NSN 5962-01-277-7145 of Microcircuit Digital - Parts Details
| Alternative NSN: 5962012777145 |
| Item Name: Microcircuit Digital |
| FSG: 59 Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC): 5962 Microcircuits Electronic |
| NIIN: 012777145 |
| NCB Code: USA (01) |
| Manufacturers: Texas Instrument Inc , Philips Semiconductors Inc , National Semiconductor Corp , L 3 Services Inc , Titan Corp The , Fairchild Semiconductor Corp |
ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is the latest parts procurement platform for the aerospace and aviation industry. Check out high demanding part numbers SNJ5437W, S5437W 883B, DM5437W 883B, 985104-037, 5437FMQB under NSN 5962-01-277-7145 of Microcircuit Digital manufactured by Texas Instrument Inc, Philips Semiconductors Inc, National Semiconductor Corp, L 3 Services Inc, Titan Corp The.
Federal Supply Class of NSN 5962-01-277-7145 is FSC 5962 contains part details of Microcircuits Electronic. Quote for your desired part numbers.
Part Number's List for NSN 5962-01-277-7145, 5962012777145
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Part No Manufacturer Item Name QTY RFQ SNJ5437W Texas Instrument Inc microcircuit digital Avl RFQ S5437W 883B Philips Semiconductors Inc microcircuit digital Avl RFQ DM5437W 883B National Semiconductor Corp microcircuit digital Avl RFQ 985104-037 L 3 Services Inc microcircuit digital Avl RFQ 985104-037 Titan Corp The microcircuit digital Avl RFQ 5437FMQB Fairchild Semiconductor Corp microcircuit digital Avl RFQ
Characteristics Data of NSN 5962012777145MRC Criteria Characteristic ADAQ BODY LENGTH 0.337 INCHES MINIMUM AND 0.350 INCHES MAXIMUM ADAT BODY WIDTH 0.235 INCHES MINIMUM AND 0.265 INCHES MAXIMUM ADAU BODY HEIGHT 0.050 INCHES MINIMUM AND 0.080 INCHES MAXIMUM AEHX MAXIMUM POWER DISSIPATION RATING 10.0 MILLIWATTS AFGA OPERATING TEMP RANGE -55.0/+125.0 DEG CELSIUS AFJQ STORAGE TEMP RANGE -65.0/+150.0 DEG CELSIUS CBBL FEATURES PROVIDED HERMETICALLY SEALED AND BURN IN AND W/TOTEM POLE OUTPUT AND POSITIVE OUTPUTS CQSJ INCLOSURE MATERIAL CERAMIC CQSZ INCLOSURE CONFIGURATION FLAT PACK CQWX OUTPUT LOGIC FORM TRANSISTOR-TRANSISTOR LOGIC CQZP INPUT CIRCUIT PATTERN QUAD 2 INPUT CSSL DESIGN FUNCTION AND QUANTITY 4 BUFFER, NAND CTFT CASE OUTLINE SOURCE AND DESIGNATOR MO-004AA JOINT ELECTRON DEVICE ENGINEERING COUNCIL CZEQ TIME RATING PER CHACTERISTIC 22.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 15.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT TEST TEST DATA DOCUMENT 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 0.337 INCHES MINIMUM AND 0.350 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.235 INCHES MINIMUM AND 0.265 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.050 INCHES MINIMUM AND 0.080 INCHES MAXIMUM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 10.0 MILLIWATTS |
| AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN AND W/TOTEM POLE OUTPUT AND POSITIVE OUTPUTS |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CQSZ | INCLOSURE CONFIGURATION | FLAT PACK |
| CQWX | OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | QUAD 2 INPUT |
| CSSL | DESIGN FUNCTION AND QUANTITY | 4 BUFFER, NAND |
| CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | MO-004AA JOINT ELECTRON DEVICE ENGINEERING COUNCIL |
| CZEQ | TIME RATING PER CHACTERISTIC | 22.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 15.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |