NSN 5962-01-332-1186 of Microcircuit Memory - Parts Details
| Alternative NSN: 5962013321186 |
| Item Name: Microcircuit Memory |
| FSG: 59 Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC): 5962 Microcircuits Electronic |
| NIIN: 013321186 |
| NCB Code: USA (01) |
| Manufacturers: Texas Instrument Inc , Freescale Semiconductor Inc , Rohde And Schwarz Inc |
ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is the latest parts procurement platform for the aerospace and aviation industry. Check out high demanding part numbers SN54LS168J, BL5809333 under NSN 5962-01-332-1186 of Microcircuit Memory manufactured by Texas Instrument Inc, Freescale Semiconductor Inc, Rohde And Schwarz Inc.
Federal Supply Class of NSN 5962-01-332-1186 is FSC 5962 contains part details of Microcircuits Electronic. Quote for your desired part numbers.
Part Number's List for NSN 5962-01-332-1186, 5962013321186
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Part No Manufacturer Item Name QTY RFQ SN54LS168J Texas Instrument Inc microcircuit memory Avl RFQ SN54LS168J Freescale Semiconductor Inc microcircuit memory Avl RFQ BL5809333 Rohde And Schwarz Inc microcircuit memory Avl RFQ
Characteristics Data of NSN 5962013321186MRC Criteria Characteristic ADAQ BODY LENGTH 0.750 INCHES MINIMUM AND 0.785 INCHES MAXIMUM AEHX MAXIMUM POWER DISSIPATION RATING 100.0 MILLIWATTS AFJQ STORAGE TEMP RANGE -65.0/+155.0 DEG CELSIUS CBBL FEATURES PROVIDED MONOLITHIC AND POSITIVE OUTPUTS CQSJ INCLOSURE MATERIAL CERAMIC CQSZ INCLOSURE CONFIGURATION DUAL-IN-LINE CQWX OUTPUT LOGIC FORM TRANSISTOR-TRANSISTOR LOGIC CQZP INPUT CIRCUIT PATTERN 9 INPUT CWSG TERMINAL SURFACE TREATMENT SOLDER CZEN VOLTAGE RATING AND TYPE PER CHARACTERISTIC 7.0 VOLTS MAXIMUM POWER SOURCE CZEQ TIME RATING PER CHACTERISTIC 35.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 35.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT TTQY TERMINAL TYPE AND QUANTITY 16 PRINTED CIRCUIT CZER MEMORY DEVICE TYPE ROM ADAT BODY WIDTH 0.240 INCHES MINIMUM AND 0.295 INCHES MAXIMUM ADAU BODY HEIGHT 0.160 INCHES MINIMUM AND 0.180 INCHES MAXIMUM AFGA OPERATING TEMP RANGE -55.0/+125.0 DEG CELSIUS ABKW OVERALL HEIGHT 0.400 INCHES MAXIMUM
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 0.750 INCHES MINIMUM AND 0.785 INCHES MAXIMUM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 100.0 MILLIWATTS |
| AFJQ | STORAGE TEMP RANGE | -65.0/+155.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | MONOLITHIC AND POSITIVE OUTPUTS |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CQWX | OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | 9 INPUT |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 7.0 VOLTS MAXIMUM POWER SOURCE |
| CZEQ | TIME RATING PER CHACTERISTIC | 35.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 35.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
| TTQY | TERMINAL TYPE AND QUANTITY | 16 PRINTED CIRCUIT |
| CZER | MEMORY DEVICE TYPE | ROM |
| ADAT | BODY WIDTH | 0.240 INCHES MINIMUM AND 0.295 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.160 INCHES MINIMUM AND 0.180 INCHES MAXIMUM |
| AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
| ABKW | OVERALL HEIGHT | 0.400 INCHES MAXIMUM |