NSN 5962-01-317-0890 of Microcircuit Memory - Parts Details
| Alternative NSN: 5962013170890 |
| Item Name: Microcircuit Memory |
| FSG: 59 Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC): 5962 Microcircuits Electronic |
| NIIN: 013170890 |
| NCB Code: USA (01) |
| Manufacturers: Xicor Inc , Dla Land And Maritime , Paeaeesikunta Logistiikkaosasto |
ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is the latest parts procurement platform for the aerospace and aviation industry. Check out high demanding part numbers X2004DMB-25, X20004DMB 10-30, 5962-8771201XX, 5962-8771201XB, 5962-8771201XA under NSN 5962-01-317-0890 of Microcircuit Memory manufactured by Xicor Inc, Dla Land And Maritime, Paeaeesikunta Logistiikkaosasto.
Federal Supply Class of NSN 5962-01-317-0890 is FSC 5962 contains part details of Microcircuits Electronic. Quote for your desired part numbers.
Part Number's List for NSN 5962-01-317-0890, 5962013170890
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Part No Manufacturer Item Name QTY RFQ X2004DMB-25 Xicor Inc microcircuit memory Avl RFQ X20004DMB 10-30 Xicor Inc microcircuit memory Avl RFQ 5962-8771201XX Dla Land And Maritime microcircuit memory Avl RFQ 5962-8771201XB Dla Land And Maritime microcircuit memory Avl RFQ 5962-8771201XA Dla Land And Maritime microcircuit memory Avl RFQ 5962-87712 Dla Land And Maritime microcircuit memory Avl RFQ 10133835 Paeaeesikunta Logistiikkaosasto microcircuit memory Avl RFQ
Characteristics Data of NSN 5962013170890MRC Criteria Characteristic ABKW OVERALL HEIGHT 0.432 INCHES MAXIMUM ADAQ BODY LENGTH 1.490 INCHES MAXIMUM ADAT BODY WIDTH 0.500 INCHES MINIMUM AND 0.610 INCHES MAXIMUM ADAU BODY HEIGHT 0.172 INCHES MINIMUM AND 0.217 INCHES MAXIMUM AEHX MAXIMUM POWER DISSIPATION RATING 750.0 MILLIWATTS AFJQ STORAGE TEMP RANGE -65.0/+150.0 DEG CELSIUS CQSJ INCLOSURE MATERIAL CERAMIC CQSZ INCLOSURE CONFIGURATION DUAL-IN-LINE CQWX OUTPUT LOGIC FORM TRANSISTOR-TRANSISTOR LOGIC CQZP INPUT CIRCUIT PATTERN 20 INPUT CTFT CASE OUTLINE SOURCE AND DESIGNATOR D-10 MIL-M-38510 CWSG TERMINAL SURFACE TREATMENT SOLDER CZER MEMORY DEVICE TYPE RAM CZZZ MEMORY CAPACITY 512X8 TEST TEST DATA DOCUMENT 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). CBBL FEATURES PROVIDED STATIC OPERATION AND MONOLITHIC TTQY TERMINAL TYPE AND QUANTITY 28 PRINTED CIRCUIT AFGA OPERATING TEMP RANGE -55.0/+125.0 DEG CELSIUS CZEN VOLTAGE RATING AND TYPE PER CHARACTERISTIC -1.0 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE
| MRC | Criteria | Characteristic |
|---|---|---|
| ABKW | OVERALL HEIGHT | 0.432 INCHES MAXIMUM |
| ADAQ | BODY LENGTH | 1.490 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.500 INCHES MINIMUM AND 0.610 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.172 INCHES MINIMUM AND 0.217 INCHES MAXIMUM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 750.0 MILLIWATTS |
| AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CQWX | OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | 20 INPUT |
| CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | D-10 MIL-M-38510 |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZER | MEMORY DEVICE TYPE | RAM |
| CZZZ | MEMORY CAPACITY | 512X8 |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| CBBL | FEATURES PROVIDED | STATIC OPERATION AND MONOLITHIC |
| TTQY | TERMINAL TYPE AND QUANTITY | 28 PRINTED CIRCUIT |
| AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -1.0 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE |