NSN 5962-01-274-7927 of Microcircuit Memory - Parts Details
| Alternative NSN: 5962012747927 |
| Item Name: Microcircuit Memory |
| FSG: 59 Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC): 5962 Microcircuits Electronic |
| NIIN: 012747927 |
| NCB Code: USA (01) |
| Manufacturers: Xicor Inc , Honeywell International Inc , Hamilton Sundstrand Corporation , Dla Land And Maritime , Paeaeesikunta Logistiikkaosasto |
ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is the latest parts procurement platform for the aerospace and aviation industry. Check out high demanding part numbers X20C04EMB-25, X2004EMB-25, X2004EM-25 C6317, 8507005-255, 795099-1 under NSN 5962-01-274-7927 of Microcircuit Memory manufactured by Xicor Inc, Honeywell International Inc, Hamilton Sundstrand Corporation, Dla Land And Maritime, Paeaeesikunta Logistiikkaosasto.
Federal Supply Class of NSN 5962-01-274-7927 is FSC 5962 contains part details of Microcircuits Electronic. Quote for your desired part numbers.
Part Number's List for NSN 5962-01-274-7927, 5962012747927
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Part No Manufacturer Item Name QTY RFQ X20C04EMB-25 Xicor Inc microcircuit memory Avl RFQ X2004EMB-25 Xicor Inc microcircuit memory Avl RFQ X2004EM-25 C6317 Xicor Inc microcircuit memory Avl RFQ 8507005-255 Honeywell International Inc microcircuit memory Avl RFQ 795099-1 Hamilton Sundstrand Corporation microcircuit memory Avl RFQ 5R8067-042-3002 Hamilton Sundstrand Corporation microcircuit memory Avl RFQ 5962-8771201YA Dla Land And Maritime microcircuit memory Avl RFQ 10133817 Paeaeesikunta Logistiikkaosasto microcircuit memory Avl RFQ
Characteristics Data of NSN 5962012747927MRC Criteria Characteristic ADAQ BODY LENGTH 0.560 INCHES MAXIMUM ADAT BODY WIDTH 0.458 INCHES MAXIMUM ADAU BODY HEIGHT 0.085 INCHES MAXIMUM AFGA OPERATING TEMP RANGE -55.0/+125.0 DEG CELSIUS AFJQ STORAGE TEMP RANGE -65.0/+150.0 DEG CELSIUS CBBL FEATURES PROVIDED ELECTROSTATIC SENSITIVE AND HERMETICALLY SEALED AND BURN IN AND BIDIRECTIONAL CQSJ INCLOSURE MATERIAL CERAMIC CQSZ INCLOSURE CONFIGURATION LEADLESS FLAT PACK CQWX OUTPUT LOGIC FORM TRANSISTOR-TRANSISTOR LOGIC CQZP INPUT CIRCUIT PATTERN 21 INPUT CWSG TERMINAL SURFACE TREATMENT SOLDER CZEN VOLTAGE RATING AND TYPE PER CHARACTERISTIC 7.0 VOLTS MAXIMUM POWER SOURCE CZEQ TIME RATING PER CHACTERISTIC 250.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 250.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT CZER MEMORY DEVICE TYPE RAM TEST TEST DATA DOCUMENT 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). TTQY TERMINAL TYPE AND QUANTITY 32 LEADLESS
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 0.560 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.458 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.085 INCHES MAXIMUM |
| AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | ELECTROSTATIC SENSITIVE AND HERMETICALLY SEALED AND BURN IN AND BIDIRECTIONAL |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CQSZ | INCLOSURE CONFIGURATION | LEADLESS FLAT PACK |
| CQWX | OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | 21 INPUT |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 7.0 VOLTS MAXIMUM POWER SOURCE |
| CZEQ | TIME RATING PER CHACTERISTIC | 250.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 250.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
| CZER | MEMORY DEVICE TYPE | RAM |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| TTQY | TERMINAL TYPE AND QUANTITY | 32 LEADLESS |