NSN 5962-01-318-8121 of Microcircuit Digital - Parts Details
| Alternative NSN: 5962013188121 |
| Item Name: Microcircuit Digital |
| FSG: 59 Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC): 5962 Microcircuits Electronic |
| NIIN: 013188121 |
| NCB Code: USA (01) |
| Manufacturers: Freescale Semiconductor Inc , Texas Instrument Inc , Boeing Company |
ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is the latest parts procurement platform for the aerospace and aviation industry. Check out high demanding part numbers M38510 32301BCA, 21-62205-1 under NSN 5962-01-318-8121 of Microcircuit Digital manufactured by Freescale Semiconductor Inc, Texas Instrument Inc, Boeing Company.
Federal Supply Class of NSN 5962-01-318-8121 is FSC 5962 contains part details of Microcircuits Electronic. Quote for your desired part numbers.
Part Number's List for NSN 5962-01-318-8121, 5962013188121
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Part No Manufacturer Item Name QTY RFQ M38510 32301BCA Freescale Semiconductor Inc microcircuit digital Avl RFQ M38510 32301BCA Texas Instrument Inc microcircuit digital Avl RFQ 21-62205-1 Boeing Company microcircuit digital Avl RFQ
Characteristics Data of NSN 5962013188121MRC Criteria Characteristic ADAQ BODY LENGTH 0.785 INCHES MAXIMUM ADAT BODY WIDTH 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM ADAU BODY HEIGHT 0.140 INCHES MINIMUM AND 0.185 INCHES MAXIMUM AEHX MAXIMUM POWER DISSIPATION RATING 110.0 MILLIWATTS AFGA OPERATING TEMP RANGE -55.0/+125.0 DEG CELSIUS AFJQ STORAGE TEMP RANGE -65.0/+150.0 DEG CELSIUS CBBL FEATURES PROVIDED ELECTROSTATIC SENSITIVE AND HERMETICALLY SEALED AND BURN IN AND POSITIVE OUTPUTS CQZP INPUT CIRCUIT PATTERN QUAD 2 INPUT CWSG TERMINAL SURFACE TREATMENT SOLDER CZEQ TIME RATING PER CHACTERISTIC 20.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 24.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT TEST TEST DATA DOCUMENT 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). CQSZ INCLOSURE CONFIGURATION DUAL-IN-LINE CSSL DESIGN FUNCTION AND QUANTITY 4 GATE, BUS BUFFER CQSJ INCLOSURE MATERIAL CERAMIC CQWX OUTPUT LOGIC FORM TRANSISTOR-TRANSISTOR LOGIC CTFT CASE OUTLINE SOURCE AND DESIGNATOR D-1 MIL-M-38510 CZEN VOLTAGE RATING AND TYPE PER CHARACTERISTIC 7.0 VOLTS MAXIMUM POWER SOURCE TTQY TERMINAL TYPE AND QUANTITY 14 PRINTED CIRCUIT
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 0.785 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.140 INCHES MINIMUM AND 0.185 INCHES MAXIMUM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 110.0 MILLIWATTS |
| AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | ELECTROSTATIC SENSITIVE AND HERMETICALLY SEALED AND BURN IN AND POSITIVE OUTPUTS |
| CQZP | INPUT CIRCUIT PATTERN | QUAD 2 INPUT |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEQ | TIME RATING PER CHACTERISTIC | 20.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 24.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CSSL | DESIGN FUNCTION AND QUANTITY | 4 GATE, BUS BUFFER |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CQWX | OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
| CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | D-1 MIL-M-38510 |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 7.0 VOLTS MAXIMUM POWER SOURCE |
| TTQY | TERMINAL TYPE AND QUANTITY | 14 PRINTED CIRCUIT |