NSN 5962-01-262-2716 of Microcircuit Memory - Parts Details
Alternative NSN: 5962012622716 |
Item Name: Microcircuit Memory |
FSG: 59 Electrical and Electronic Equipment Components |
Federal Supply Class (FSC): 5962 Microcircuits Electronic |
NIIN: 012622716 |
NCB Code: USA (01) |
Manufacturers: Dla Land And Maritime , Mmi Amd , Texas Instrument Inc |
ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is the latest parts procurement platform for the aerospace and aviation industry. Check out high demanding part numbers 5962-85155, 5962-85155042A, 5962-85155042B, 5962-85155042X, PAL16R4BPML883B under NSN 5962-01-262-2716 of Microcircuit Memory manufactured by Dla Land And Maritime, Mmi Amd, Texas Instrument Inc.
Federal Supply Class of NSN 5962-01-262-2716 is FSC 5962 contains part details of Microcircuits Electronic. Quote for your desired part numbers.
Part Number's List for NSN 5962-01-262-2716, 5962012622716
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Part No Manufacturer Item Name QTY RFQ 5962-85155 Dla Land And Maritime microcircuit memory Avl RFQ 5962-85155042A Dla Land And Maritime microcircuit memory Avl RFQ 5962-85155042B Dla Land And Maritime microcircuit memory Avl RFQ 5962-85155042X Dla Land And Maritime microcircuit memory Avl RFQ PAL16R4BPML883B Mmi Amd microcircuit memory Avl RFQ TIBPAL16R4-20MFKB Texas Instrument Inc microcircuit memory Avl RFQ
Characteristics Data of NSN 5962012622716MRC Criteria Characteristic ADAQ BODY LENGTH 0.350 INCHES MAXIMUM ADAT BODY WIDTH 0.350 INCHES MAXIMUM AEHX MAXIMUM POWER DISSIPATION RATING 1.0 WATTS AFGA OPERATING TEMP RANGE -55.0/+125.0 DEG CELSIUS AFJQ STORAGE TEMP RANGE -65.0/+150.0 DEG CELSIUS CBBL FEATURES PROVIDED HERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND BIPOLAR CQSJ INCLOSURE MATERIAL CERAMIC CQSZ INCLOSURE CONFIGURATION LEADLESS FLAT PACK CQWX OUTPUT LOGIC FORM TRANSISTOR-TRANSISTOR LOGIC CQZP INPUT CIRCUIT PATTERN 16 INPUT CTFT CASE OUTLINE SOURCE AND DESIGNATOR C-2 MIL-M-38510 CWSG TERMINAL SURFACE TREATMENT SOLDER CZEN VOLTAGE RATING AND TYPE PER CHARACTERISTIC 7.0 VOLTS MAXIMUM POWER SOURCE CZER MEMORY DEVICE TYPE PAL TEST TEST DATA DOCUMENT 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). TTQY TERMINAL TYPE AND QUANTITY 20 LEADLESS
MRC | Criteria | Characteristic |
---|---|---|
ADAQ | BODY LENGTH | 0.350 INCHES MAXIMUM |
ADAT | BODY WIDTH | 0.350 INCHES MAXIMUM |
AEHX | MAXIMUM POWER DISSIPATION RATING | 1.0 WATTS |
AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND BIPOLAR |
CQSJ | INCLOSURE MATERIAL | CERAMIC |
CQSZ | INCLOSURE CONFIGURATION | LEADLESS FLAT PACK |
CQWX | OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
CQZP | INPUT CIRCUIT PATTERN | 16 INPUT |
CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | C-2 MIL-M-38510 |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 7.0 VOLTS MAXIMUM POWER SOURCE |
CZER | MEMORY DEVICE TYPE | PAL |
TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
TTQY | TERMINAL TYPE AND QUANTITY | 20 LEADLESS |