NSN 5962-01-300-9932 of Microcircuit Digital - Parts Details
| Alternative NSN: 5962013009932 |
| Item Name: Microcircuit Digital |
| FSG: 59 Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC): 5962 Microcircuits Electronic |
| NIIN: 013009932 |
| NCB Code: USA (01) |
| Manufacturers: Mmi Amd , Litton Systems Inc |
ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is the latest parts procurement platform for the aerospace and aviation industry. Check out high demanding part numbers SN54LS469L883B, SN54LS469AL883B, 7137945-1 under NSN 5962-01-300-9932 of Microcircuit Digital manufactured by Mmi Amd, Litton Systems Inc.
Federal Supply Class of NSN 5962-01-300-9932 is FSC 5962 contains part details of Microcircuits Electronic. Quote for your desired part numbers.
Part Number's List for NSN 5962-01-300-9932, 5962013009932
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Part No Manufacturer Item Name QTY RFQ SN54LS469L883B Mmi Amd microcircuit digital Avl RFQ SN54LS469AL883B Mmi Amd microcircuit digital Avl RFQ 7137945-1 Litton Systems Inc microcircuit digital Avl RFQ
Characteristics Data of NSN 5962013009932MRC Criteria Characteristic ADAQ BODY LENGTH 0.442 INCHES MINIMUM AND 0.460 INCHES MAXIMUM ADAT BODY WIDTH 0.442 INCHES MINIMUM AND 0.460 INCHES MAXIMUM ADAU BODY HEIGHT 0.060 INCHES MINIMUM AND 0.100 INCHES MAXIMUM AFGA OPERATING TEMP RANGE -55.0/+125.0 DEG CELSIUS AFJQ STORAGE TEMP RANGE -65.0/+150.0 DEG CELSIUS CBBL FEATURES PROVIDED HERMETICALLY SEALED AND BURN IN AND ELECTROSTATIC SENSITIVE AND LOW POWER AND SCHOTTKY AND 3-STATE OUTPUT CQSJ INCLOSURE MATERIAL CERAMIC CQSZ INCLOSURE CONFIGURATION LEADLESS FLAT PACK CQZP INPUT CIRCUIT PATTERN 13 INPUT CSSL DESIGN FUNCTION AND QUANTITY 1 COUNTER, UP/DOWN CTFT CASE OUTLINE SOURCE AND DESIGNATOR C-4 MIL-M-38510 CWSG TERMINAL SURFACE TREATMENT SOLDER CZEN VOLTAGE RATING AND TYPE PER CHARACTERISTIC 7.0 VOLTS MAXIMUM POWER SOURCE CZEQ TIME RATING PER CHACTERISTIC 95.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 95.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT TEST TEST DATA DOCUMENT 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). TTQY TERMINAL TYPE AND QUANTITY 28 LEADLESS CQWX OUTPUT LOGIC FORM TRANSISTOR-TRANSISTOR LOGIC AEHX MAXIMUM POWER DISSIPATION RATING 990.0 MILLIWATTS
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 0.442 INCHES MINIMUM AND 0.460 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.442 INCHES MINIMUM AND 0.460 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.060 INCHES MINIMUM AND 0.100 INCHES MAXIMUM |
| AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN AND ELECTROSTATIC SENSITIVE AND LOW POWER AND SCHOTTKY AND 3-STATE OUTPUT |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CQSZ | INCLOSURE CONFIGURATION | LEADLESS FLAT PACK |
| CQZP | INPUT CIRCUIT PATTERN | 13 INPUT |
| CSSL | DESIGN FUNCTION AND QUANTITY | 1 COUNTER, UP/DOWN |
| CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | C-4 MIL-M-38510 |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 7.0 VOLTS MAXIMUM POWER SOURCE |
| CZEQ | TIME RATING PER CHACTERISTIC | 95.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 95.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| TTQY | TERMINAL TYPE AND QUANTITY | 28 LEADLESS |
| CQWX | OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 990.0 MILLIWATTS |