NSN 5962-01-307-5784 of Microcircuit Memory - Parts Details
| Alternative NSN: 5962013075784 |
| Item Name: Microcircuit Memory |
| FSG: 59 Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC): 5962 Microcircuits Electronic |
| NIIN: 013075784 |
| NCB Code: USA (01) |
| Manufacturers: Texas Instrument Inc , Mmi Amd , Dla Land And Maritime |
ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is the latest parts procurement platform for the aerospace and aviation industry. Check out high demanding part numbers TIBPAL16R4-15MWB, PAL16R4DMW 883B, 5962-8515512SB, 5962-8515512SA, 5962-85155 under NSN 5962-01-307-5784 of Microcircuit Memory manufactured by Texas Instrument Inc, Mmi Amd, Dla Land And Maritime.
Federal Supply Class of NSN 5962-01-307-5784 is FSC 5962 contains part details of Microcircuits Electronic. Quote for your desired part numbers.
Part Number's List for NSN 5962-01-307-5784, 5962013075784
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Part No Manufacturer Item Name QTY RFQ TIBPAL16R4-15MWB Texas Instrument Inc microcircuit memory Avl RFQ PAL16R4DMW 883B Mmi Amd microcircuit memory Avl RFQ 5962-8515512SB Dla Land And Maritime microcircuit memory Avl RFQ 5962-8515512SA Dla Land And Maritime microcircuit memory Avl RFQ 5962-85155 Dla Land And Maritime microcircuit memory Avl RFQ
Characteristics Data of NSN 5962013075784MRC Criteria Characteristic ABHP OVERALL LENGTH 0.540 INCHES MAXIMUM ABKW OVERALL HEIGHT 0.100 INCHES MAXIMUM ADAQ BODY LENGTH 0.540 INCHES MAXIMUM ADAT BODY WIDTH 0.300 INCHES MAXIMUM ADAU BODY HEIGHT 0.100 INCHES MAXIMUM AEHX MAXIMUM POWER DISSIPATION RATING 1.2 WATTS AFGA OPERATING TEMP RANGE -55.0/+125.0 DEG CELSIUS AFJQ STORAGE TEMP RANGE -65.0/+150.0 DEG CELSIUS CBBL FEATURES PROVIDED BIPOLAR AND BURN IN AND MONOLITHIC AND PROGRAMMABLE AND W/RESISTOR CQSJ INCLOSURE MATERIAL CERAMIC CQSZ INCLOSURE CONFIGURATION LEADLESS FLAT PACK CQZP INPUT CIRCUIT PATTERN 16 INPUT CTFT CASE OUTLINE SOURCE AND DESIGNATOR F-9 MIL-M-38510 CWSG TERMINAL SURFACE TREATMENT SOLDER TEST TEST DATA DOCUMENT 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). TTQY TERMINAL TYPE AND QUANTITY 20 FLAT LEADS ABMK OVERALL WIDTH 1.040 INCHES MAXIMUM CQWX OUTPUT LOGIC FORM BIPOLAR METAL-OXIDE SEMICONDUCTOR CZEN VOLTAGE RATING AND TYPE PER CHARACTERISTIC 5.0 VOLTS NOMINAL POWER SOURCE CZER MEMORY DEVICE TYPE PAL
| MRC | Criteria | Characteristic |
|---|---|---|
| ABHP | OVERALL LENGTH | 0.540 INCHES MAXIMUM |
| ABKW | OVERALL HEIGHT | 0.100 INCHES MAXIMUM |
| ADAQ | BODY LENGTH | 0.540 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.300 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.100 INCHES MAXIMUM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 1.2 WATTS |
| AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | BIPOLAR AND BURN IN AND MONOLITHIC AND PROGRAMMABLE AND W/RESISTOR |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CQSZ | INCLOSURE CONFIGURATION | LEADLESS FLAT PACK |
| CQZP | INPUT CIRCUIT PATTERN | 16 INPUT |
| CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | F-9 MIL-M-38510 |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| TTQY | TERMINAL TYPE AND QUANTITY | 20 FLAT LEADS |
| ABMK | OVERALL WIDTH | 1.040 INCHES MAXIMUM |
| CQWX | OUTPUT LOGIC FORM | BIPOLAR METAL-OXIDE SEMICONDUCTOR |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 5.0 VOLTS NOMINAL POWER SOURCE |
| CZER | MEMORY DEVICE TYPE | PAL |