NSN 5962-01-323-2534 of Microcircuit Memory - Parts Details
| Alternative NSN: 5962013232534 |
| Item Name: Microcircuit Memory |
| FSG: 59 Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC): 5962 Microcircuits Electronic |
| NIIN: 013232534 |
| NCB Code: USA (01) |
| Manufacturers: Waferscale Integration Inc , Texas Instrument Inc , Technique Energie Atomique , Intel Corp Sales Office , Selex Galileo Ltd , Atmel Corporation , Advanced Micro Devices Inc , Dla Land And Maritime , Philips Semiconductors Inc , Microchip Components |
ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is the latest parts procurement platform for the aerospace and aviation industry. Check out high demanding part numbers WS27C512L-20DMB, SMJ27C512-20JM, NTA-251430, MD27C512-20DB, DR521-1512-002H under NSN 5962-01-323-2534 of Microcircuit Memory manufactured by Waferscale Integration Inc, Texas Instrument Inc, Technique Energie Atomique, Intel Corp Sales Office, Selex Galileo Ltd.
Federal Supply Class of NSN 5962-01-323-2534 is FSC 5962 contains part details of Microcircuits Electronic. Quote for your desired part numbers.
Part Number's List for NSN 5962-01-323-2534, 5962013232534
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Part No Manufacturer Item Name QTY RFQ WS27C512L-20DMB Waferscale Integration Inc microcircuit memory Avl RFQ SMJ27C512-20JM Texas Instrument Inc microcircuit memory Avl RFQ NTA-251430 Technique Energie Atomique microcircuit memory Avl RFQ MD27C512-20DB Intel Corp Sales Office microcircuit memory Avl RFQ DR521-1512-002H Selex Galileo Ltd microcircuit memory Avl RFQ AT27C512-20DM 883 Atmel Corporation microcircuit memory Avl RFQ AM27C512 200 BXA Advanced Micro Devices Inc microcircuit memory Avl RFQ 5962-8764802XX Dla Land And Maritime microcircuit memory Avl RFQ 5962-8764802XB Dla Land And Maritime microcircuit memory Avl RFQ 5962-8764802XA Dla Land And Maritime microcircuit memory Avl RFQ 5962-87648 Dla Land And Maritime microcircuit memory Avl RFQ 27C512 BXA 20 Philips Semiconductors Inc microcircuit memory Avl RFQ 27C512 20MR J Microchip Components microcircuit memory Avl RFQ
Characteristics Data of NSN 5962013232534MRC Criteria Characteristic ADAQ BODY LENGTH 1.490 INCHES MAXIMUM ADAT BODY WIDTH 0.500 INCHES MINIMUM AND 0.610 INCHES MAXIMUM AEHX MAXIMUM POWER DISSIPATION RATING 350.0 MILLIWATTS AFGA OPERATING TEMP RANGE -55.0 TO 125.0 DEG CELSIUS CBBL FEATURES PROVIDED MONOLITHIC AND ULTRAVIOLET ERASABLE CQSJ INCLOSURE MATERIAL CERAMIC CQSZ INCLOSURE CONFIGURATION DUAL-IN-LINE CQWX OUTPUT LOGIC FORM COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC CQZP INPUT CIRCUIT PATTERN 26 INPUT CTFT CASE OUTLINE SOURCE AND DESIGNATOR D-10 MIL-M-38510 CTQX CURRENT RATING PER CHARACTERISTIC 60.00 MILLIAMPERES MAXIMUM SUPPLY CZEN VOLTAGE RATING AND TYPE PER CHARACTERISTIC 5.0 VOLTS NOMINAL POWER SOURCE FEAT SPECIAL FEATURES TRANSPARENT LID TO PERMIT ULTRAVIOLET LIGHT ERASURE TEST TEST DATA DOCUMENT 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). TTQY TERMINAL TYPE AND QUANTITY 28 PRINTED CIRCUIT CWSG TERMINAL SURFACE TREATMENT SOLDER ADAU BODY HEIGHT 0.165 INCHES MINIMUM AND 0.210 INCHES MAXIMUM AFJQ STORAGE TEMP RANGE -65.0 TO 150.0 DEG CELSIUS CZER MEMORY DEVICE TYPE EPROM
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 1.490 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.500 INCHES MINIMUM AND 0.610 INCHES MAXIMUM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 350.0 MILLIWATTS |
| AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | MONOLITHIC AND ULTRAVIOLET ERASABLE |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | 26 INPUT |
| CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | D-10 MIL-M-38510 |
| CTQX | CURRENT RATING PER CHARACTERISTIC | 60.00 MILLIAMPERES MAXIMUM SUPPLY |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 5.0 VOLTS NOMINAL POWER SOURCE |
| FEAT | SPECIAL FEATURES | TRANSPARENT LID TO PERMIT ULTRAVIOLET LIGHT ERASURE |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| TTQY | TERMINAL TYPE AND QUANTITY | 28 PRINTED CIRCUIT |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| ADAU | BODY HEIGHT | 0.165 INCHES MINIMUM AND 0.210 INCHES MAXIMUM |
| AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS |
| CZER | MEMORY DEVICE TYPE | EPROM |