NSN 5962-01-262-1279 of Microcircuit Memory - Parts Details
| Alternative NSN: 5962012621279 |
| Item Name: Microcircuit Memory |
| FSG: 59 Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC): 5962 Microcircuits Electronic |
| NIIN: 012621279 |
| NCB Code: USA (01) |
| Manufacturers: Texas Instrument Inc , Integrated Device Technology Inc , Advanced Micro Devices Inc , Dla Land And Maritime |
ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is the latest parts procurement platform for the aerospace and aviation industry. Check out high demanding part numbers SMJ64C16L-45JDM, IDT6168LA45DB, AM99C68-55 BRA, 5962-8670506RA, 5962-8670506BRX under NSN 5962-01-262-1279 of Microcircuit Memory manufactured by Texas Instrument Inc, Integrated Device Technology Inc, Advanced Micro Devices Inc, Dla Land And Maritime.
Federal Supply Class of NSN 5962-01-262-1279 is FSC 5962 contains part details of Microcircuits Electronic. Quote for your desired part numbers.
Part Number's List for NSN 5962-01-262-1279, 5962012621279
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Part No Manufacturer Item Name QTY RFQ SMJ64C16L-45JDM Texas Instrument Inc microcircuit memory Avl RFQ IDT6168LA45DB Integrated Device Technology Inc microcircuit memory Avl RFQ AM99C68-55 BRA Advanced Micro Devices Inc microcircuit memory Avl RFQ 5962-8670506RA Dla Land And Maritime microcircuit memory Avl RFQ 5962-8670506BRX Dla Land And Maritime microcircuit memory Avl RFQ 5962-8670506BRB Dla Land And Maritime microcircuit memory Avl RFQ 5962-8670506BRA Dla Land And Maritime microcircuit memory Avl RFQ 5962-86705 Dla Land And Maritime microcircuit memory Avl RFQ
Characteristics Data of NSN 5962012621279MRC Criteria Characteristic ADAQ BODY LENGTH 1.060 INCHES MAXIMUM ADAT BODY WIDTH 0.310 INCHES MAXIMUM ADAU BODY HEIGHT 0.185 INCHES MAXIMUM AEHX MAXIMUM POWER DISSIPATION RATING 1.0 WATTS AFGA OPERATING TEMP RANGE -55.0/+125.0 DEG CELSIUS AFJQ STORAGE TEMP RANGE -65.0/+150.0 DEG CELSIUS CBBL FEATURES PROVIDED MONOLITHIC AND STATIC OPERATION CQSJ INCLOSURE MATERIAL METAL OR CERAMIC OR PLASTIC CQSZ INCLOSURE CONFIGURATION DUAL-IN-LINE CQWX OUTPUT LOGIC FORM COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC CQZP INPUT CIRCUIT PATTERN 18 INPUT CTFT CASE OUTLINE SOURCE AND DESIGNATOR D-8 MIL-M-38510 CWSG TERMINAL SURFACE TREATMENT SOLDER CZEN VOLTAGE RATING AND TYPE PER CHARACTERISTIC 7.0 VOLTS MAXIMUM POWER SOURCE CZER MEMORY DEVICE TYPE RAM TEST TEST DATA DOCUMENT 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). TTQY TERMINAL TYPE AND QUANTITY 20 PRINTED CIRCUIT
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 1.060 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.310 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.185 INCHES MAXIMUM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 1.0 WATTS |
| AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | MONOLITHIC AND STATIC OPERATION |
| CQSJ | INCLOSURE MATERIAL | METAL OR CERAMIC OR PLASTIC |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | 18 INPUT |
| CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | D-8 MIL-M-38510 |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 7.0 VOLTS MAXIMUM POWER SOURCE |
| CZER | MEMORY DEVICE TYPE | RAM |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| TTQY | TERMINAL TYPE AND QUANTITY | 20 PRINTED CIRCUIT |