NSN 5962-01-242-7985 of Microcircuit Memory - Parts Details
| Alternative NSN: 5962012427985 |
| Item Name: Microcircuit Memory |
| FSG: 59 Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC): 5962 Microcircuits Electronic |
| NIIN: 012427985 |
| NCB Code: USA (01) |
| Manufacturers: Boeing Company , Raytheon Aircraft , Texas Instrument Inc , Dla Land And Maritime , National Semiconductor Corp , Mmi Amd |
ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is the latest parts procurement platform for the aerospace and aviation industry. Check out high demanding part numbers V510-00050-3, V510 00050 3, SN92573J, ROM PROM FAMILY 010, DM54S471D 883B under NSN 5962-01-242-7985 of Microcircuit Memory manufactured by Boeing Company, Raytheon Aircraft, Texas Instrument Inc, Dla Land And Maritime, National Semiconductor Corp.
Federal Supply Class of NSN 5962-01-242-7985 is FSC 5962 contains part details of Microcircuits Electronic. Quote for your desired part numbers.
Part Number's List for NSN 5962-01-242-7985, 5962012427985
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Part No Manufacturer Item Name QTY RFQ V510-00050-3 Boeing Company microcircuit memory Avl RFQ V510 00050 3 Raytheon Aircraft microcircuit memory Avl RFQ SN92573J Texas Instrument Inc microcircuit memory Avl RFQ ROM PROM FAMILY 010 Dla Land And Maritime microcircuit memory Avl RFQ DM54S471D 883B National Semiconductor Corp microcircuit memory Avl RFQ 5309-1J 883B Mmi Amd microcircuit memory Avl RFQ
Characteristics Data of NSN 5962012427985MRC Criteria Characteristic ADAT BODY WIDTH 0.265 INCHES MINIMUM AND 0.300 INCHES MAXIMUM ADAQ BODY LENGTH 0.930 INCHES MINIMUM AND 0.990 INCHES MAXIMUM AFGA OPERATING TEMP RANGE -55.0/+125.0 DEG CELSIUS CBBL FEATURES PROVIDED HERMETICALLY SEALED AND MONOLITHIC AND PROGRAMMABLE AND PROGRAMMED CQSZ INCLOSURE CONFIGURATION DUAL-IN-LINE CRHL (NON-CORE DATA) BIT QUANTITY 2048 CSWJ (NON-CORE DATA) WORD QUANTITY 256 TEST TEST DATA DOCUMENT 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). CWSG TERMINAL SURFACE TREATMENT SOLDER CQWX OUTPUT LOGIC FORM TRANSISTOR-TRANSISTOR LOGIC CZEQ TIME RATING PER CHACTERISTIC 80.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 80.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT TTQY TERMINAL TYPE AND QUANTITY 20 PRINTED CIRCUIT ADAU BODY HEIGHT 0.165 INCHES MINIMUM AND 0.185 INCHES MAXIMUM AFJQ STORAGE TEMP RANGE 65.0/+150.0 DEG CELSIUS CQSJ INCLOSURE MATERIAL CERAMIC AND GLASS OR METAL CZEN VOLTAGE RATING AND TYPE PER CHARACTERISTIC 7.0 VOLTS MAXIMUM POWER SOURCE CZER MEMORY DEVICE TYPE PROM CQZP INPUT CIRCUIT PATTERN 10 INPUT
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAT | BODY WIDTH | 0.265 INCHES MINIMUM AND 0.300 INCHES MAXIMUM |
| ADAQ | BODY LENGTH | 0.930 INCHES MINIMUM AND 0.990 INCHES MAXIMUM |
| AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND MONOLITHIC AND PROGRAMMABLE AND PROGRAMMED |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CRHL | (NON-CORE DATA) BIT QUANTITY | 2048 |
| CSWJ | (NON-CORE DATA) WORD QUANTITY | 256 |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CQWX | OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
| CZEQ | TIME RATING PER CHACTERISTIC | 80.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 80.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
| TTQY | TERMINAL TYPE AND QUANTITY | 20 PRINTED CIRCUIT |
| ADAU | BODY HEIGHT | 0.165 INCHES MINIMUM AND 0.185 INCHES MAXIMUM |
| AFJQ | STORAGE TEMP RANGE | 65.0/+150.0 DEG CELSIUS |
| CQSJ | INCLOSURE MATERIAL | CERAMIC AND GLASS OR METAL |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 7.0 VOLTS MAXIMUM POWER SOURCE |
| CZER | MEMORY DEVICE TYPE | PROM |
| CQZP | INPUT CIRCUIT PATTERN | 10 INPUT |