NSN 5962-01-246-9676 of Microcircuit Digital - Parts Details
| Alternative NSN: 5962012469676 |
| Item Name: Microcircuit Digital |
| FSG: 59 Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC): 5962 Microcircuits Electronic |
| NIIN: 012469676 |
| NCB Code: USA (01) |
| Manufacturers: Texas Instrument Inc , Hamilton Sundstrand Corporation , Freescale Semiconductor Inc , Ge Aviation Systems Llc , Paeaeesikunta Logistiikkaosasto |
ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is the latest parts procurement platform for the aerospace and aviation industry. Check out high demanding part numbers SNJ54ALS240AFK, 796641-1, 54ALS240M B2CJC, 160615-03, 10136345 under NSN 5962-01-246-9676 of Microcircuit Digital manufactured by Texas Instrument Inc, Hamilton Sundstrand Corporation, Freescale Semiconductor Inc, Ge Aviation Systems Llc, Paeaeesikunta Logistiikkaosasto.
Federal Supply Class of NSN 5962-01-246-9676 is FSC 5962 contains part details of Microcircuits Electronic. Quote for your desired part numbers.
Part Number's List for NSN 5962-01-246-9676, 5962012469676
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Part No Manufacturer Item Name QTY RFQ SNJ54ALS240AFK Texas Instrument Inc microcircuit digital Avl RFQ 796641-1 Hamilton Sundstrand Corporation microcircuit digital Avl RFQ 54ALS240M B2CJC Freescale Semiconductor Inc microcircuit digital Avl RFQ 160615-03 Ge Aviation Systems Llc microcircuit digital Avl RFQ 10136345 Paeaeesikunta Logistiikkaosasto microcircuit digital Avl RFQ
Characteristics Data of NSN 5962012469676MRC Criteria Characteristic ADAQ BODY LENGTH 0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM ADAT BODY WIDTH 0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM ADAU BODY HEIGHT 0.064 INCHES MINIMUM AND 0.100 INCHES MAXIMUM AEHX MAXIMUM POWER DISSIPATION RATING 138.0 MILLIWATTS AFGA OPERATING TEMP RANGE -55.0/+125.0 DEG CELSIUS AFJQ STORAGE TEMP RANGE -65.0/+150.0 DEG CELSIUS CBBL FEATURES PROVIDED LOW POWER AND SCHOTTKY AND 3-STATE OUTPUT AND ELECTROSTATIC SENSITIVE AND MONOLITHIC CQSJ INCLOSURE MATERIAL CERAMIC CQSZ INCLOSURE CONFIGURATION LEADLESS FLAT PACK CQWX OUTPUT LOGIC FORM TRANSISTOR-TRANSISTOR LOGIC CQZP INPUT CIRCUIT PATTERN 10 INPUT CSSL DESIGN FUNCTION AND QUANTITY 8 BUFFER AND 2 DRIVER, LINE CTFT CASE OUTLINE SOURCE AND DESIGNATOR C-2 MIL-M-38510 CWSG TERMINAL SURFACE TREATMENT SOLDER CZEN VOLTAGE RATING AND TYPE PER CHARACTERISTIC 7.0 VOLTS MAXIMUM POWER SOURCE TEST TEST DATA DOCUMENT 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). TTQY TERMINAL TYPE AND QUANTITY 20 LEADLESS
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.064 INCHES MINIMUM AND 0.100 INCHES MAXIMUM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 138.0 MILLIWATTS |
| AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | LOW POWER AND SCHOTTKY AND 3-STATE OUTPUT AND ELECTROSTATIC SENSITIVE AND MONOLITHIC |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CQSZ | INCLOSURE CONFIGURATION | LEADLESS FLAT PACK |
| CQWX | OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | 10 INPUT |
| CSSL | DESIGN FUNCTION AND QUANTITY | 8 BUFFER AND 2 DRIVER, LINE |
| CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | C-2 MIL-M-38510 |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 7.0 VOLTS MAXIMUM POWER SOURCE |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| TTQY | TERMINAL TYPE AND QUANTITY | 20 LEADLESS |