NSN 5962-01-273-6754 of Microcircuit Memory - Parts Details
| Alternative NSN: 5962012736754 |
| Item Name: Microcircuit Memory |
| FSG: 59 Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC): 5962 Microcircuits Electronic |
| NIIN: 012736754 |
| NCB Code: USA (01) |
| Manufacturers: Dla Land And Maritime , Texas Instrument Inc , Mmi Amd |
ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is the latest parts procurement platform for the aerospace and aviation industry. Check out high demanding part numbers ROM PROM FAMILY 010, JBP18S22MJ, 5309-1J883B under NSN 5962-01-273-6754 of Microcircuit Memory manufactured by Dla Land And Maritime, Texas Instrument Inc, Mmi Amd.
Federal Supply Class of NSN 5962-01-273-6754 is FSC 5962 contains part details of Microcircuits Electronic. Quote for your desired part numbers.
Part Number's List for NSN 5962-01-273-6754, 5962012736754
-
Part No Manufacturer Item Name QTY RFQ ROM PROM FAMILY 010 Dla Land And Maritime microcircuit memory Avl RFQ JBP18S22MJ Texas Instrument Inc microcircuit memory Avl RFQ 5309-1J883B Mmi Amd microcircuit memory Avl RFQ
Characteristics Data of NSN 5962012736754MRC Criteria Characteristic CZER MEMORY DEVICE TYPE PROM ADAQ BODY LENGTH 0.930 INCHES MINIMUM AND 0.975 INCHES MAXIMUM CSWJ (NON-CORE DATA) WORD QUANTITY 256 CRHL (NON-CORE DATA) BIT QUANTITY 2048 ADAT BODY WIDTH 0.245 INCHES MINIMUM AND 0.300 INCHES MAXIMUM ADAU BODY HEIGHT 0.180 INCHES MAXIMUM CTQX CURRENT RATING PER CHARACTERISTIC 155.00 MILLIAMPERES MAXIMUM SUPPLY AFGA OPERATING TEMP RANGE -55.0 TO 125.0 DEG CELSIUS CQSJ INCLOSURE MATERIAL CERAMIC AND GLASS CQWX OUTPUT LOGIC FORM TRANSISTOR-TRANSISTOR LOGIC CQZP INPUT CIRCUIT PATTERN 10 INPUT TEST TEST DATA DOCUMENT 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). TTQY TERMINAL TYPE AND QUANTITY 18 PRINTED CIRCUIT AFJQ STORAGE TEMP RANGE -65.0/+150.0 DEG CELSIUS CBBL FEATURES PROVIDED PROGRAMMABLE AND SCHOTTKY AND LOW CURRENT CQSZ INCLOSURE CONFIGURATION DUAL-IN-LINE CWSG TERMINAL SURFACE TREATMENT SOLDER CZEQ TIME RATING PER CHACTERISTIC 35.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 35.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT CZEN VOLTAGE RATING AND TYPE PER CHARACTERISTIC 4.5 VOLTS MINIMUM POWER SOURCE AND 55.5 VOLTS MAXIMUM POWER SOURCE
| MRC | Criteria | Characteristic |
|---|---|---|
| CZER | MEMORY DEVICE TYPE | PROM |
| ADAQ | BODY LENGTH | 0.930 INCHES MINIMUM AND 0.975 INCHES MAXIMUM |
| CSWJ | (NON-CORE DATA) WORD QUANTITY | 256 |
| CRHL | (NON-CORE DATA) BIT QUANTITY | 2048 |
| ADAT | BODY WIDTH | 0.245 INCHES MINIMUM AND 0.300 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.180 INCHES MAXIMUM |
| CTQX | CURRENT RATING PER CHARACTERISTIC | 155.00 MILLIAMPERES MAXIMUM SUPPLY |
| AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS |
| CQSJ | INCLOSURE MATERIAL | CERAMIC AND GLASS |
| CQWX | OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | 10 INPUT |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| TTQY | TERMINAL TYPE AND QUANTITY | 18 PRINTED CIRCUIT |
| AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | PROGRAMMABLE AND SCHOTTKY AND LOW CURRENT |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEQ | TIME RATING PER CHACTERISTIC | 35.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 35.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 4.5 VOLTS MINIMUM POWER SOURCE AND 55.5 VOLTS MAXIMUM POWER SOURCE |