NSN 5962-01-295-8581 of Microcircuit Memory - Parts Details
Alternative NSN: 5962012958581 |
Item Name: Microcircuit Memory |
FSG: 59 Electrical and Electronic Equipment Components |
Federal Supply Class (FSC): 5962 Microcircuits Electronic |
NIIN: 012958581 |
NCB Code: USA (01) |
Manufacturers: Bae Systems , Advanced Micro Devices Inc , Thales Avionics |
ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is the latest parts procurement platform for the aerospace and aviation industry. Check out high demanding part numbers MM639738-04, AM27S291A BLA, 91613883, 639738-04, 636725-03 under NSN 5962-01-295-8581 of Microcircuit Memory manufactured by Bae Systems, Advanced Micro Devices Inc, Thales Avionics.
Federal Supply Class of NSN 5962-01-295-8581 is FSC 5962 contains part details of Microcircuits Electronic. Quote for your desired part numbers.
Part Number's List for NSN 5962-01-295-8581, 5962012958581
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Part No Manufacturer Item Name QTY RFQ MM639738-04 Bae Systems microcircuit memory Avl RFQ AM27S291A BLA Advanced Micro Devices Inc microcircuit memory Avl RFQ 91613883 Thales Avionics microcircuit memory Avl RFQ 639738-04 Bae Systems microcircuit memory Avl RFQ 636725-03 Bae Systems microcircuit memory Avl RFQ
Characteristics Data of NSN 5962012958581MRC Criteria Characteristic AFJQ STORAGE TEMP RANGE -65.0 TO 150.0 DEG CELSIUS CQWX OUTPUT LOGIC FORM TRANSISTOR-TRANSISTOR LOGIC CQSZ INCLOSURE CONFIGURATION DUAL-IN-LINE AFGA OPERATING TEMP RANGE -55.0 TO 125.0 DEG CELSIUS CQSJ INCLOSURE MATERIAL CERAMIC CRHL (NON-CORE DATA) BIT QUANTITY 16384 TTQY TERMINAL TYPE AND QUANTITY 24 PRINTED CIRCUIT ADAT BODY WIDTH 0.510 INCHES MINIMUM AND 0.545 INCHES MAXIMUM CQZP INPUT CIRCUIT PATTERN 14 INPUT ADAU BODY HEIGHT 0.090 INCHES MINIMUM AND 0.210 INCHES MAXIMUM CSWJ (NON-CORE DATA) WORD QUANTITY 2048 CZER MEMORY DEVICE TYPE ROM TEST TEST DATA DOCUMENT 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). CBBL FEATURES PROVIDED PROGRAMMED CZEQ TIME RATING PER CHACTERISTIC 65.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 65.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT CZEN VOLTAGE RATING AND TYPE PER CHARACTERISTIC -0.5 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE CZZZ MEMORY CAPACITY UNKNOWN CWSG TERMINAL SURFACE TREATMENT SOLDER ADAQ BODY LENGTH 1.230 INCHES MINIMUM AND 1.285 INCHES MAXIMUM
MRC | Criteria | Characteristic |
---|---|---|
AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS |
CQWX | OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS |
CQSJ | INCLOSURE MATERIAL | CERAMIC |
CRHL | (NON-CORE DATA) BIT QUANTITY | 16384 |
TTQY | TERMINAL TYPE AND QUANTITY | 24 PRINTED CIRCUIT |
ADAT | BODY WIDTH | 0.510 INCHES MINIMUM AND 0.545 INCHES MAXIMUM |
CQZP | INPUT CIRCUIT PATTERN | 14 INPUT |
ADAU | BODY HEIGHT | 0.090 INCHES MINIMUM AND 0.210 INCHES MAXIMUM |
CSWJ | (NON-CORE DATA) WORD QUANTITY | 2048 |
CZER | MEMORY DEVICE TYPE | ROM |
TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
CBBL | FEATURES PROVIDED | PROGRAMMED |
CZEQ | TIME RATING PER CHACTERISTIC | 65.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 65.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -0.5 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE |
CZZZ | MEMORY CAPACITY | UNKNOWN |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
ADAQ | BODY LENGTH | 1.230 INCHES MINIMUM AND 1.285 INCHES MAXIMUM |