NSN 5962-01-333-3430 of Microcircuit Memory - Parts Details
Alternative NSN: 5962013333430 |
Item Name: Microcircuit Memory |
FSG: 59 Electrical and Electronic Equipment Components |
Federal Supply Class (FSC): 5962 Microcircuits Electronic |
NIIN: 013333430 |
NCB Code: USA (01) |
Manufacturers: Waferscale Integration Inc , Austin Semiconductor Inc , Intel Corp Sales Office , Raytheon Aircraft , Atmel Corporation , Advanced Micro Devices Inc , Dla Land And Maritime , Microchip Components , Thales Communications Inc |
ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is the latest parts procurement platform for the aerospace and aviation industry. Check out high demanding part numbers WS27C512L-15DMB, SMJ27C512-25JM, MD27C512-15 B, G528349-103, G330510-303 under NSN 5962-01-333-3430 of Microcircuit Memory manufactured by Waferscale Integration Inc, Austin Semiconductor Inc, Intel Corp Sales Office, Raytheon Aircraft, Atmel Corporation.
Federal Supply Class of NSN 5962-01-333-3430 is FSC 5962 contains part details of Microcircuits Electronic. Quote for your desired part numbers.
Part Number's List for NSN 5962-01-333-3430, 5962013333430
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Part No Manufacturer Item Name QTY RFQ WS27C512L-15DMB Waferscale Integration Inc microcircuit memory Avl RFQ SMJ27C512-25JM Austin Semiconductor Inc microcircuit memory Avl RFQ MD27C512-15 B Intel Corp Sales Office microcircuit memory Avl RFQ G528349-103 Raytheon Aircraft microcircuit memory Avl RFQ G330510-303 Raytheon Aircraft microcircuit memory Avl RFQ AT27C512R-15DM 883 Atmel Corporation microcircuit memory Avl RFQ AT27C512R-15DC Atmel Corporation microcircuit memory Avl RFQ AM27C512-150 BXA Advanced Micro Devices Inc microcircuit memory Avl RFQ 5962-8764801XX Dla Land And Maritime microcircuit memory Avl RFQ 5962-8764801XB Dla Land And Maritime microcircuit memory Avl RFQ 5962-8764801XA Dla Land And Maritime microcircuit memory Avl RFQ 5962-8764801BXX Dla Land And Maritime microcircuit memory Avl RFQ 5962-8764801BXB Dla Land And Maritime microcircuit memory Avl RFQ 5962-8764801BXA Dla Land And Maritime microcircuit memory Avl RFQ 5962-87648 Dla Land And Maritime microcircuit memory Avl RFQ 27C512-15MR J Microchip Components microcircuit memory Avl RFQ 115721-0001 Thales Communications Inc microcircuit memory Avl RFQ
Characteristics Data of NSN 5962013333430MRC Criteria Characteristic ABKW OVERALL HEIGHT 0.357 INCHES MINIMUM AND 0.432 INCHES MAXIMUM ADAQ BODY LENGTH 1.490 INCHES MAXIMUM ADAU BODY HEIGHT 0.172 INCHES MINIMUM AND 0.217 INCHES MAXIMUM AEHX MAXIMUM POWER DISSIPATION RATING 350.0 MILLIWATTS AFGA OPERATING TEMP RANGE -55.0/+125.0 DEG CELSIUS AFJQ STORAGE TEMP RANGE -65.0/+150.0 DEG CELSIUS CBBL FEATURES PROVIDED HERMETICALLY SEALED AND BURN IN AND PROGRAMMABLE AND ULTRAVIOLET ERASABLE CQSJ INCLOSURE MATERIAL CERAMIC CQSZ INCLOSURE CONFIGURATION DUAL-IN-LINE CQWX OUTPUT LOGIC FORM COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC CQZP INPUT CIRCUIT PATTERN 26 INPUT CTFT CASE OUTLINE SOURCE AND DESIGNATOR D-10 MIL-M-38510 CTQX CURRENT RATING PER CHARACTERISTIC 60.00 MILLIAMPERES MAXIMUM SUPPLY CZEN VOLTAGE RATING AND TYPE PER CHARACTERISTIC 5.0 VOLTS NOMINAL POWER SOURCE CZEQ TIME RATING PER CHACTERISTIC 150.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 150.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT CZER MEMORY DEVICE TYPE EPROM CZZZ MEMORY CAPACITY UNKNOWN TTQY TERMINAL TYPE AND QUANTITY 28 PRINTED CIRCUIT TEST TEST DATA DOCUMENT 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). ADAT BODY WIDTH 0.500 INCHES MINIMUM AND 0.610 INCHES MAXIMUM CWSG TERMINAL SURFACE TREATMENT SOLDER
MRC | Criteria | Characteristic |
---|---|---|
ABKW | OVERALL HEIGHT | 0.357 INCHES MINIMUM AND 0.432 INCHES MAXIMUM |
ADAQ | BODY LENGTH | 1.490 INCHES MAXIMUM |
ADAU | BODY HEIGHT | 0.172 INCHES MINIMUM AND 0.217 INCHES MAXIMUM |
AEHX | MAXIMUM POWER DISSIPATION RATING | 350.0 MILLIWATTS |
AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN AND PROGRAMMABLE AND ULTRAVIOLET ERASABLE |
CQSJ | INCLOSURE MATERIAL | CERAMIC |
CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
CQZP | INPUT CIRCUIT PATTERN | 26 INPUT |
CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | D-10 MIL-M-38510 |
CTQX | CURRENT RATING PER CHARACTERISTIC | 60.00 MILLIAMPERES MAXIMUM SUPPLY |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 5.0 VOLTS NOMINAL POWER SOURCE |
CZEQ | TIME RATING PER CHACTERISTIC | 150.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 150.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
CZER | MEMORY DEVICE TYPE | EPROM |
CZZZ | MEMORY CAPACITY | UNKNOWN |
TTQY | TERMINAL TYPE AND QUANTITY | 28 PRINTED CIRCUIT |
TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
ADAT | BODY WIDTH | 0.500 INCHES MINIMUM AND 0.610 INCHES MAXIMUM |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER |