NSN 5962-01-313-0665 of Microcircuit Digital - Parts Details
| Alternative NSN: 5962013130665 |
| Item Name: Microcircuit Digital |
| FSG: 59 Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC): 5962 Microcircuits Electronic |
| NIIN: 013130665 |
| NCB Code: USA (01) |
| Manufacturers: Toshiba International Corporation , Freescale Semiconductor Inc , Tektronix Inc |
ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is the latest parts procurement platform for the aerospace and aviation industry. Check out high demanding part numbers TC74HC283P, MC74HC283, 156-2823-00 under NSN 5962-01-313-0665 of Microcircuit Digital manufactured by Toshiba International Corporation, Freescale Semiconductor Inc, Tektronix Inc.
Federal Supply Class of NSN 5962-01-313-0665 is FSC 5962 contains part details of Microcircuits Electronic. Quote for your desired part numbers.
Part Number's List for NSN 5962-01-313-0665, 5962013130665
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Part No Manufacturer Item Name QTY RFQ TC74HC283P Toshiba International Corporation microcircuit digital Avl RFQ MC74HC283 Freescale Semiconductor Inc microcircuit digital Avl RFQ 156-2823-00 Tektronix Inc microcircuit digital Avl RFQ
Characteristics Data of NSN 5962013130665MRC Criteria Characteristic ADAQ BODY LENGTH 0.870 INCHES MAXIMUM ADAU BODY HEIGHT 0.180 INCHES MAXIMUM AFGA OPERATING TEMP RANGE -40.0/+85.0 DEG CELSIUS AFJQ STORAGE TEMP RANGE -65.0/+150.0 DEG CELSIUS CBBL FEATURES PROVIDED HIGH SPEED AND POSITIVE OUTPUTS AND MONOLITHIC CQSJ INCLOSURE MATERIAL PLASTIC CQSZ INCLOSURE CONFIGURATION DUAL-IN-LINE CQWX OUTPUT LOGIC FORM COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC CQZP INPUT CIRCUIT PATTERN 9 INPUT CWSG TERMINAL SURFACE TREATMENT SOLDER CZEN VOLTAGE RATING AND TYPE PER CHARACTERISTIC 7.0 VOLTS MAXIMUM POWER SOURCE TTQY TERMINAL TYPE AND QUANTITY 16 PRINTED CIRCUIT AEHX MAXIMUM POWER DISSIPATION RATING 500.0 MILLIWATTS ADAT BODY WIDTH 0.240 INCHES MINIMUM AND 0.260 INCHES MAXIMUM CZEQ TIME RATING PER CHACTERISTIC 340.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 340.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT CSSL DESIGN FUNCTION AND QUANTITY 1 ADDER, FULL, BINARY
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 0.870 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.180 INCHES MAXIMUM |
| AFGA | OPERATING TEMP RANGE | -40.0/+85.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | HIGH SPEED AND POSITIVE OUTPUTS AND MONOLITHIC |
| CQSJ | INCLOSURE MATERIAL | PLASTIC |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | 9 INPUT |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 7.0 VOLTS MAXIMUM POWER SOURCE |
| TTQY | TERMINAL TYPE AND QUANTITY | 16 PRINTED CIRCUIT |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 500.0 MILLIWATTS |
| ADAT | BODY WIDTH | 0.240 INCHES MINIMUM AND 0.260 INCHES MAXIMUM |
| CZEQ | TIME RATING PER CHACTERISTIC | 340.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 340.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
| CSSL | DESIGN FUNCTION AND QUANTITY | 1 ADDER, FULL, BINARY |