FEATURES | HARDNESS CRITICAL ITEM |
| NHCF | NUCLEAR HARDNESS CRITICAL FEATURE | HARDENED |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |