NSN 5962-01-264-3010 of Microcircuit Memory - Parts Details
Alternative NSN: 5962012643010 |
Item Name: Microcircuit Memory |
FSG: 59 Electrical and Electronic Equipment Components |
Federal Supply Class (FSC): 5962 Microcircuits Electronic |
NIIN: 012643010 |
NCB Code: USA (01) |
Manufacturers: Dla Land And Maritime , Texas Instrument Inc , Mmi Amd , Advanced Micro Devices Inc |
ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is the latest parts procurement platform for the aerospace and aviation industry. Check out high demanding part numbers ROM PROM HEAD 245, PAL16R4AMWB, PAL16R4AMW 883B, AMPAL16R4A BSA, 8103610SX under NSN 5962-01-264-3010 of Microcircuit Memory manufactured by Dla Land And Maritime, Texas Instrument Inc, Mmi Amd, Advanced Micro Devices Inc.
Federal Supply Class of NSN 5962-01-264-3010 is FSC 5962 contains part details of Microcircuits Electronic. Quote for your desired part numbers.
Part Number's List for NSN 5962-01-264-3010, 5962012643010
-
Part No Manufacturer Item Name QTY RFQ ROM PROM HEAD 245 Dla Land And Maritime microcircuit memory Avl RFQ PAL16R4AMWB Texas Instrument Inc microcircuit memory Avl RFQ PAL16R4AMW 883B Mmi Amd microcircuit memory Avl RFQ AMPAL16R4A BSA Advanced Micro Devices Inc microcircuit memory Avl RFQ 8103610SX Dla Land And Maritime microcircuit memory Avl RFQ 8103610SB Dla Land And Maritime microcircuit memory Avl RFQ 8103610SA Dla Land And Maritime microcircuit memory Avl RFQ 81036 Dla Land And Maritime microcircuit memory Avl RFQ
Characteristics Data of NSN 5962012643010MRC Criteria Characteristic ADAQ BODY LENGTH 0.540 INCHES MAXIMUM ADAT BODY WIDTH 0.300 INCHES MAXIMUM ADAU BODY HEIGHT 0.092 INCHES MAXIMUM AEHX MAXIMUM POWER DISSIPATION RATING 1.0 WATTS AFGA OPERATING TEMP RANGE -55.0/+125.0 DEG CELSIUS AFJQ STORAGE TEMP RANGE -65.0/+150.0 DEG CELSIUS CBBL FEATURES PROVIDED HERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND POSITIVE OUTPUTS CQSJ INCLOSURE MATERIAL CERAMIC CQSZ INCLOSURE CONFIGURATION FLAT PACK CQWX OUTPUT LOGIC FORM TRANSISTOR-TRANSISTOR LOGIC CQZP INPUT CIRCUIT PATTERN 14 INPUT CTFT CASE OUTLINE SOURCE AND DESIGNATOR F-9 MIL-M-38510 CTQX CURRENT RATING PER CHARACTERISTIC 100.00 MILLIAMPERES FORWARD CURRENT, MAXIMUM PEAK TOTAL VALUE NOT APPLICABLE CWSG TERMINAL SURFACE TREATMENT SOLDER CZEN VOLTAGE RATING AND TYPE PER CHARACTERISTIC -0.5 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE CZEQ TIME RATING PER CHACTERISTIC 30.00 NANOSECONDS MAXIMUM DELAY CZER MEMORY DEVICE TYPE PAL TEST TEST DATA DOCUMENT 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). TTQY TERMINAL TYPE AND QUANTITY 20 FLAT LEADS
MRC | Criteria | Characteristic |
---|---|---|
ADAQ | BODY LENGTH | 0.540 INCHES MAXIMUM |
ADAT | BODY WIDTH | 0.300 INCHES MAXIMUM |
ADAU | BODY HEIGHT | 0.092 INCHES MAXIMUM |
AEHX | MAXIMUM POWER DISSIPATION RATING | 1.0 WATTS |
AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND POSITIVE OUTPUTS |
CQSJ | INCLOSURE MATERIAL | CERAMIC |
CQSZ | INCLOSURE CONFIGURATION | FLAT PACK |
CQWX | OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
CQZP | INPUT CIRCUIT PATTERN | 14 INPUT |
CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | F-9 MIL-M-38510 |
CTQX | CURRENT RATING PER CHARACTERISTIC | 100.00 MILLIAMPERES FORWARD CURRENT, MAXIMUM PEAK TOTAL VALUE NOT APPLICABLE |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -0.5 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE |
CZEQ | TIME RATING PER CHACTERISTIC | 30.00 NANOSECONDS MAXIMUM DELAY |
CZER | MEMORY DEVICE TYPE | PAL |
TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
TTQY | TERMINAL TYPE AND QUANTITY | 20 FLAT LEADS |