NSN 5962-01-263-5904 of Microcircuit Digital - Parts Details
| Alternative NSN: 5962012635904 |
| Item Name: Microcircuit Digital |
| FSG: 59 Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC): 5962 Microcircuits Electronic |
| NIIN: 012635904 |
| NCB Code: USA (01) |
| Manufacturers: Texas Instrument Inc , Dla Land And Maritime , National Semiconductor Corp , Philips Semiconductors Inc , Raytheon Aircraft |
ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is the latest parts procurement platform for the aerospace and aviation industry. Check out high demanding part numbers SNJ54ALS161BFK, 83022012X, 83022012B, 83022012A, 83022 under NSN 5962-01-263-5904 of Microcircuit Digital manufactured by Texas Instrument Inc, Dla Land And Maritime, National Semiconductor Corp, Philips Semiconductors Inc, Raytheon Aircraft.
Federal Supply Class of NSN 5962-01-263-5904 is FSC 5962 contains part details of Microcircuits Electronic. Quote for your desired part numbers.
Part Number's List for NSN 5962-01-263-5904, 5962012635904
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Part No Manufacturer Item Name QTY RFQ SNJ54ALS161BFK Texas Instrument Inc microcircuit digital Avl RFQ 83022012X Dla Land And Maritime microcircuit digital Avl RFQ 83022012B Dla Land And Maritime microcircuit digital Avl RFQ 83022012A Dla Land And Maritime microcircuit digital Avl RFQ 83022 Dla Land And Maritime microcircuit digital Avl RFQ 54ALS161BE 883 National Semiconductor Corp microcircuit digital Avl RFQ 54ALS161 B2A Philips Semiconductors Inc microcircuit digital Avl RFQ 2690550-2 Raytheon Aircraft microcircuit digital Avl RFQ
Characteristics Data of NSN 5962012635904MRC Criteria Characteristic ADAQ BODY LENGTH 0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM ADAT BODY WIDTH 0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM ADAU BODY HEIGHT 0.064 INCHES MINIMUM AND 0.100 INCHES MAXIMUM AEHX MAXIMUM POWER DISSIPATION RATING 115.5 MILLIWATTS AFGA OPERATING TEMP RANGE -55.0/+125.0 DEG CELSIUS AFJQ STORAGE TEMP RANGE -65.0/+150.0 DEG CELSIUS CBBL FEATURES PROVIDED LOW POWER AND SCHOTTKY AND ASYNCHRONOUS AND W/CLEAR AND W/CLOCK CQSJ INCLOSURE MATERIAL CERAMIC CQSZ INCLOSURE CONFIGURATION LEADLESS FLAT PACK CQWX OUTPUT LOGIC FORM TRANSISTOR-TRANSISTOR LOGIC CQZP INPUT CIRCUIT PATTERN 9 INPUT CSSL DESIGN FUNCTION AND QUANTITY 1 COUNTER, BINARY CTFT CASE OUTLINE SOURCE AND DESIGNATOR C-2 MIL-M-38510 CTQX CURRENT RATING PER CHARACTERISTIC 21.00 MILLIAMPERES MAXIMUM SUPPLY CWSG TERMINAL SURFACE TREATMENT SOLDER CZEN VOLTAGE RATING AND TYPE PER CHARACTERISTIC 7.0 VOLTS MAXIMUM TOTAL SUPPLY FEAT SPECIAL FEATURES NUCLEAR HARDNESS CRITICAL ITEMS NHCF NUCLEAR HARDNESS CRITICAL FEATURE HARDENED TEST TEST DATA DOCUMENT 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.064 INCHES MINIMUM AND 0.100 INCHES MAXIMUM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 115.5 MILLIWATTS |
| AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | LOW POWER AND SCHOTTKY AND ASYNCHRONOUS AND W/CLEAR AND W/CLOCK |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CQSZ | INCLOSURE CONFIGURATION | LEADLESS FLAT PACK |
| CQWX | OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | 9 INPUT |
| CSSL | DESIGN FUNCTION AND QUANTITY | 1 COUNTER, BINARY |
| CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | C-2 MIL-M-38510 |
| CTQX | CURRENT RATING PER CHARACTERISTIC | 21.00 MILLIAMPERES MAXIMUM SUPPLY |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 7.0 VOLTS MAXIMUM TOTAL SUPPLY |
| FEAT | SPECIAL FEATURES | NUCLEAR HARDNESS CRITICAL ITEMS |
| NHCF | NUCLEAR HARDNESS CRITICAL FEATURE | HARDENED |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |