NSN 5962-01-300-7889 of Microcircuit Digital - Parts Details
| Alternative NSN: 5962013007889 |
| Item Name: Microcircuit Digital |
| FSG: 59 Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC): 5962 Microcircuits Electronic |
| NIIN: 013007889 |
| NCB Code: USA (01) |
| Manufacturers: Lsi Logic Corp , Litton Systems Inc |
ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is the latest parts procurement platform for the aerospace and aviation industry. Check out high demanding part numbers L1A3441DP84C8BCB, 7138161-701-1 under NSN 5962-01-300-7889 of Microcircuit Digital manufactured by Lsi Logic Corp, Litton Systems Inc.
Federal Supply Class of NSN 5962-01-300-7889 is FSC 5962 contains part details of Microcircuits Electronic. Quote for your desired part numbers.
Part Number's List for NSN 5962-01-300-7889, 5962013007889
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Part No Manufacturer Item Name QTY RFQ L1A3441DP84C8BCB Lsi Logic Corp microcircuit digital Avl RFQ 7138161-701-1 Litton Systems Inc microcircuit digital Avl RFQ
Characteristics Data of NSN 5962013007889MRC Criteria Characteristic ABHP OVERALL LENGTH 1.600 INCHES MAXIMUM ABKW OVERALL HEIGHT 0.150 INCHES MAXIMUM ABMK OVERALL WIDTH 1.600 INCHES MAXIMUM ADAQ BODY LENGTH 1.560 INCHES MAXIMUM ADAT BODY WIDTH 1.560 INCHES MAXIMUM ADAU BODY HEIGHT 0.150 INCHES MAXIMUM AEHX MAXIMUM POWER DISSIPATION RATING 1.0 WATTS AFGA OPERATING TEMP RANGE -55.0/+125.0 DEG CELSIUS AFJQ STORAGE TEMP RANGE -65.0/+150.0 DEG CELSIUS CBBL FEATURES PROVIDED BURN IN AND ELECTROSTATIC SENSITIVE AND MONOLITHIC CQSJ INCLOSURE MATERIAL CERAMIC CQSZ INCLOSURE CONFIGURATION FLAT PACK CQWX OUTPUT LOGIC FORM COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC CQZP INPUT CIRCUIT PATTERN 35 INPUT CSSL DESIGN FUNCTION AND QUANTITY 1 GATE, ARRAY AND 1 REGISTER, FILE CWSG TERMINAL SURFACE TREATMENT SOLDER CZEN VOLTAGE RATING AND TYPE PER CHARACTERISTIC -0.3 VOLTS MINIMUM POWER SOURCE AND 6.0 VOLTS MAXIMUM POWER SOURCE TTQY TERMINAL TYPE AND QUANTITY 196 FLAT LEADS ABHP OVERALL LENGTH 1.600 INCHES MAXIMUM ABKW OVERALL HEIGHT 0.150 INCHES MAXIMUM ABMK OVERALL WIDTH 1.600 INCHES MAXIMUM ADAQ BODY LENGTH 1.560 INCHES MAXIMUM ADAT BODY WIDTH 1.560 INCHES MAXIMUM ADAU BODY HEIGHT 0.150 INCHES MAXIMUM AEHX MAXIMUM POWER DISSIPATION RATING 1.0 WATTS AFGA OPERATING TEMP RANGE -55.0/+125.0 DEG CELSIUS AFJQ STORAGE TEMP RANGE -65.0/+150.0 DEG CELSIUS CBBL FEATURES PROVIDED BURN IN AND ELECTROSTATIC SENSITIVE AND MONOLITHIC CQSJ INCLOSURE MATERIAL CERAMIC CQSZ INCLOSURE CONFIGURATION FLAT PACK CQWX OUTPUT LOGIC FORM COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC CQZP INPUT CIRCUIT PATTERN 35 INPUT CSSL DESIGN FUNCTION AND QUANTITY 1 GATE, ARRAY AND 1 REGISTER, FILE CWSG TERMINAL SURFACE TREATMENT SOLDER CZEN VOLTAGE RATING AND TYPE PER CHARACTERISTIC -0.3 VOLTS MINIMUM POWER SOURCE AND 6.0 VOLTS MAXIMUM POWER SOURCE TTQY TERMINAL TYPE AND QUANTITY 196 FLAT LEADS ABHP OVERALL LENGTH 1.600 INCHES MAXIMUM ABKW OVERALL HEIGHT 0.150 INCHES MAXIMUM ABMK OVERALL WIDTH 1.600 INCHES MAXIMUM ADAQ BODY LENGTH 1.560 INCHES MAXIMUM ADAT BODY WIDTH 1.560 INCHES MAXIMUM ADAU BODY HEIGHT 0.150 INCHES MAXIMUM AEHX MAXIMUM POWER DISSIPATION RATING 1.0 WATTS AFGA OPERATING TEMP RANGE -55.0/+125.0 DEG CELSIUS AFJQ STORAGE TEMP RANGE -65.0/+150.0 DEG CELSIUS CBBL FEATURES PROVIDED BURN IN AND ELECTROSTATIC SENSITIVE AND MONOLITHIC CQSJ INCLOSURE MATERIAL CERAMIC CQSZ INCLOSURE CONFIGURATION FLAT PACK CQWX OUTPUT LOGIC FORM COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC CQZP INPUT CIRCUIT PATTERN 35 INPUT CSSL DESIGN FUNCTION AND QUANTITY 1 GATE, ARRAY AND 1 REGISTER, FILE CWSG TERMINAL SURFACE TREATMENT SOLDER CZEN VOLTAGE RATING AND TYPE PER CHARACTERISTIC -0.3 VOLTS MINIMUM POWER SOURCE AND 6.0 VOLTS MAXIMUM POWER SOURCE TTQY TERMINAL TYPE AND QUANTITY 196 FLAT LEADS ABHP OVERALL LENGTH 1.600 INCHES MAXIMUM ABKW OVERALL HEIGHT 0.150 INCHES MAXIMUM ABMK OVERALL WIDTH 1.600 INCHES MAXIMUM ADAQ BODY LENGTH 1.560 INCHES MAXIMUM ADAT BODY WIDTH 1.560 INCHES MAXIMUM ADAU BODY HEIGHT 0.150 INCHES MAXIMUM AEHX MAXIMUM POWER DISSIPATION RATING 1.0 WATTS AFGA OPERATING TEMP RANGE -55.0/+125.0 DEG CELSIUS AFJQ STORAGE TEMP RANGE -65.0/+150.0 DEG CELSIUS CBBL FEATURES PROVIDED BURN IN AND ELECTROSTATIC SENSITIVE AND MONOLITHIC CQSJ INCLOSURE MATERIAL CERAMIC CQSZ INCLOSURE CONFIGURATION FLAT PACK CQWX OUTPUT LOGIC FORM COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC CQZP INPUT CIRCUIT PATTERN 35 INPUT CSSL DESIGN FUNCTION AND QUANTITY 1 GATE, ARRAY AND 1 REGISTER, FILE CWSG TERMINAL SURFACE TREATMENT SOLDER CZEN VOLTAGE RATING AND TYPE PER CHARACTERISTIC -0.3 VOLTS MINIMUM POWER SOURCE AND 6.0 VOLTS MAXIMUM POWER SOURCE TTQY TERMINAL TYPE AND QUANTITY 196 FLAT LEADS
| MRC | Criteria | Characteristic |
|---|---|---|
| ABHP | OVERALL LENGTH | 1.600 INCHES MAXIMUM |
| ABKW | OVERALL HEIGHT | 0.150 INCHES MAXIMUM |
| ABMK | OVERALL WIDTH | 1.600 INCHES MAXIMUM |
| ADAQ | BODY LENGTH | 1.560 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 1.560 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.150 INCHES MAXIMUM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 1.0 WATTS |
| AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | BURN IN AND ELECTROSTATIC SENSITIVE AND MONOLITHIC |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CQSZ | INCLOSURE CONFIGURATION | FLAT PACK |
| CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | 35 INPUT |
| CSSL | DESIGN FUNCTION AND QUANTITY | 1 GATE, ARRAY AND 1 REGISTER, FILE |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -0.3 VOLTS MINIMUM POWER SOURCE AND 6.0 VOLTS MAXIMUM POWER SOURCE |
| TTQY | TERMINAL TYPE AND QUANTITY | 196 FLAT LEADS |
| ABHP | OVERALL LENGTH | 1.600 INCHES MAXIMUM |
| ABKW | OVERALL HEIGHT | 0.150 INCHES MAXIMUM |
| ABMK | OVERALL WIDTH | 1.600 INCHES MAXIMUM |
| ADAQ | BODY LENGTH | 1.560 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 1.560 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.150 INCHES MAXIMUM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 1.0 WATTS |
| AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | BURN IN AND ELECTROSTATIC SENSITIVE AND MONOLITHIC |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CQSZ | INCLOSURE CONFIGURATION | FLAT PACK |
| CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | 35 INPUT |
| CSSL | DESIGN FUNCTION AND QUANTITY | 1 GATE, ARRAY AND 1 REGISTER, FILE |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -0.3 VOLTS MINIMUM POWER SOURCE AND 6.0 VOLTS MAXIMUM POWER SOURCE |
| TTQY | TERMINAL TYPE AND QUANTITY | 196 FLAT LEADS |
| ABHP | OVERALL LENGTH | 1.600 INCHES MAXIMUM |
| ABKW | OVERALL HEIGHT | 0.150 INCHES MAXIMUM |
| ABMK | OVERALL WIDTH | 1.600 INCHES MAXIMUM |
| ADAQ | BODY LENGTH | 1.560 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 1.560 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.150 INCHES MAXIMUM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 1.0 WATTS |
| AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | BURN IN AND ELECTROSTATIC SENSITIVE AND MONOLITHIC |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CQSZ | INCLOSURE CONFIGURATION | FLAT PACK |
| CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | 35 INPUT |
| CSSL | DESIGN FUNCTION AND QUANTITY | 1 GATE, ARRAY AND 1 REGISTER, FILE |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -0.3 VOLTS MINIMUM POWER SOURCE AND 6.0 VOLTS MAXIMUM POWER SOURCE |
| TTQY | TERMINAL TYPE AND QUANTITY | 196 FLAT LEADS |
| ABHP | OVERALL LENGTH | 1.600 INCHES MAXIMUM |
| ABKW | OVERALL HEIGHT | 0.150 INCHES MAXIMUM |
| ABMK | OVERALL WIDTH | 1.600 INCHES MAXIMUM |
| ADAQ | BODY LENGTH | 1.560 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 1.560 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.150 INCHES MAXIMUM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 1.0 WATTS |
| AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | BURN IN AND ELECTROSTATIC SENSITIVE AND MONOLITHIC |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CQSZ | INCLOSURE CONFIGURATION | FLAT PACK |
| CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | 35 INPUT |
| CSSL | DESIGN FUNCTION AND QUANTITY | 1 GATE, ARRAY AND 1 REGISTER, FILE |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -0.3 VOLTS MINIMUM POWER SOURCE AND 6.0 VOLTS MAXIMUM POWER SOURCE |
| TTQY | TERMINAL TYPE AND QUANTITY | 196 FLAT LEADS |