NSN 5962-01-309-8749 of Microcircuit Digital - Parts Details
Alternative NSN: 5962013098749 |
Item Name: Microcircuit Digital |
FSG: 59 Electrical and Electronic Equipment Components |
Federal Supply Class (FSC): 5962 Microcircuits Electronic |
NIIN: 013098749 |
NCB Code: USA (01) |
Manufacturers: Texas Instrument Inc |
ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is the latest parts procurement platform for the aerospace and aviation industry. Check out high demanding part numbers SNJ54H73W under NSN 5962-01-309-8749 of Microcircuit Digital manufactured by Texas Instrument Inc.
Federal Supply Class of NSN 5962-01-309-8749 is FSC 5962 contains part details of Microcircuits Electronic. Quote for your desired part numbers.
Part Number's List for NSN 5962-01-309-8749, 5962013098749
Characteristics Data of NSN 5962013098749MRC Criteria Characteristic ABMK OVERALL WIDTH 0.777 INCHES MINIMUM AND 0.895 INCHES MAXIMUM ADAQ BODY LENGTH 0.337 INCHES MINIMUM AND 0.360 INCHES MAXIMUM ADAT BODY WIDTH 0.235 INCHES MINIMUM AND 0.265 INCHES MAXIMUM ADAU BODY HEIGHT 0.050 INCHES MINIMUM AND 0.080 INCHES MAXIMUM CBBL FEATURES PROVIDED MONOLITHIC AND W/CLOCK AND W/CLEAR AND HERMETICALLY SEALED CQSJ INCLOSURE MATERIAL CERAMIC CQSZ INCLOSURE CONFIGURATION FLAT PACK CQZP INPUT CIRCUIT PATTERN 8 INPUT CSSL DESIGN FUNCTION AND QUANTITY 2 FLIP-FLOP, J-K CWSG TERMINAL SURFACE TREATMENT SOLDER CZEN VOLTAGE RATING AND TYPE PER CHARACTERISTIC 7.0 VOLTS MAXIMUM POWER SOURCE CZEQ TIME RATING PER CHACTERISTIC 21.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 27.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT TEST TEST DATA DOCUMENT 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). TTQY TERMINAL TYPE AND QUANTITY 14 FLAT LEADS AFGA OPERATING TEMP RANGE -55.0/+125.0 DEG CELSIUS AFJQ STORAGE TEMP RANGE -65.0/+150.0 DEG CELSIUS CQWX OUTPUT LOGIC FORM TRANSISTOR-TRANSISTOR LOGIC
MRC | Criteria | Characteristic |
---|---|---|
ABMK | OVERALL WIDTH | 0.777 INCHES MINIMUM AND 0.895 INCHES MAXIMUM |
ADAQ | BODY LENGTH | 0.337 INCHES MINIMUM AND 0.360 INCHES MAXIMUM |
ADAT | BODY WIDTH | 0.235 INCHES MINIMUM AND 0.265 INCHES MAXIMUM |
ADAU | BODY HEIGHT | 0.050 INCHES MINIMUM AND 0.080 INCHES MAXIMUM |
CBBL | FEATURES PROVIDED | MONOLITHIC AND W/CLOCK AND W/CLEAR AND HERMETICALLY SEALED |
CQSJ | INCLOSURE MATERIAL | CERAMIC |
CQSZ | INCLOSURE CONFIGURATION | FLAT PACK |
CQZP | INPUT CIRCUIT PATTERN | 8 INPUT |
CSSL | DESIGN FUNCTION AND QUANTITY | 2 FLIP-FLOP, J-K |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 7.0 VOLTS MAXIMUM POWER SOURCE |
CZEQ | TIME RATING PER CHACTERISTIC | 21.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 27.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
TTQY | TERMINAL TYPE AND QUANTITY | 14 FLAT LEADS |
AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
CQWX | OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |