NSN 5962-01-253-9114 of Microcircuit Memory - Parts Details
Alternative NSN: 5962012539114 |
Item Name: Microcircuit Memory |
FSG: 59 Electrical and Electronic Equipment Components |
Federal Supply Class (FSC): 5962 Microcircuits Electronic |
NIIN: 012539114 |
NCB Code: USA (01) |
Manufacturers: Texas Instrument Inc , Intel Corp Sales Office , Freescale Semiconductor Inc , Dla Land And Maritime |
ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is the latest parts procurement platform for the aerospace and aviation industry. Check out high demanding part numbers SMJ2114-25JDM, MD2114A 5 B, MCM2114BVBA25, L03706 under NSN 5962-01-253-9114 of Microcircuit Memory manufactured by Texas Instrument Inc, Intel Corp Sales Office, Freescale Semiconductor Inc, Dla Land And Maritime.
Federal Supply Class of NSN 5962-01-253-9114 is FSC 5962 contains part details of Microcircuits Electronic. Quote for your desired part numbers.
Part Number's List for NSN 5962-01-253-9114, 5962012539114
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Part No Manufacturer Item Name QTY RFQ SMJ2114-25JDM Texas Instrument Inc microcircuit memory Avl RFQ MD2114A 5 B Intel Corp Sales Office microcircuit memory Avl RFQ MCM2114BVBA25 Freescale Semiconductor Inc microcircuit memory Avl RFQ L03706 Dla Land And Maritime microcircuit memory Avl RFQ
Characteristics Data of NSN 5962012539114MRC Criteria Characteristic ADAQ BODY LENGTH 0.880 INCHES MINIMUM AND 0.920 INCHES MAXIMUM ADAT BODY WIDTH 0.265 INCHES MINIMUM AND 0.310 INCHES MAXIMUM ADAU BODY HEIGHT 0.140 INCHES MINIMUM AND 0.165 INCHES MAXIMUM AEHX MAXIMUM POWER DISSIPATION RATING 1.0 WATTS AFGA OPERATING TEMP RANGE -55.0 TO 125.0 DEG CELSIUS AFJQ STORAGE TEMP RANGE -65.0 TO 150.0 DEG CELSIUS CBBL FEATURES PROVIDED HIGH PERFORMANCE AND LOW POWER AND HIGH SPEED CQSJ INCLOSURE MATERIAL CERAMIC CQSZ INCLOSURE CONFIGURATION DUAL-IN-LINE CQWX OUTPUT LOGIC FORM METAL OXIDE-SEMICONDUCTOR LOGIC CQZP INPUT CIRCUIT PATTERN 16 INPUT CRTL CRITICALITY CODE JUSTIFICATION FEAT CWSG TERMINAL SURFACE TREATMENT SOLDER CZEN VOLTAGE RATING AND TYPE PER CHARACTERISTIC 3.5 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE CZER MEMORY DEVICE TYPE RAM FEAT SPECIAL FEATURES ITEM MUST COMPLY WITH REQUIREMENTS OF DEFENSE ELECTRONICS SUPPLY CENTER PRODUCTION STANDARD NO. L03706; FOR NAVY NUCLEAR PROPULSION PLANT PRODUCTS ONLY TEST TEST DATA DOCUMENT 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). TTQY TERMINAL TYPE AND QUANTITY 18 PRINTED CIRCUIT
MRC | Criteria | Characteristic |
---|---|---|
ADAQ | BODY LENGTH | 0.880 INCHES MINIMUM AND 0.920 INCHES MAXIMUM |
ADAT | BODY WIDTH | 0.265 INCHES MINIMUM AND 0.310 INCHES MAXIMUM |
ADAU | BODY HEIGHT | 0.140 INCHES MINIMUM AND 0.165 INCHES MAXIMUM |
AEHX | MAXIMUM POWER DISSIPATION RATING | 1.0 WATTS |
AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS |
AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS |
CBBL | FEATURES PROVIDED | HIGH PERFORMANCE AND LOW POWER AND HIGH SPEED |
CQSJ | INCLOSURE MATERIAL | CERAMIC |
CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
CQWX | OUTPUT LOGIC FORM | METAL OXIDE-SEMICONDUCTOR LOGIC |
CQZP | INPUT CIRCUIT PATTERN | 16 INPUT |
CRTL | CRITICALITY CODE JUSTIFICATION | FEAT |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 3.5 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE |
CZER | MEMORY DEVICE TYPE | RAM |
FEAT | SPECIAL FEATURES | ITEM MUST COMPLY WITH REQUIREMENTS OF DEFENSE ELECTRONICS SUPPLY CENTER PRODUCTION STANDARD NO. L03706; FOR NAVY NUCLEAR PROPULSION PLANT PRODUCTS ONLY |
TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
TTQY | TERMINAL TYPE AND QUANTITY | 18 PRINTED CIRCUIT |