NSN 5962-01-277-7139 of Microcircuit Memory - Parts Details
| Alternative NSN: 5962012777139 |
| Item Name: Microcircuit Memory |
| FSG: 59 Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC): 5962 Microcircuits Electronic |
| NIIN: 012777139 |
| NCB Code: USA (01) |
| Manufacturers: Dla Land And Maritime , Advanced Micro Devices Inc , Raytheon Aircraft |
ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is the latest parts procurement platform for the aerospace and aviation industry. Check out high demanding part numbers ROM PROM FAMILY 108, AM27S191ALMC, 795389-2, 2802887-1 under NSN 5962-01-277-7139 of Microcircuit Memory manufactured by Dla Land And Maritime, Advanced Micro Devices Inc, Raytheon Aircraft.
Federal Supply Class of NSN 5962-01-277-7139 is FSC 5962 contains part details of Microcircuits Electronic. Quote for your desired part numbers.
Part Number's List for NSN 5962-01-277-7139, 5962012777139
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Part No Manufacturer Item Name QTY RFQ ROM PROM FAMILY 108 Dla Land And Maritime microcircuit memory Avl RFQ AM27S191ALMC Advanced Micro Devices Inc microcircuit memory Avl RFQ 795389-2 Raytheon Aircraft microcircuit memory Avl RFQ 2802887-1 Raytheon Aircraft microcircuit memory Avl RFQ
Characteristics Data of NSN 5962012777139MRC Criteria Characteristic ADAQ BODY LENGTH 0.540 INCHES MINIMUM AND 0.560 INCHES MAXIMUM ADAT BODY WIDTH 0.442 INCHES MINIMUM AND 0.458 INCHES MAXIMUM ADAU BODY HEIGHT 0.060 INCHES MINIMUM AND 0.120 INCHES MAXIMUM AFGA OPERATING TEMP RANGE -55.0 TO 125.0 DEG CELSIUS AFJQ STORAGE TEMP RANGE -65.0 TO 150.0 DEG CELSIUS CBBL FEATURES PROVIDED HERMETICALLY SEALED AND PROGRAMMABLE AND SCHOTTKY AND 3-STATE OUTPUT AND POSITIVE OUTPUTS CQSJ INCLOSURE MATERIAL CERAMIC CQSZ INCLOSURE CONFIGURATION LEADLESS FLAT PACK CQWX OUTPUT LOGIC FORM TRANSISTOR-TRANSISTOR LOGIC CQZP INPUT CIRCUIT PATTERN 14 INPUT CWSG TERMINAL SURFACE TREATMENT SOLDER CZEN VOLTAGE RATING AND TYPE PER CHARACTERISTIC 5.0 VOLTS MAXIMUM POWER SOURCE CZEQ TIME RATING PER CHACTERISTIC 35.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 35.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT CZER MEMORY DEVICE TYPE ROM TTQY TERMINAL TYPE AND QUANTITY 32 LEADLESS
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 0.540 INCHES MINIMUM AND 0.560 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.442 INCHES MINIMUM AND 0.458 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.060 INCHES MINIMUM AND 0.120 INCHES MAXIMUM |
| AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND PROGRAMMABLE AND SCHOTTKY AND 3-STATE OUTPUT AND POSITIVE OUTPUTS |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CQSZ | INCLOSURE CONFIGURATION | LEADLESS FLAT PACK |
| CQWX | OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | 14 INPUT |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 5.0 VOLTS MAXIMUM POWER SOURCE |
| CZEQ | TIME RATING PER CHACTERISTIC | 35.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 35.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
| CZER | MEMORY DEVICE TYPE | ROM |
| TTQY | TERMINAL TYPE AND QUANTITY | 32 LEADLESS |