NSN 5962-01-273-4254 of Microcircuit Memory - Parts Details
Alternative NSN: 5962012734254 |
Item Name: Microcircuit Memory |
FSG: 59 Electrical and Electronic Equipment Components |
Federal Supply Class (FSC): 5962 Microcircuits Electronic |
NIIN: 012734254 |
NCB Code: USA (01) |
Manufacturers: Mmi Amd , Texas Instrument Inc , Dla Land And Maritime |
ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is the latest parts procurement platform for the aerospace and aviation industry. Check out high demanding part numbers 5309-1J883B, JBP18S22MJ, ROM PROM FAMILY 010 under NSN 5962-01-273-4254 of Microcircuit Memory manufactured by Mmi Amd, Texas Instrument Inc, Dla Land And Maritime.
Federal Supply Class of NSN 5962-01-273-4254 is FSC 5962 contains part details of Microcircuits Electronic. Quote for your desired part numbers.
Part Number's List for NSN 5962-01-273-4254, 5962012734254
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Part No Manufacturer Item Name QTY RFQ 5309-1J883B Mmi Amd microcircuit memory Avl RFQ JBP18S22MJ Texas Instrument Inc microcircuit memory Avl RFQ ROM PROM FAMILY 010 Dla Land And Maritime microcircuit memory Avl RFQ
Characteristics Data of NSN 5962012734254MRC Criteria Characteristic ADAU BODY HEIGHT 0.180 INCHES MAXIMUM CTQX CURRENT RATING PER CHARACTERISTIC 155.00 MILLIAMPERES MAXIMUM SUPPLY CQSZ INCLOSURE CONFIGURATION DUAL-IN-LINE CQWX OUTPUT LOGIC FORM TRANSISTOR-TRANSISTOR LOGIC CRHL (NON-CORE DATA) BIT QUANTITY 2048 CZEQ TIME RATING PER CHACTERISTIC 35.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 35.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT CSWJ (NON-CORE DATA) WORD QUANTITY 256 ADAQ BODY LENGTH 0.930 INCHES MINIMUM AND 0.975 INCHES MAXIMUM CQSJ INCLOSURE MATERIAL CERAMIC AND GLASS CZEN VOLTAGE RATING AND TYPE PER CHARACTERISTIC 4.5 VOLTS MINIMUM POWER SOURCE AND 5.5 VOLTS MAXIMUM POWER SOURCE CZER MEMORY DEVICE TYPE PROM ADAT BODY WIDTH 0.245 INCHES MINIMUM AND 0.300 INCHES MAXIMUM AFGA OPERATING TEMP RANGE 55.0/+125.0 DEG CELSIUS AFJQ STORAGE TEMP RANGE -65.0/+150.0 DEG CELSIUS CBBL FEATURES PROVIDED PROGRAMMABLE AND SCHOTTKY AND LOW CURRENT CQZP INPUT CIRCUIT PATTERN 10 INPUT CWSG TERMINAL SURFACE TREATMENT SOLDER TEST TEST DATA DOCUMENT 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). TTQY TERMINAL TYPE AND QUANTITY 18 PRINTED CIRCUIT
MRC | Criteria | Characteristic |
---|---|---|
ADAU | BODY HEIGHT | 0.180 INCHES MAXIMUM |
CTQX | CURRENT RATING PER CHARACTERISTIC | 155.00 MILLIAMPERES MAXIMUM SUPPLY |
CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
CQWX | OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
CRHL | (NON-CORE DATA) BIT QUANTITY | 2048 |
CZEQ | TIME RATING PER CHACTERISTIC | 35.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 35.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
CSWJ | (NON-CORE DATA) WORD QUANTITY | 256 |
ADAQ | BODY LENGTH | 0.930 INCHES MINIMUM AND 0.975 INCHES MAXIMUM |
CQSJ | INCLOSURE MATERIAL | CERAMIC AND GLASS |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 4.5 VOLTS MINIMUM POWER SOURCE AND 5.5 VOLTS MAXIMUM POWER SOURCE |
CZER | MEMORY DEVICE TYPE | PROM |
ADAT | BODY WIDTH | 0.245 INCHES MINIMUM AND 0.300 INCHES MAXIMUM |
AFGA | OPERATING TEMP RANGE | 55.0/+125.0 DEG CELSIUS |
AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
CBBL | FEATURES PROVIDED | PROGRAMMABLE AND SCHOTTKY AND LOW CURRENT |
CQZP | INPUT CIRCUIT PATTERN | 10 INPUT |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
TTQY | TERMINAL TYPE AND QUANTITY | 18 PRINTED CIRCUIT |