NSN 5962-01-282-0588 of Microcircuit Digital - Parts Details
| Alternative NSN: 5962012820588 |
| Item Name: Microcircuit Digital |
| FSG: 59 Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC): 5962 Microcircuits Electronic |
| NIIN: 012820588 |
| NCB Code: USA (01) |
| Manufacturers: Texas Instrument Inc , Philips Semiconductors Inc , Freescale Semiconductor Inc , National Semiconductor Corp , Fairchild Semiconductor Corp |
ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is the latest parts procurement platform for the aerospace and aviation industry. Check out high demanding part numbers SNJ54174W, S54174W883B, MC54174BFBS, DM54174W 883B, 54174FMQB under NSN 5962-01-282-0588 of Microcircuit Digital manufactured by Texas Instrument Inc, Philips Semiconductors Inc, Freescale Semiconductor Inc, National Semiconductor Corp, Fairchild Semiconductor Corp.
Federal Supply Class of NSN 5962-01-282-0588 is FSC 5962 contains part details of Microcircuits Electronic. Quote for your desired part numbers.
Part Number's List for NSN 5962-01-282-0588, 5962012820588
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Part No Manufacturer Item Name QTY RFQ SNJ54174W Texas Instrument Inc microcircuit digital Avl RFQ S54174W883B Philips Semiconductors Inc microcircuit digital Avl RFQ MC54174BFBS Freescale Semiconductor Inc microcircuit digital Avl RFQ DM54174W 883B National Semiconductor Corp microcircuit digital Avl RFQ 54174FMQB Fairchild Semiconductor Corp microcircuit digital Avl RFQ
Characteristics Data of NSN 5962012820588MRC Criteria Characteristic ADAQ BODY LENGTH 0.371 INCHES MINIMUM AND 0.400 INCHES MAXIMUM ADAT BODY WIDTH 0.247 INCHES MINIMUM AND 0.285 INCHES MAXIMUM ADAU BODY HEIGHT 0.050 INCHES MINIMUM AND 0.080 INCHES MAXIMUM AFGA OPERATING TEMP RANGE -55.0/+125.0 DEG CELSIUS AFJQ STORAGE TEMP RANGE -65.0/+150.0 DEG CELSIUS CBBL FEATURES PROVIDED HERMETICALLY SEALED AND BURN IN AND W/CLEAR AND W/CLOCK CQSJ INCLOSURE MATERIAL CERAMIC CQSZ INCLOSURE CONFIGURATION FLAT PACK CQWX OUTPUT LOGIC FORM TRANSISTOR-TRANSISTOR LOGIC CQZP INPUT CIRCUIT PATTERN 8 INPUT CSSL DESIGN FUNCTION AND QUANTITY 6 FLIP-FLOP, D-TYPE CTFT CASE OUTLINE SOURCE AND DESIGNATOR MO-001AA JOINT ELECTRON DEVICE ENGINEERING COUNCIL CWSG TERMINAL SURFACE TREATMENT SOLDER CZEN VOLTAGE RATING AND TYPE PER CHARACTERISTIC 7.0 VOLTS MAXIMUM POWER SOURCE CZEQ TIME RATING PER CHACTERISTIC 30.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 35.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT TEST TEST DATA DOCUMENT 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). TTQY TERMINAL TYPE AND QUANTITY 16 FLAT LEADS
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 0.371 INCHES MINIMUM AND 0.400 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.247 INCHES MINIMUM AND 0.285 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.050 INCHES MINIMUM AND 0.080 INCHES MAXIMUM |
| AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN AND W/CLEAR AND W/CLOCK |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CQSZ | INCLOSURE CONFIGURATION | FLAT PACK |
| CQWX | OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | 8 INPUT |
| CSSL | DESIGN FUNCTION AND QUANTITY | 6 FLIP-FLOP, D-TYPE |
| CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | MO-001AA JOINT ELECTRON DEVICE ENGINEERING COUNCIL |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 7.0 VOLTS MAXIMUM POWER SOURCE |
| CZEQ | TIME RATING PER CHACTERISTIC | 30.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 35.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| TTQY | TERMINAL TYPE AND QUANTITY | 16 FLAT LEADS |